JPH02152109A - Y-ba-cu-o group superconductor film formed onto alumina base material and forming method thereof - Google Patents
Y-ba-cu-o group superconductor film formed onto alumina base material and forming method thereofInfo
- Publication number
- JPH02152109A JPH02152109A JP63299763A JP29976388A JPH02152109A JP H02152109 A JPH02152109 A JP H02152109A JP 63299763 A JP63299763 A JP 63299763A JP 29976388 A JP29976388 A JP 29976388A JP H02152109 A JPH02152109 A JP H02152109A
- Authority
- JP
- Japan
- Prior art keywords
- film
- mixture
- base material
- until
- alumina base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000002887 superconductor Substances 0.000 title claims description 29
- 239000000463 material Substances 0.000 title claims description 14
- 238000001035 drying Methods 0.000 claims abstract description 8
- 238000000137 annealing Methods 0.000 claims description 9
- 239000012298 atmosphere Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- BTGZYWWSOPEHMM-UHFFFAOYSA-N [O].[Cu].[Y].[Ba] Chemical compound [O].[Cu].[Y].[Ba] BTGZYWWSOPEHMM-UHFFFAOYSA-N 0.000 claims description 3
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 claims description 3
- FFWQPZCNBYQCBT-UHFFFAOYSA-N barium;oxocopper Chemical compound [Ba].[Cu]=O FFWQPZCNBYQCBT-UHFFFAOYSA-N 0.000 claims description 2
- 238000010583 slow cooling Methods 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910002480 Cu-O Inorganic materials 0.000 claims 1
- IQAKAOAPBMJSGJ-UHFFFAOYSA-N [Cu].[Y].[Ba] Chemical compound [Cu].[Y].[Ba] IQAKAOAPBMJSGJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 18
- 238000007650 screen-printing Methods 0.000 abstract description 7
- 238000003801 milling Methods 0.000 abstract description 4
- 238000007639 printing Methods 0.000 abstract description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000005751 Copper oxide Substances 0.000 abstract description 2
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 2
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 2
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 2
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 2
- 239000011812 mixed powder Substances 0.000 abstract description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 238000001914 filtration Methods 0.000 abstract 1
- 238000010298 pulverizing process Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 33
- 239000000758 substrate Substances 0.000 description 20
- 239000000523 sample Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Inorganic Compounds Of Heavy Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
本発明は、超伝導臨界温度が90aK付近のイットリウ
ム−バリウム−銅酸化物系超伝導体粉末(以下Y−Ba
−Cu−0系超伝導体と称す)によりなる超伝導体膜を
得る方法に関し、とくにアルミナ基材にY−Ba−Cu
−0系超伝導体膜を形成する方法及びその製品に関する
。Detailed Description of the Invention [Industrial Application Field] The present invention is directed to yttrium-barium-copper oxide based superconductor powder (hereinafter referred to as Y-Ba
-Cu-0 based superconductor)
The present invention relates to a method for forming a -0-based superconductor film and its products.
超伝導臨界温度が90′Kを越すY−Ba−Cu−0系
超伝導体をより経済的に量産できる方法を、出願人及び
その共同研究者らは、特願昭63−130484号明細
書(1988年5月30日出願)において提案している
。The applicant and his co-researchers have proposed a method for more economically mass producing Y-Ba-Cu-0 superconductors with a superconducting critical temperature exceeding 90'K, as disclosed in Japanese Patent Application No. 130484/1984. (filed on May 30, 1988).
また、超伝導体は、臨界電流密度がバルク状の時の10
’A/crMに比し、薄膜の場合テハ、106A /
ciに達することから、出願人らも開発に力を注ぎ、そ
の成果として、1987年8月4日付米マテリアル・リ
サーチ・ソサエティー(MR3)の秋季ミーティングで
、市販の96%アルミナを基板としてY−Ba−Cu−
0系超伝導体膜を形成する方法を報告した。In addition, the critical current density of superconductors is 10 in the bulk state.
'Compared to A/crM, in the case of a thin film, Teha, 106A/
In order to reach ci, the applicant and others focused on development, and as a result, at the Autumn Meeting of the Materials Research Society (MR3) on August 4, 1987, Y- Ba-Cu-
We reported a method for forming 0-based superconductor films.
上記報告で提案した方法では、Y−Ba−Cu−0系超
伝導体粉末を3=2の重量比で有機粘結剤(たとえばエ
チルセルローズを酢酸ブチルカルピトールに溶解させて
なる粘結剤)と混合して均一ペースト状にしてから、こ
のペーストの網目スクリーン印刷法によるアルミナ基板
表面への印刷とその印刷されたアルミナ基板の自然乾燥
、加熱乾燥工程を繰り返して膜厚を増やし、所定の膜厚
に至って前記乾燥をしたのら、900〜950°Cの温
度で焼結し、さらに酸素又は空気による酸化性雰囲気中
でアニール処理し、徐冷することにより、超伝導臨界温
度がほぼ90χで安定なY−Ba−Cu−0系超伝導体
を得ている。In the method proposed in the above report, Y-Ba-Cu-0 based superconductor powder is mixed with an organic binder (for example, a binder made by dissolving ethyl cellulose in butyl calpitol acetate) in a weight ratio of 3=2. This paste is mixed to form a uniform paste, and then this paste is printed on the surface of the alumina substrate using a mesh screen printing method, and the printed alumina substrate is repeatedly dried naturally and heated to increase the film thickness and form a desired film. After reaching a thickness and drying, it is sintered at a temperature of 900 to 950°C, further annealed in an oxidizing atmosphere with oxygen or air, and slowly cooled, so that the superconducting critical temperature is approximately 90χ. A stable Y-Ba-Cu-0 based superconductor has been obtained.
