JPH02146823U - - Google Patents
Info
- Publication number
- JPH02146823U JPH02146823U JP5379189U JP5379189U JPH02146823U JP H02146823 U JPH02146823 U JP H02146823U JP 5379189 U JP5379189 U JP 5379189U JP 5379189 U JP5379189 U JP 5379189U JP H02146823 U JPH02146823 U JP H02146823U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrode layers
- electronic component
- type electronic
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
Description
第1図は本考案に係るラジアルリード型の電子
部品を示す側断面図、第2図は従来例に係るラジ
アルリード型電子部品の側断面図である。
10……素体、11,12……電極層、13,
14……リード線、13a,14a……先端部、
13b,14b……導出部、15……外装皮膜、
θ……折曲げ角度範囲。
FIG. 1 is a side sectional view showing a radial lead type electronic component according to the present invention, and FIG. 2 is a side sectional view of a radial lead type electronic component according to a conventional example. 10... Elementary body, 11, 12... Electrode layer, 13,
14... Lead wire, 13a, 14a... Tip part,
13b, 14b... Leading out part, 15... Exterior coating,
θ...Bending angle range.
Claims (1)
その各電極層11,12に先端部13a,14a
を当接固着すると共に、この各先端部13a,1
4aから導出部13b,14bを90°〜150
°の角度範囲θで電極層11,12の離間方向に
折曲げ加工した一対のリード線13,14を同一
方向に取出し装着し、そのリード線13,14と
素体10の外周面とを粉体塗料の流動浸漬による
外装皮膜15で被覆して構成されてなることを特
徴とするラジアルリード型電子部品。 Electrode layers 11 and 12 are provided on both end surfaces of the element body 10,
Tip portions 13a, 14a are provided on each electrode layer 11, 12.
are abutted and fixed, and each tip portion 13a, 1
4a to the lead-out portions 13b and 14b from 90° to 150°.
A pair of lead wires 13 and 14 that have been bent in the direction of separation of the electrode layers 11 and 12 in the angular range θ of A radial lead type electronic component characterized in that it is coated with an exterior film 15 formed by fluid dipping of body paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5379189U JPH02146823U (en) | 1989-05-10 | 1989-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5379189U JPH02146823U (en) | 1989-05-10 | 1989-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146823U true JPH02146823U (en) | 1990-12-13 |
Family
ID=31575284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5379189U Pending JPH02146823U (en) | 1989-05-10 | 1989-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146823U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010087250A1 (en) * | 2009-01-29 | 2010-08-05 | 株式会社村田製作所 | Ceramic electronic component |
| JP2017037942A (en) * | 2015-08-07 | 2017-02-16 | Koa株式会社 | Surface mount chip varistor |
| JP2017037943A (en) * | 2015-08-07 | 2017-02-16 | Koa株式会社 | Surface mount chip varistor |
-
1989
- 1989-05-10 JP JP5379189U patent/JPH02146823U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010087250A1 (en) * | 2009-01-29 | 2010-08-05 | 株式会社村田製作所 | Ceramic electronic component |
| JP2017037942A (en) * | 2015-08-07 | 2017-02-16 | Koa株式会社 | Surface mount chip varistor |
| JP2017037943A (en) * | 2015-08-07 | 2017-02-16 | Koa株式会社 | Surface mount chip varistor |
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