JPH02146832U - - Google Patents

Info

Publication number
JPH02146832U
JPH02146832U JP4877790U JP4877790U JPH02146832U JP H02146832 U JPH02146832 U JP H02146832U JP 4877790 U JP4877790 U JP 4877790U JP 4877790 U JP4877790 U JP 4877790U JP H02146832 U JPH02146832 U JP H02146832U
Authority
JP
Japan
Prior art keywords
mounting points
unit
fixed point
substrate
actual position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4877790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4877790U priority Critical patent/JPH02146832U/ja
Publication of JPH02146832U publication Critical patent/JPH02146832U/ja
Pending legal-status Critical Current

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  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案によるペレツトボンデイング装
置の一例を示す略平面図、第2図は第1図のマウ
ントユニツト部を示す側面図、第3図は第1図に
おける基板と基板支持台の一部を示す略平面図、
第4図は第1図における基板と基板支持台を示す
断面図、第5図は本考案の一実施例を示す制御系
統図、第6図は第5図のパターン認識回路におけ
る認識の状態を示す座標図である。 11……基板、13……ペレツト、22……マ
ウントユニツト、25……Xテーブル、27……
Yテーブル、31……コレツト、41……キヤリ
ア、42……ガイドレール、44……位置決めピ
ン、45……位置決め孔、46……設定器、49
……パターン認識回路、50……モニタ、51…
…演算回路、52……マーク発生回路、53……
制御回路、54……駆動器、M,m……検出定点
、A,a,B,b……マウント点。
FIG. 1 is a schematic plan view showing an example of the pellet bonding apparatus according to the present invention, FIG. 2 is a side view showing the mount unit shown in FIG. 1, and FIG. A schematic plan view showing the part;
FIG. 4 is a sectional view showing the substrate and substrate support in FIG. 1, FIG. 5 is a control system diagram showing an embodiment of the present invention, and FIG. 6 shows the recognition state in the pattern recognition circuit shown in FIG. FIG. 11...Substrate, 13...Pellet, 22...Mount unit, 25...X table, 27...
Y table, 31... Collet, 41... Carrier, 42... Guide rail, 44... Positioning pin, 45... Positioning hole, 46... Setting device, 49
...Pattern recognition circuit, 50...Monitor, 51...
... Arithmetic circuit, 52 ... Mark generation circuit, 53 ...
Control circuit, 54...Driver, M, m...Detection fixed point, A, a, B, b...Mount point.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板支持台に支持された複数の所定マウント点
を有する基板上に、駆動部によつて移動制御され
るコレツトを用いてペレツトを順次マウントする
ペレツトボンデイング装置において、前記基板上
に予め定めた検出定点並びに前記複数の所定マウ
ント点の正規位置が記憶されて設定部と、前記基
板を撮像する撮像部と、この撮像部が撮像した画
像に基づき前記検出定点の実際の位置を認識する
認識部と、前記検出定点に関し前記設定部に記憶
されている正規位置に対する前記認識部で認識さ
れた実際の位置のずれ量を求めるとともに、この
ずれ量に基づき前記複数の所定マウント点それぞ
れの実際の位置を算出する演算部と、この演算部
で算出した実際の複数のマウント点に順次ペレツ
トを吸着した前記コレツトを移動させるように前
記駆動部を制御する制御部とを有することを特徴
とするペレツトボンデイング装置。
In a pellet bonding apparatus that sequentially mounts pellets on a substrate having a plurality of predetermined mounting points supported by a substrate support using a collet whose movement is controlled by a drive unit, a predetermined detection point is placed on the substrate. a setting section in which regular positions of the fixed point and the plurality of predetermined mounting points are stored; an imaging section that takes an image of the board; and a recognition section that recognizes the actual position of the detection fixed point based on the image taken by the imaging section. , determining the amount of deviation of the actual position recognized by the recognition unit from the normal position stored in the setting unit regarding the detection fixed point, and determining the actual position of each of the plurality of predetermined mounting points based on this amount of deviation; Pellet bonding characterized by having a calculation unit that performs the calculation, and a control unit that controls the drive unit to move the collet that sequentially adsorbs pellets to a plurality of actual mounting points calculated by the calculation unit. Device.
JP4877790U 1990-05-10 1990-05-10 Pending JPH02146832U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4877790U JPH02146832U (en) 1990-05-10 1990-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4877790U JPH02146832U (en) 1990-05-10 1990-05-10

Publications (1)

Publication Number Publication Date
JPH02146832U true JPH02146832U (en) 1990-12-13

Family

ID=31565892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4877790U Pending JPH02146832U (en) 1990-05-10 1990-05-10

Country Status (1)

Country Link
JP (1) JPH02146832U (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563836A (en) * 1978-11-06 1980-05-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Defect detection device for insulating film
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate
JPS5726448A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Pellet attaching device with recognizing mechanism
JPS5753950A (en) * 1980-09-17 1982-03-31 Fujitsu Ltd Pellet bonding device
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563836A (en) * 1978-11-06 1980-05-14 Chiyou Lsi Gijutsu Kenkyu Kumiai Defect detection device for insulating film
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate
JPS5726448A (en) * 1980-07-23 1982-02-12 Hitachi Ltd Pellet attaching device with recognizing mechanism
JPS5753950A (en) * 1980-09-17 1982-03-31 Fujitsu Ltd Pellet bonding device
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

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