JPH0438061U - - Google Patents
Info
- Publication number
- JPH0438061U JPH0438061U JP1990080081U JP8008190U JPH0438061U JP H0438061 U JPH0438061 U JP H0438061U JP 1990080081 U JP1990080081 U JP 1990080081U JP 8008190 U JP8008190 U JP 8008190U JP H0438061 U JPH0438061 U JP H0438061U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- tab
- wire
- peripheral edge
- assembly structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例に係る半導体素子組付
け構造を示す図であり、図ａは平面図、同ｂは側
断面図で、第２図はリード配線体の一部を示す図
、第３図は樹脂封止した半導体素子を示す断面図
、第４図は他の構成のタブを用いた場合の構成を
示す断面図、第５図は従来における半導体素子の
組付け構造を示す図であり、図ａは平面図、同ｂ
は断面図、第６図は従来においてリード配線体に
テーピングが施された状態を示す図である。
１……半導体素子、２，９，１９……タブ、４
……リード配線体、５……リード線、７……レジ
ン、８……耐熱テープ、９ａ，１９ａ……凸部。
1 is a diagram showing a semiconductor element assembly structure according to an embodiment of the present invention, FIG. 1A is a plan view, FIG. 2B is a side sectional view, and FIG. FIG. 3 is a sectional view showing a resin-sealed semiconductor element, FIG. 4 is a sectional view showing a configuration using a tab with another configuration, and FIG. 5 is a diagram showing a conventional assembly structure of a semiconductor element. , where figure a is a plan view and figure b is a plan view.
6 is a cross-sectional view, and FIG. 6 is a diagram showing a state in which taping has been applied to a lead wiring body in the related art. 1... Semiconductor element, 2, 9, 19... Tab, 4
... Lead wiring body, 5 ... Lead wire, 7 ... Resin, 8 ... Heat-resistant tape, 9a, 19a ... Convex portion.
Claims (1)
リード線をボンデイングワイヤにて接続し、上記
半導体素子をタブ上に固定する半導体素子組付け
構造において、上記タブは合成樹脂材料により金
型を用いてモールド成形し、かつタブの周縁部に
よりリード線先端を固定保持するようにしたこと
を特徴とする半導素子体組み付け構造。 (2) 上記タブの周縁部には、ボンデイングされ
るワイヤに沿つて傾斜した凸部を形成したことを
特徴とする上記請求項１記載の半導体素子組付け
構造。[Claims for Utility Model Registration] (1) In a semiconductor element assembly structure in which a terminal of a semiconductor element and a plurality of lead wires of a lead wiring body are connected with a bonding wire and the semiconductor element is fixed on the tab, 1. A structure for assembling a semiconductor element body, which is formed by molding a synthetic resin material using a metal mold, and in which the tip of a lead wire is fixed and held by the peripheral edge of a tab. (2) The semiconductor element assembly structure according to claim 1, wherein a convex portion is formed on the peripheral edge of the tab so as to be inclined along the wire to be bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990080081U JPH0438061U (en) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990080081U JPH0438061U (en) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438061U true JPH0438061U (en) | 1992-03-31 |
Family
ID=31624821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990080081U Pending JPH0438061U (en) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438061U (en) |
-
1990
- 1990-07-27 JP JP1990080081U patent/JPH0438061U/ja active Pending