上記網目スクリーン印刷法を提案した背景は、従来のこ
の種超伝導体膜の形成方法では、超伝導体膜をその表面
に形成するベースとなる基板としては、単結晶型のマグ
ネシャやチタン酸ストロンチウムなどに限られているが
、この種基材の価格は余りにも高過ぎるのに対し、アル
ミナは遥かに安価で96%純度程度ならどこでも市販さ
れ、マイクロエレクトロニク・ハイブリッド回路技術に
、広く採用されていることにある。しかし、アルミナ基
材にも、なお、他の問題点がある。まず、Y−Ba−C
u−0系超伝導体が高い超伝導臨界温度を示すには、そ
の組成がY+BazC+u+07−sで、δ値が0.1
〜0.2程度でなければならないが、同温熱処理の際に
印刷された膜とアルミナ基板とがその接触面で反応を起
こし、前記Y1BazCuJt−sの組成からずれ、超
伝導特性が失われる。これの対策としては、バッファー
層として0.6 : 1.5 : 1の重量比のY2O
3とBaC0,とCuOとの混合物をエチレングリコー
ルでペースト状にして基板表面に塗り付けることを、イ
トーミネオらがNo、3 、 Vol、27. J。The background for proposing the above-mentioned mesh screen printing method is that in the conventional method for forming this type of superconductor film, the base substrate on which the superconductor film is formed is made of single-crystal magnesia or strontium titanate. However, the price of this kind of base material is too high, whereas alumina is much cheaper and is available commercially at around 96% purity, and is widely used in microelectronic hybrid circuit technology. It is in the fact that However, alumina substrates still have other problems. First, Y-Ba-C
In order for the u-0 series superconductor to exhibit a high superconducting critical temperature, its composition must be Y+BazC+u+07-s and the δ value must be 0.1.
Although it should be about 0.2, the printed film and the alumina substrate react at the contact surface during the isothermal heat treatment, resulting in a deviation from the composition of Y1BazCuJt-s and loss of superconducting properties. As a countermeasure for this, Y2O with a weight ratio of 0.6:1.5:1 is used as a buffer layer.
No. 3, Vol. 27. Itomineo et al. reported that a mixture of 3, BaC0, and CuO was made into a paste with ethylene glycol and applied to the substrate surface. J.
J、A、P、 (1088年3月)に提案しているが、
これは、また、それだけ余分の工程が増えることを意味
する。また、形成された膜とアルミナ基板間の結合力が
きわめて弱く剥離しやすいことも、実用性における大き
な欠点となっている。proposed by J.A.P. (March 1088).
This also means an extra step. Furthermore, the bonding force between the formed film and the alumina substrate is extremely weak and the film easily peels off, which is a major drawback in terms of practicality.
他方、超伝導体膜の形成技術の面でも、従来は、超伝導
体粉末を、溶液にしてプラズマジェントの形で基板に吹
き付けるプラズマスプレー法や、ペースト状にしてナイ
フなどを用いて基板上に塗り付けるテープキャスティン
グ法があるが、前者は、プラズマ装置が極めて高価なう
えに、他の電子部品の組み付は作業にうまくマツチさせ
ることが難しく、後者は、手作業によるため、曲面の生
地や形の複雑さによっては、制限を受け、大量には作れ
ない問題もある。On the other hand, in terms of technology for forming superconductor films, conventional methods include the plasma spray method in which superconductor powder is made into a solution and sprayed onto a substrate in the form of a plasma agent, and the method in which superconductor powder is made into a paste and then applied onto a substrate using a knife or the like. There is a tape casting method that involves painting, but in the former, the plasma equipment is extremely expensive and it is difficult to match the assembly of other electronic parts to the work, and in the latter, because it is done by hand, it cannot be used with curved fabrics or shapes. Depending on the complexity of the product, there may be restrictions that prevent it from being produced in large quantities.
本発明は、上記にかんがみ、これらの問題点を解決し、
高価なプラズマスプレー装置を要せず、安価な市販アル
ミナ基板に直接、90′に程度の超伝導臨界温度を示す
Y−Ba−Cu−0系超伝導体膜を形成する方法、及び
アルミナを基板とした、容易に剥離することなく、90
′に程度の超伝導臨界温度を示すY−Ba−Cu−0系
超伝導体膜を提供しようとするものである。In view of the above, the present invention solves these problems,
A method for forming a Y-Ba-Cu-0 based superconductor film exhibiting a superconducting critical temperature of about 90' directly on an inexpensive commercially available alumina substrate without requiring an expensive plasma spray device, and a method for forming a Y-Ba-Cu-0 based superconductor film that exhibits a superconducting critical temperature of approximately 90'; 90% without peeling easily.
