JPH02146155U - - Google Patents
Info
- Publication number
- JPH02146155U JPH02146155U JP5338389U JP5338389U JPH02146155U JP H02146155 U JPH02146155 U JP H02146155U JP 5338389 U JP5338389 U JP 5338389U JP 5338389 U JP5338389 U JP 5338389U JP H02146155 U JPH02146155 U JP H02146155U
- Authority
- JP
- Japan
- Prior art keywords
- wall
- vacuum evaporation
- electrons
- reflected
- electron gun
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007738 vacuum evaporation Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案真空蒸着装置の壁面の構造例を
示し、第２図は従来の真空蒸着装置の概略図、第
３図はその壁面の電子の軌跡を示す説明図、第４
図は本考案の作用を説明するための説明図である
。
１……電子銃、２……電子ビーム、３……電磁
コイル、４……るつぼ、５……金属蒸気、６……
壁、７……蒸着板、８……加熱器、９……真空チ
ヤンバ、１０……蒸着金属、１１……反射電子（
散乱熱流束）、１２……２次反射電子、１３……
内壁、１４……開口部、１５……外壁、１６……
内壁と外壁との間の空間、１７……内壁の冷却管
、１８……外壁の冷却管、１９……反射電子。
Fig. 1 shows an example of the structure of the wall surface of the vacuum evaporation apparatus of the present invention, Fig. 2 is a schematic diagram of a conventional vacuum evaporation apparatus, Fig. 3 is an explanatory diagram showing the trajectory of electrons on the wall surface, and Fig. 4
The figure is an explanatory diagram for explaining the operation of the present invention. 1... Electron gun, 2... Electron beam, 3... Electromagnetic coil, 4... Crucible, 5... Metal vapor, 6...
Wall, 7... Vapor deposition plate, 8... Heater, 9... Vacuum chamber, 10... Vapor deposition metal, 11... Backscattered electron (
scattered heat flux), 12... secondary backscattered electrons, 13...
Inner wall, 14...Opening, 15...Outer wall, 16...
Space between inner wall and outer wall, 17... Cooling pipe on inner wall, 18... Cooling pipe on outer wall, 19... Backscattered electrons.
Claims (1)
ぼ内蒸着金属表面から反射する電子が到達する壁
を二重にし、内壁の開口比を４０％〜６０％とし
て、反射電子の壁面からの２次反射を低減させる
ようにしたことを特徴とする真空蒸着装置。 In a vacuum evaporation device using electron gun heating, the wall where the electrons reflected from the surface of the evaporated metal in the crucible reach is doubled, and the aperture ratio of the inner wall is set to 40% to 60% to reduce secondary reflection of reflected electrons from the wall surface. 1. A vacuum evaporation apparatus characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5338389U JPH02146155U (en) | 1989-05-11 | 1989-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5338389U JPH02146155U (en) | 1989-05-11 | 1989-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146155U true JPH02146155U (en) | 1990-12-12 |
Family
ID=31574516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5338389U Pending JPH02146155U (en) | 1989-05-11 | 1989-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146155U (en) |
-
1989
- 1989-05-11 JP JP5338389U patent/JPH02146155U/ja active Pending
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