JPH0214807B2 - - Google Patents

Info

Publication number
JPH0214807B2
JPH0214807B2 JP12182982A JP12182982A JPH0214807B2 JP H0214807 B2 JPH0214807 B2 JP H0214807B2 JP 12182982 A JP12182982 A JP 12182982A JP 12182982 A JP12182982 A JP 12182982A JP H0214807 B2 JPH0214807 B2 JP H0214807B2
Authority
JP
Japan
Prior art keywords
substrate
piezoelectric
electrode
film
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12182982A
Other languages
Japanese (ja)
Other versions
JPS5912614A (en
Inventor
Takashi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP12182982A priority Critical patent/JPS5912614A/en
Publication of JPS5912614A publication Critical patent/JPS5912614A/en
Publication of JPH0214807B2 publication Critical patent/JPH0214807B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【発明の詳細な説明】 この発明は抵抗を有する圧電振動部品を製造す
る方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a piezoelectric vibrating component with resistance.

従来、圧電基板上に電極を設けて形成された共
振子、フイルタ、発振子、トラツプ素子、FMデ
イスクリミネータ用共振素子の如き圧電振動部品
と抵抗を組合せたいときは抵抗と圧電振動部品と
は別個に作られ、プリント基板上において別々に
取り扱かわれていたが、別個であると部品点数が
多くなりプリント基板上においてスペース的に不
利となる。
Conventionally, when you want to combine a piezoelectric vibrating component such as a resonator, a filter, an oscillator, a trap element, a resonant element for FM disc liminator, etc., which are formed by providing electrodes on a piezoelectric substrate, with a resistor, what are resistors and piezoelectric vibrating components? They were made separately and handled separately on the printed circuit board, but if they were separate, the number of parts would increase, resulting in a disadvantage in terms of space on the printed circuit board.

このため、一板の圧電基板上に電極と抵抗を設
け部品数の減少と小型化によりスペース的に有利
な圧電振動部品が近年提案されている。
Therefore, in recent years, piezoelectric vibrating components have been proposed in which electrodes and resistors are provided on a single piezoelectric substrate, which is advantageous in terms of space due to the reduction in the number of components and miniaturization.

上記のような圧電振動部品を製造する一般的な
方法は、圧電特性の出る組成の磁器材料を用い、
これを焼成して圧電基板を形成し、この圧電基板
を分極して圧電性をもたせ、共振電極等の加工を
施す。この後圧電性基板に抵抗ペーストを塗布し
てこれを焼付け固着させるようにしていた。
A general method for manufacturing piezoelectric vibrating parts as described above uses a porcelain material with a composition that exhibits piezoelectric properties.
This is fired to form a piezoelectric substrate, this piezoelectric substrate is polarized to give it piezoelectricity, and processed into a resonant electrode and the like. After this, a resistance paste was applied to the piezoelectric substrate and fixed by baking.

しかし、抵抗ペーストを焼付け加工するときに
圧電基板を高温で加熱すると、圧電基板が備えて
いる圧電性がとれるため、抵抗ペーストの焼付け
を、圧電基板の圧電性を損なわない温度以下で行
なう必要がある。
However, if the piezoelectric substrate is heated to high temperatures when baking the resistance paste, the piezoelectricity of the piezoelectric substrate will be lost, so it is necessary to bake the resistance paste at a temperature below which does not impair the piezoelectricity of the piezoelectric substrate. be.

このため抵抗の焼付けが不充分となり、強度の
強いものが得られないと共に、抵抗値のバラツキ
発生や経時変化の原因となるという問題がある。
For this reason, there is a problem that the resistor is insufficiently baked, making it impossible to obtain a strong one, and causing variations in resistance value and changes over time.

この発明は上記のような問題を解決するために
なされたものであり、抵抗の焼付けが高温で行な
え、抵抗の強度と精度が優れた圧電振動部品を提
供することを目的とする。
This invention was made to solve the above-mentioned problems, and it is an object of the present invention to provide a piezoelectric vibrating component in which the resistance can be baked at high temperature and the resistance has excellent strength and accuracy.

