JPH02146475U - - Google Patents
Info
- Publication number
- JPH02146475U JPH02146475U JP5529689U JP5529689U JPH02146475U JP H02146475 U JPH02146475 U JP H02146475U JP 5529689 U JP5529689 U JP 5529689U JP 5529689 U JP5529689 U JP 5529689U JP H02146475 U JPH02146475 U JP H02146475U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- pad portion
- lead wires
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａは本考案の一実施例に係るプリント配
線板のパツド部の拡大斜視図、第１図ｂはパツド
部にリード線を半田付けした状態を示す第１図ａ
のＡ−Ａ断面図、第２図ａは従来の表面実装用Ｉ
Ｃとプリント配線板のパツド部の拡大図、第２図
ｃはパツド部にリード線を半田付けした状態を示
す第１図ｂのＢ−Ｂ断面図である。
１：プリント配線板、２：パツド部、２ａ，２
ｂ：パツド、３ａ：リード線、４……半田、４ａ
：半田フイレツト部。
Fig. 1a is an enlarged perspective view of a pad portion of a printed wiring board according to an embodiment of the present invention, and Fig. 1b shows a state in which lead wires are soldered to the pad portion.
A-A sectional view of , Figure 2a is a conventional surface mount I
FIG. 2C is an enlarged view of the pad portion of the printed wiring board, and FIG. 2C is a sectional view taken along the line BB in FIG. 1: Printed wiring board, 2: Pad part, 2a, 2
b: Padded, 3a: Lead wire, 4...Solder, 4a
:Solder fillet part.
補正 平１．８．２
図面の簡単な説明を次のように補正する。
明細書第６頁第６行目「表面実装用ＩＣ」の後
の「と」を削除し、「を示す図、第２図ｂは従来
の」を挿入する。Amendment 1.8.2 The brief description of the drawing is amended as follows. In the 6th line of page 6 of the specification, the ``and'' after ``Surface Mount IC'' is deleted, and ``A figure showing the figure, Figure 2b is a conventional'' is inserted.
Claims (1)
するためにパツド部を配設したプリント配線板に
おいて、このプリント配線板のパツドの一端をリ
ード線の横幅よりも広く形成し、これを交互に組
合せて配設するパツド部を有することを特徴とす
るプリント配線板。 In a printed wiring board provided with a pad portion for mounting a surface mount IC having multiple lead wires, one end of the pad of the printed wiring board is formed wider than the width of the lead wires, and these are alternately combined. What is claimed is: 1. A printed wiring board characterized in that it has a pad portion disposed on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5529689U JPH02146475U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5529689U JPH02146475U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146475U true JPH02146475U (en) | 1990-12-12 |
Family
ID=31578120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5529689U Pending JPH02146475U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146475U (en) |
-
1989
- 1989-05-16 JP JP5529689U patent/JPH02146475U/ja active Pending