JPH02146440U - - Google Patents

Info

Publication number
JPH02146440U
JPH02146440U JP1989055599U JP5559989U JPH02146440U JP H02146440 U JPH02146440 U JP H02146440U JP 1989055599 U JP1989055599 U JP 1989055599U JP 5559989 U JP5559989 U JP 5559989U JP H02146440 U JPH02146440 U JP H02146440U
Authority
JP
Japan
Prior art keywords
electronic component
flange part
head
tip
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989055599U
Other languages
English (en)
Other versions
JPH075636Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989055599U priority Critical patent/JPH075636Y2/ja
Publication of JPH02146440U publication Critical patent/JPH02146440U/ja
Application granted granted Critical
Publication of JPH075636Y2 publication Critical patent/JPH075636Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の原理説明図、第２図は本考案
のよる一実施例の説明図で、ａは斜視図、ｂ，ｃ
は側面図、第３図は従来の説明図で、ａは側面図
、ｂは吸引状態の説明図を示す。 図において、１はプリント基板、２は電子部品
、３はリムーブヘツド、４は筒部、５は開口部、
６はフランジ部、７は爪部、８は内壁面、２Ａは
側壁面、２Ｂは表面、３Ａは先端を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 プリント基板１にボンデイングされた電子部品
    ２をリムーブヘツド３により該プリント基板１か
    ら取り外す際、予め、該電子部品２に装着させる
    ことで該電子部品２の取り外しを行う電子部品の
    リムーブ治具であつて、 矩形の筒部４の一端に前記リムーブヘツド３の
    挿脱を行う開口部５を設け、他端に前記電子部品
    ２の側壁面２Ａを挟持する爪部７を設けることで
    形成され、かつ、該リムーブヘツド３の先端３Ａ
    と該電子部品２の表面２Ｂとの間に所定の隙間Ｓ
    を保つよう該リムーブヘツド３の先端３Ａに当接
    されるフランジ部６を該筒部４の内壁面８に設け
    て成ることを特徴とする電子部品のリムーブ治具
    。
JP1989055599U 1989-05-15 1989-05-15 電子部品のリムーブ治具 Expired - Lifetime JPH075636Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989055599U JPH075636Y2 (ja) 1989-05-15 1989-05-15 電子部品のリムーブ治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989055599U JPH075636Y2 (ja) 1989-05-15 1989-05-15 電子部品のリムーブ治具

Publications (2)

Publication Number Publication Date
JPH02146440U true JPH02146440U (ja) 1990-12-12
JPH075636Y2 JPH075636Y2 (ja) 1995-02-08

Family

ID=31578692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989055599U Expired - Lifetime JPH075636Y2 (ja) 1989-05-15 1989-05-15 電子部品のリムーブ治具

Country Status (1)

Country Link
JP (1) JPH075636Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251892A (ja) * 1992-03-06 1993-09-28 Nec Corp テーピング品検査用オートハンドラの不良品取外し装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251892A (ja) * 1992-03-06 1993-09-28 Nec Corp テーピング品検査用オートハンドラの不良品取外し装置

Also Published As

Publication number Publication date
JPH075636Y2 (ja) 1995-02-08

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