この発明の構成は、圧電磁器板になり得る基板
の所要位置に抵抗膜を設けて充分な温度で焼付
け、この抵抗膜の両端を除く表面を不導体インキ
で被覆した後、基板の表面全体に電極膜を施して
分極を行ない、電極膜上に必要なパターンをレジ
ストインキで印刷してエツチングを施すように
し、電極膜の形成前に抵抗膜を高温で焼付け加工
することができるようにしたものである。
The structure of this invention is to provide a resistive film at a desired position on a substrate that can be made into a piezoelectric ceramic plate, bake it at a sufficient temperature, coat the surface of the resistive film except for both ends with nonconducting ink, and then coat the entire surface of the substrate with nonconducting ink. Polarization is performed by applying an electrode film, and the necessary pattern is printed on the electrode film with resist ink and etched, making it possible to bake the resistive film at high temperature before forming the electrode film. It is.

以下、この発明の一実施例を添付図面にもとづ
いて説明する。
Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings.

図面は1素子構成の圧電磁器フイルタに1つの
抵抗を設けた圧電振動部品に適用した例であり、
第1図ないし第9図はその製造工程を示し、第1
0図は同上の電気的回路を示しているが、共振子
等他の圧電振動部品にも適用できる。
The drawing shows an example of application to a piezoelectric vibrating component in which a piezoelectric ceramic filter with a single element configuration is provided with one resistor.
Figures 1 to 9 show the manufacturing process.
Although Figure 0 shows the same electrical circuit as above, it can also be applied to other piezoelectric vibrating components such as resonators.

先ず、第1図のように、圧電磁器板になり得る
材料を用いて基板1を形成し、次に第2図のよう
に、基板1の表面における所要の位置に抵抗ペー
ストを塗布した後、高温で焼付を行なつて抵抗膜
2を形成する。
First, as shown in FIG. 1, a substrate 1 is formed using a material that can be made into a piezoelectric ceramic plate, and then, as shown in FIG. The resistive film 2 is formed by baking at a high temperature.

抵抗膜2は高温での焼付けにより強固な固着と
なる。
The resistive film 2 becomes firmly fixed by baking at high temperature.

第3図のように、抵抗膜2の両端を除く表面を
不導体インキ3で被覆した後、基板1の表面およ
び裏面の全体に電極膜4を設ける。(第4図参照) 電極膜4の形成は、蒸着やスパツタリング等の
手段によつて施し、抵抗膜2の不導体インキ3で
被覆された部分は電極膜4との接触がなく、その
両端の露出する部分のみが電極膜4と導通するこ
とになり、後にこの部分が電極における入出力両
端子との接続部分となる。
As shown in FIG. 3, after the surface of the resistive film 2 except for both ends is coated with a nonconducting ink 3, an electrode film 4 is provided on the entire front and back surfaces of the substrate 1. (See Figure 4) The electrode film 4 is formed by means such as vapor deposition or sputtering, and the portion of the resistive film 2 covered with the non-conducting ink 3 does not come into contact with the electrode film 4, and both ends thereof Only the exposed portion will be electrically connected to the electrode film 4, and this portion will later become the connection portion between the input and output terminals of the electrode.

電極膜4の形成された基板1に対し、表裏の電
極膜に直流の高電圧をかけ、第5図のように、母
基板の厚み方向に分極処理を施し、圧電基板1a
に形成する。
A high direct current voltage is applied to the front and back electrode films of the substrate 1 on which the electrode film 4 is formed, and polarization treatment is performed in the thickness direction of the mother substrate as shown in FIG.
to form.

この後、表裏両電極膜4上に残しておきたい電
極パターンをレジストインキ5で印刷する。
Thereafter, an electrode pattern to be left on both the front and back electrode films 4 is printed with resist ink 5.

