JPH0214751U - - Google Patents

Info

Publication number
JPH0214751U
JPH0214751U JP9308688U JP9308688U JPH0214751U JP H0214751 U JPH0214751 U JP H0214751U JP 9308688 U JP9308688 U JP 9308688U JP 9308688 U JP9308688 U JP 9308688U JP H0214751 U JPH0214751 U JP H0214751U
Authority
JP
Japan
Prior art keywords
metal wire
semiconductor device
lead
temperature
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9308688U
Other languages
Japanese (ja)
Other versions
JPH0433631Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988093086U priority Critical patent/JPH0433631Y2/ja
Publication of JPH0214751U publication Critical patent/JPH0214751U/ja
Application granted granted Critical
Publication of JPH0433631Y2 publication Critical patent/JPH0433631Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Emergency Protection Circuit Devices (AREA)
  • Fuses (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る一実施例の保護素子の構
成を示す図、第２図Ａ〜Ｆは本実施例の保護素子
の製造工程を説明する図、第３図Ａ，Ｂは本考案
に係る他の実施例の金属板打ち抜き形状を示す図
、第４図は第３図Ａに示すリード形状とした時の
保護素子のモールド状態を示す図、第５図は金属
線の溶断時の状態を示す図である。 図中、１…半導体装置用保護素子、１１…金属
線、１２，１３…リード線、１４…モールドパツ
ケージ、１５…孔部、２１…金属板、２２…打ち
抜き部である。 Fig. 1 is a diagram showing the configuration of a protection element according to an embodiment of the present invention, Figs. 2 A to F are diagrams explaining the manufacturing process of the protection element of this embodiment, and Figs. 3 A and B are diagrams according to the invention. FIG. 4 is a diagram showing the molded state of the protective element when the lead shape shown in FIG. 3A is formed, and FIG. It is a figure showing a state. In the figure, 1... protective element for semiconductor device, 11... metal wire, 12, 13... lead wire, 14... mold package, 15... hole, 21... metal plate, 22... punching part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に装着され半導体装置の過電流破壊を防止
する半導体装置用保護素子であつて、対を成すリ
ード先端部近傍の所定位置間に所定温度で溶融す
る金属線を張設し、前記両リード両端が導出する
よう前記金属線及び前記リードを前記金属線融点
温度より低い温度で軟化する熱可塑性樹脂でモー
ルドしたことを特徴とする面実装用半導体装置用
保護素子。 A protection element for a semiconductor device that is attached to a substrate and prevents overcurrent damage to the semiconductor device, in which a metal wire that melts at a predetermined temperature is stretched between predetermined positions near the tips of a pair of leads, and A protective element for a surface-mounted semiconductor device, characterized in that the metal wire and the lead are molded with a thermoplastic resin that softens at a temperature lower than the melting point temperature of the metal wire so as to lead out the metal wire.
JP1988093086U 1988-07-15 1988-07-15 Expired JPH0433631Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988093086U JPH0433631Y2 (en) 1988-07-15 1988-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988093086U JPH0433631Y2 (en) 1988-07-15 1988-07-15

Publications (2)

Publication Number Publication Date
JPH0214751U true JPH0214751U (en) 1990-01-30
JPH0433631Y2 JPH0433631Y2 (en) 1992-08-12

Family

ID=31317536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988093086U Expired JPH0433631Y2 (en) 1988-07-15 1988-07-15

Country Status (1)

Country Link
JP (1) JPH0433631Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257533A (en) * 1988-04-05 1989-10-13 Honda Motor Co Ltd Assembly equipment
JPH04192237A (en) * 1990-11-26 1992-07-10 Rohm Co Ltd Chip type fuse
JP2014212098A (en) * 2013-04-17 2014-11-13 三星エスディアイ株式会社Ｓａｍｓｕｎｇ ＳＤＩ Ｃｏ．，Ｌｔｄ． Secondary battery
JP2018503235A (en) * 2015-01-22 2018-02-01 リテルヒューズ・インク Wire in air split fuse with built-in arc quencher

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981828A (en) * 1982-11-01 1984-05-11 松下電器産業株式会社 Square chip type fuse part
JPS59119546U (en) * 1983-02-02 1984-08-11 日本電信電話株式会社 Chip-shaped fuse

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981828A (en) * 1982-11-01 1984-05-11 松下電器産業株式会社 Square chip type fuse part
JPS59119546U (en) * 1983-02-02 1984-08-11 日本電信電話株式会社 Chip-shaped fuse

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257533A (en) * 1988-04-05 1989-10-13 Honda Motor Co Ltd Assembly equipment
JPH04192237A (en) * 1990-11-26 1992-07-10 Rohm Co Ltd Chip type fuse
JP2014212098A (en) * 2013-04-17 2014-11-13 三星エスディアイ株式会社Ｓａｍｓｕｎｇ ＳＤＩ Ｃｏ．，Ｌｔｄ． Secondary battery
JP2018503235A (en) * 2015-01-22 2018-02-01 リテルヒューズ・インク Wire in air split fuse with built-in arc quencher

Also Published As

Publication number Publication date
JPH0433631Y2 (en) 1992-08-12

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