JPH02150028A - Centrifugal drying apparatus - Google Patents

Abstract

PURPOSE:To decompose and gasify organic materials remaining on the surface of a semiconductor substrate and to discharge it together with water content from a chamber by providing an ultraviolet ray generator in the chamber, and irradiating the surface of the substrate to which a centrifugal force is applied by centrifugal force applying means with ultraviolet rays. CONSTITUTION:A containing vessel 2 and a semiconductor substrate 1 are rotated by a drive source 6 to apply a centrifugal force thereto. A voltage is applied from a power source 11 to an ultraviolet lamp 10a to generate ultraviolet rays from the lamp 10a, thereby irradiating the substrate 1 with the ultraviolet rays. Thus, an organic material remaining on the surface of the substrate 1 is decomposed to be gasified. The gas is discharged on an air flow 13 from an air intake port 8 to a discharge tube 9 together with water content out of a drying chamber 5. Since the ultraviolet lamp is provided in the drying chamber, the substrate is irradiated with the ultraviolet rays at the time of drying to gasify the organic material remaining on the substrate to thereby remove it and to improve the yield of the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a centrifugal drying apparatus used for drying a semiconductor substrate after wet processing in a semiconductor device manufacturing process.

[Conventional technology] FIG. 3 is a longitudinal sectional view showing a conventional centrifugal drying device.

Inside the storage container 2 are a large number of semiconductor substrates 1 after wet processing.
is stored with its surface horizontal, and this storage container 2
is rotatably installed in the drying chamber 5 with its center of rotation being vertical. The N7 provided at the head of the drying chamber is removable, and by removing the lid 7, the semiconductor substrates 1 can be loaded into and taken out of the drying chamber 5. The lid 7 is provided with a large number of air intake ports 8,
When the lid 7 is installed at the head of the drying chamber 5, air is supplied into the drying chamber 5 through the air intake port 8. An exhaust pipe 9 is provided at the periphery of the bottom 5a of the drying chamber 5, and the air introduced into the drying chamber 5 through the air intake port 8 described above flows through an air flow 13 indicated by an arrow in the figure. This flows through the drying chamber 5 and is discharged from the exhaust pipe 9 to the outside.

Below the bottom 5a of the drying chamber 5, a drive source 6 such as a motor is provided with its drive shaft 3 vertical and its tip facing upward. This drive shaft 3 is supported by a bearing section 4 provided at the center of the bottom 5a of the drying chamber 5, and its tip end is inserted into the drying chamber 5 through the bearing section 4. The tip of the drive shaft 3 is connected to the storage container 2 in the drying chamber 5, and when the drive source 6 is activated and the drive shaft 3 rotates, the storage container 2 is vertically moved at a predetermined rotational speed. Driven to rotate around an axis.

In the conventional apparatus configured as described above, the semiconductor substrate 1 after wet processing is stored in the storage container 2, and after this storage container 2 is installed in the drying chamber 5, the drive source 6 is activated to move the storage container 2 is rotated at high speed around its central vertical axis of rotation. Then, a centrifugal force acts on the semiconductor substrate 1 in the storage container 2, and the moisture adhering to the surface of the semiconductor substrate 1 is scattered in a direction parallel to the surface of the semiconductor substrate 1. This moisture is discharged to the outside of the drying chamber 5 along with the air flow 13 introduced into the drying chamber 5 through the air intake port 8 of the lid 7.

[Problems to be Solved by the Invention] However, in the above-described conventional centrifugal drying apparatus, although moisture adhering to the semiconductor substrate 1 can be removed, organic substances adhering to the surface of the semiconductor substrate 1 can be removed. The disadvantage is that it cannot be removed and remains on the surface of the semiconductor substrate 1 as it is.

The present invention has been made in view of such problems, and includes:
It is an object of the present invention to provide a centrifugal drying device that can remove not only moisture but also organic matter from the surface of a semiconductor substrate.

[Means for Solving the Problems] A centrifugal drying apparatus according to the present invention includes a chamber into which a semiconductor substrate is charged, and a centrifugal force applying means for applying centrifugal force to the semiconductor substrate to dehydrate and dry the semiconductor substrate within the chamber. , further comprising an ultraviolet generator provided in the chamber and irradiating the semiconductor substrate with ultraviolet rays.

[Function] In the present invention, an ultraviolet ray generator is provided in the chamber,
Ultraviolet rays are irradiated onto the surface of the semiconductor substrate to which centrifugal force is applied by centrifugal force applying means. As a result, the organic matter remaining on the surface of the semiconductor substrate is decomposed and gasified, and is discharged from the chamber together with the moisture.

[Example] Next, an example of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention.

In FIG. 1, the same parts as in FIG. 3 are given the same reference numerals, and detailed explanation thereof will be omitted.

A rod-shaped ultraviolet lamp 1 is installed in the center of the lid 7 of the drying chamber 5.
The drying chamber 5 is suspended vertically with its longitudinal direction being vertical so that 0a is located at the center of the drying chamber 5. A power source 11 is connected to the ultraviolet lamp 10a via a cable 12.

In the centrifugal drying apparatus configured in this way, when the storage container 2 and the semiconductor substrate 1 are rotated by driving the drive source 6 to apply centrifugal force, power is supplied from the power source 11 to the ultraviolet lamp 10a, and the ultraviolet lamp 10a is The semiconductor substrate 1 is irradiated with ultraviolet rays. As a result, the organic substances remaining on the surface of the semiconductor substrate 1 are decomposed, and
gasified. This gas is carried by an air flow 13 extending from the air intake port 8 to the exhaust pipe 9, and is discharged to the outside of the drying chamber 5 together with moisture.

FIG. 2 is a longitudinal sectional view showing a second embodiment of the invention.

In FIG. 2, the same parts as in FIG. 1 are given the same reference numerals, and their explanations will be omitted. In this embodiment, the ultraviolet lamp 1
0b is attached to the inner surface of the side wall of the drying chamber 5.

This embodiment has the advantage that a larger number of lamps 10b can be provided than in the first embodiment.
The decomposition and gasification of organic matter is further accelerated.

[Effects of the Invention] As explained above, in the present invention, since the ultraviolet lamp is provided in the centrifugal drying chamber, organic matter remaining on the semiconductor substrate is gasified and removed by irradiating the semiconductor substrate with ultraviolet rays during drying. This has the effect that the yield of semiconductor substrates can be significantly improved.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view showing a centrifugal drying apparatus according to a first embodiment of the present invention, FIG. 2 is a longitudinal cross-sectional view showing a centrifugal drying apparatus according to a second embodiment of the present invention, and FIG. FIG. 2 is a longitudinal cross-sectional view showing a conventional centrifugal drying device. 1; Semiconductor substrate, 2; Storage container, 3; Drive shaft, 4; Bearing part, 5; Drying chamber, 6; Drive source, 7; Lid, 8; Air intake port, 9; Exhaust pipe, 10a, 10b; Ultraviolet rays Lamp, 11;
Power supply, 12; Cable, 13; Air flow 8;

Claims (1)

[Claims] (1) A chamber into which a semiconductor substrate is loaded; a centrifugal force applying means for dehydrating and drying the semiconductor substrate by applying centrifugal force to the semiconductor substrate within the chamber; and a centrifugal force applying means provided within the chamber for irradiating the semiconductor substrate with ultraviolet rays. A centrifugal drying device characterized by having an ultraviolet ray generator.