第6図は圧電基板1aの表面に、また第7図は
同裏面に施す電極パターンのレジストインキを示
している。
FIG. 6 shows the resist ink of the electrode pattern applied to the front surface of the piezoelectric substrate 1a, and FIG. 7 shows the resist ink applied to the back surface of the piezoelectric substrate 1a.

表面のレジストインキ5は一対の振動電極を形
成するために施され、入出力の端子に該当する部
分が不導体インキ3の端部に達している。
The resist ink 5 on the surface is applied to form a pair of vibrating electrodes, and portions corresponding to input/output terminals reach the ends of the nonconductive ink 3.

レジストインキ5の印刷後、表裏両電極膜4に
エツチングを施す。エツチングを行なうと、レジ
ストインキ5で覆われた部分だけそのまゝ残り、
露出している不要部分の電極膜4は除去され、こ
の後洗浄すればレジストインキ5が取り除かれ、
第8図のように必要とするパターンの電極6が形
成されることになる。
After printing the resist ink 5, both the front and back electrode films 4 are etched. When etching is performed, only the areas covered with resist ink 5 remain as they are,
The exposed unnecessary portions of the electrode film 4 are removed, and the resist ink 5 is removed by subsequent cleaning.
The electrode 6 of the required pattern is formed as shown in FIG.

また、第9図のように、必要ならば抵抗膜2を
不導体インキ3と共にトリミング7して抵抗値を
所望のものにすればよく、圧電基板1aの表面に
一対の分割振動電極6a,6bが対向し、その入
出力端子AとBが抵抗膜2でつながり、しかも裏
面側に振動電極6cを備えた圧電磁器フイルタが
できあがり、各端子A,B,Cにリード線を接続
する等通常の加工を施せばよい。
Further, as shown in FIG. 9, if necessary, the resistance film 2 may be trimmed 7 together with the nonconductor ink 3 to obtain a desired resistance value. A piezoelectric ceramic filter is completed in which the input and output terminals A and B are connected by a resistive film 2, and a vibrating electrode 6c is provided on the back side. All you have to do is process it.

なお、実施例では、一つの圧電振動部品を製作
したが、大きな母基板を用い、多数個の同時加工
を行なつてもよい。
In the embodiment, one piezoelectric vibrating component was manufactured, but a large mother board may be used and a large number of piezoelectric vibrating components may be processed simultaneously.

以上のように、この発明によると、圧電磁器板
になり得る基板の所要位置に抵抗膜を設けて焼付
加工した後、この抵抗膜を不導体インキで被覆
し、次に電極膜の形成、基板の分極、電極膜上へ
のレジストインキでの印刷、エツチングを順次施
し、電極膜の不要部分を除去するようにしたの
で、抵抗膜の形成を圧電基板の分極加工前に行な
うことができ、従つて圧電基板の圧電性に関係な
く、充分に高い温度で抵抗膜を焼付加工すること
ができるようになり、強度が強く精度の高い抵抗
膜を形成でき、性能バラツキのない複合圧電振動
部品を得ることができる。
As described above, according to the present invention, a resistive film is provided at the required position of a substrate that can be made into a piezoelectric ceramic plate, and then the resistive film is coated with a nonconducting ink, and then an electrode film is formed, and the substrate is coated with a nonconducting ink. By sequentially polarizing the electrode film, printing with resist ink on the electrode film, and etching to remove unnecessary parts of the electrode film, the resistive film can be formed before the piezoelectric substrate is polarized. As a result, it is now possible to bake a resistive film at a sufficiently high temperature regardless of the piezoelectricity of the piezoelectric substrate, forming a strong and highly accurate resistive film, resulting in a composite piezoelectric vibrating component with consistent performance. be able to.

