JPH02148751A - Pad layout for semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate the formation of a probe card by composing the pads of an input terminal of a columns or n rows having the same function if the number of divisional measurements is n times when measuring pads are provided to measure the characteristics of a semiconductor device, and disposing the pads of an output terminal at intervals equal to the intervals between the columns or rows. CONSTITUTION:The fact that contact measuring styluses may be 1/n if input/ output pads are composed of a times of parallel movements is noticed, and the disposition of the pads is considered according to this. For example, in case of split measurements, a region partitioned by a scribing line 12 indicates one chip, and shaded pads 123-128 indicate input pads, and shaded pads 101-122 indicate output pads. In order to input the same signal to the input pads 123 and 124, 125 and 126, 127 and 128, the interval distance of the pads of the input terminal group is determined by d, and the output terminals are provided corresponding to the d. In case of the measurement, a stylus 14 is first brought into contact with the pad of odd number as shown by a solid line 16, and a card is second deviated by the d to be brought into contact with the even number pad shown by a broken line 18.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to the arrangement of pads for measuring the characteristics of semiconductor devices, particularly input pads and output pads. A measuring pad was installed in the section. For this measurement, a probe card was used that had measurement needles arranged corresponding to all the pads.

[Problem to be solved by the invention]

However, when measuring with a glove card that has measurement needles arranged corresponding to all pads as described above, the probe card has become more dense with semiconductor devices, the number of outputs has increased, and the distance between pads has increased. If the needles become too short, there are problems such as the measurement needles coming into contact with each other or making it physically impossible to arrange the needles.

Furthermore, as the number of measurement pads increases, it becomes difficult to manufacture probe cards and the probability of connection between the needle and pads decreases significantly.
Poor connections make measurements inefficient, and the glove card itself becomes expensive.

The object of the present invention is to improve the above problems and achieve high density [prior art].

[Means for resolving the subject]

In order to achieve the above object, the present invention focuses on the fact that when an input/output pad is constructed by n times of parallel movement, the number of measuring needles that come into contact with it may be 1/n, and the present invention is constructed as described below. .

In the pad arrangement of a semiconductor device where characteristics are measured using input and output terminal pads placed on the surface of the semiconductor device, when the number of divided measurements is n, the input terminal pads are arranged in n rows of pads with the same function. Alternatively, they are provided at a plurality of locations in n rows, and pads of output terminals corresponding to input terminals are arranged at intervals equal to the column spacing or row spacing of the input terminals.

Note that n here is a positive integer of 2 or more.

〔Example〕

Hereinafter, the present invention will be described in detail based on the drawings. FIG. 1 shows one embodiment of the present invention, for example, in the case of two-part measurement.

A region demarcated by scribe lines 12 on the surface of the semiconductor substrate represents one semiconductor chip, and square portions of this semiconductor chip represent pads.
6 to 128 indicate input pads. 101 to 122 indicate output pads. Input pads 126 and 124°12
The same signals are input to 5 and 126, 127 and 128. The spacing between pads of the input terminal group is d, and the output terminals are distributed in correspondence to d.

In the first measurement, the measuring needle 14 contacts odd-numbered pads as shown by the solid line 16 and takes measurements. Second
In the second measurement, the probe card moves by a pitch d and contacts the even numbered pads of the measuring needles indicated by broken lines 18.

FIG. 2 shows the pad arrangement in the case of three-part measurement.

The pair 201.202.206 and 204,205.206
The set 207, 208, and 209 indicate input terminal pads having the same function, and 210 to 218 indicate output terminal pads distributed in correspondence with the pitch of the input terminal group. In the first measurement, pad 201.204.2
07.210.213.216 is used, and in the second time pad 202.205.208.211.21
4.217 is used and in the third measurement pad °206.206.209.212.215.218 is used. As described above, according to the present invention, the number of measuring needles of the glove card used is only required in n divisional measurements, and the number of measuring needles is sparse, making it easy to create a probe card. It becomes possible to

〔Effect of the invention〕

As is clear from the above description, according to the present invention, it is possible to easily create a glove card in the measurement of semiconductor devices in which input pads and output pads are densely integrated, and the same glove card can be easily created by performing multiple divided measurements. It is possible to check the full output with the card, and furthermore, the connection probability can be improved, the measurement efficiency can be increased, and the price of the glove card can be reduced. Further, the direction of parallel movement used here may be the lateral direction. The number of divided measurements is not limited to two or three times as shown in the embodiments, but multiple divided measurements are possible.

[Brief explanation of the drawing]

Both FIG. 1 and FIG. 2 show the pad arrangement of the present invention, with FIG. 1 being an explanatory diagram of one embodiment, and FIG. 2 being an explanatory diagram of another embodiment. 12...Scribe line, 14...Measuring needle, 101-128.201-218...Pad. Figure 2

Claims (1)

[Claims] In a pad arrangement of a semiconductor device in which characteristics are measured using pads of an input terminal and an output terminal arranged on the surface of a semiconductor device, when the number of divided measurements is n times, the pad of the input terminal is the same as the pad having the same function. are provided in a plurality of locations in n columns or n rows, and the pads of the output terminals corresponding to the input terminals are arranged at intervals equal to the column spacing or row spacing of the input terminals. structure.