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第9図の各々は、この発明による製
造方法を示す工程図、第10図は圧電振動部品の
一例を示す回路図である。 1……基板、1a……圧電基板、2……抵抗
膜、3……不導体インキ、4……電極膜、5……
レジストインキ、6……電極、7……トリミン
グ。
Each of FIGS. 1 to 9 is a process diagram showing a manufacturing method according to the present invention, and FIG. 10 is a circuit diagram showing an example of a piezoelectric vibrating component. DESCRIPTION OF SYMBOLS 1... Substrate, 1a... Piezoelectric substrate, 2... Resistive film, 3... Nonconductor ink, 4... Electrode film, 5...
Resist ink, 6...electrode, 7...trimming.

Claims (1)

【特許請求の範囲】[Claims] 1 圧電磁器板になり得る基板の所要位置に抵抗
膜を設けて焼付け、この抵抗膜の両端を除く表面
を不導体インキで被覆した後基板の表面全体に電
極膜を設け、次に基板の分極を行ない分極後電極
膜上に残しておきたいパターンをレジストインキ
で印刷し、この後エツチングを施して電極膜の不
要部分を除去することを特徴とする抵抗を有する
圧電振動部品の製造方法。
1. A resistive film is provided at the required position of a substrate that can be made into a piezoelectric ceramic plate and baked, the surface of this resistive film except for both ends is coated with non-conducting ink, an electrode film is provided on the entire surface of the substrate, and then the polarization of the substrate is performed. A method for manufacturing a piezoelectric vibrating component having resistance, which comprises printing a pattern to be left on the electrode film after polarization with resist ink, and then etching to remove unnecessary portions of the electrode film.
JP12182982A 1982-07-12 1982-07-12 Manufacture of piezoelectric oscillating parts having resistance Granted JPS5912614A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12182982A JPS5912614A (en) 1982-07-12 1982-07-12 Manufacture of piezoelectric oscillating parts having resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12182982A JPS5912614A (en) 1982-07-12 1982-07-12 Manufacture of piezoelectric oscillating parts having resistance

Publications (2)

Publication Number Publication Date
JPS5912614A JPS5912614A (en) 1984-01-23
JPH0214807B2 true JPH0214807B2 (en) 1990-04-10

Family

ID=14820954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12182982A Granted JPS5912614A (en) 1982-07-12 1982-07-12 Manufacture of piezoelectric oscillating parts having resistance

Country Status (1)

Country Link
JP (1) JPS5912614A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0439715U (en) * 1990-07-31 1992-04-03

Also Published As

Publication number Publication date
JPS5912614A (en) 1984-01-23

Similar Documents

Publication Publication Date Title
KR910000969B1 (en) Chip-type resistor
US5991988A (en) Method of manufacturing a piezoelectric element
JPS5912614A (en) Manufacture of piezoelectric oscillating parts having resistance
JP2003217903A (en) Resistor and method for manufacturing the same, and temperature sensor using the resistor
JPH08265083A (en) Chip type low pass filter
KR20000047400A (en) High frequency resonator, and its methode for manufacture
JPH0795483B2 (en) Method for manufacturing thick film resistance element
JP2000124008A (en) Composite chip thermistor electronic component and its manufacture
JP2002353001A (en) Thick film chip resistor
JP2002246206A (en) Chip resistor and its manufacturing method
JPH0590859A (en) Manufacture of piezo-resonator
JP2003297670A (en) Chip type composite part
JPH06237026A (en) Forming method of thick-film electrode
JPH1167508A (en) Composite device and method of manufacturing the same
JPH08265081A (en) Chip type filter
JPH0547598A (en) Cr array
JPS6228740Y2 (en)
JPH0227710A (en) Chip type cr composite component and manufacture thereof
JP3419305B2 (en) Composite element
JPH0851002A (en) Electronic device and production thereof
JP2718196B2 (en) Manufacturing method of square plate type thin film chip resistor
JPH10294207A (en) Composite device and method of manufacturing the same
JP2640767B2 (en) Method of manufacturing chip-type resistor network
JPH10321403A (en) Manufacturing method of resistor
JPH04259202A (en) Chip part