The present invention aims to provide a Y--Ba--Cu--0 based superconductor film that exhibits a superconducting critical temperature on the order of .
上記目的を達成するために、本発明は.イットリウム−
バリウム−銅の酸化物系超伝導体と有機粘結剤を混合し
てペースト状にし、このペースト状混合物をスクリーン
印刷法でアルミナ基材上に印刷して乾燥させた後、高温
焼結処理、酸化雰囲気中での熱アニール処理及び徐冷を
へることにより、アルミナ基材上にイツトリウム−バリ
ウム銅の酸化物系超伝導体膜を形成する方法において、
前記ペースト状混合物をアルミナ基材に印刷して乾燥す
る工程を、前記膜の厚さが20廁以上になるまで繰り返
すことを特徴とする。In order to achieve the above object, the present invention... Yttrium
A barium-copper oxide superconductor and an organic binder are mixed to form a paste, and this paste mixture is printed on an alumina substrate using a screen printing method and dried, followed by high-temperature sintering. In a method for forming a yttrium-barium copper oxide superconductor film on an alumina substrate by thermal annealing in an oxidizing atmosphere and slow cooling,
The process of printing the pasty mixture on an alumina base material and drying it is repeated until the thickness of the film becomes 20 mm or more.
本発明が採った上記手段の特徴によれば、従来知られて
いたアルミナ相とY−Ba−Cu−0系相間において、
約16〜20卿の厚さ範囲で相互拡散現象が起き、超伝
導特性がない遷移相からなる所謂緩衝層が生成し、形成
した膜の厚さが20μm以上の部分では超伝導体組成を
維持し、アルミナとの間で相互拡散を行なわず、90′
に程度の超伝導臨界温度が保たれる。According to the features of the above means taken by the present invention, between the conventionally known alumina phase and the Y-Ba-Cu-0 phase,
An interdiffusion phenomenon occurs in the thickness range of about 16 to 20 μm, and a so-called buffer layer consisting of a transition phase with no superconducting properties is generated, and the superconducting composition is maintained in the part of the formed film with a thickness of 20 μm or more. 90′ without mutual diffusion with alumina.
The superconducting critical temperature is maintained at about .
以下、本発明の詳細な説明する。 The present invention will be explained in detail below.
試料作成:
酸化イツトリウムと、炭酸バリウムと、酸化銅を、それ
ぞれ互いにモル比がl:2:3となるように秤量して混
合し、無水アルコールを入れて均一なペースト状になる
ように撹拌し、振動ミルにより微粉ミリングをした後ろ
過し、このろ過動を乾燥後900℃温度で約15時間加
熱し、炉冷させ、前記ミリングと加熱炉冷を、混合物が
全くY、Ba2Cu、0.−δ相になるまで多数回繰り
返した。Sample preparation: Weigh and mix yttrium oxide, barium carbonate, and copper oxide in a molar ratio of 1:2:3, add anhydrous alcohol, and stir to form a uniform paste. After milling into fine powder using a vibrating mill, the mixture was filtered, dried, heated at 900° C. for about 15 hours, and cooled in a furnace. This was repeated many times until the −δ phase was reached.
次いで、酢酸プチルカルビトルにエチルセルローズを約
10−1%溶かしてなる有機粘結剤により、前記Y+B
azCU:+0t−5混合粉末へ、重量比にしてその約
3に対し2の割合を注入混合し、ロールミルにかけて均
一なペースト状になるようにミリングする。Next, the above Y+B
The azCU:+0t-5 mixed powder is injected and mixed in a weight ratio of about 3 to 2, and milled using a roll mill to form a uniform paste.
なお、この際、上記ペースト状混合物とアルミナ基材と
の接着力増強用として、酸化銀を少量添加した。At this time, a small amount of silver oxide was added to enhance the adhesive strength between the paste mixture and the alumina base material.
上記ペースト状混合物を、通常は板状に形成された市販
の96%アルミナ基板に、普通、約200メンシユのス
テンレススクリーンを用いて、スクリーン印刷法で膜状
に印刷し、膜表面が均一平坦になるよう暫く室温大気中
に静置した後、100°C温度で乾燥、この印刷、静置
及び乾燥の手順を、基板表面に形成される膜が所定厚さ
となるまで繰り返し行なった。The above paste-like mixture is printed onto a commercially available 96% alumina substrate, usually formed into a plate, in the form of a film using a screen printing method using a stainless steel screen of about 200 mesh, so that the film surface is uniform and flat. The substrate was allowed to stand for a while in the air at room temperature, and then dried at a temperature of 100° C. This procedure of printing, standing, and drying was repeated until the film formed on the surface of the substrate reached a predetermined thickness.
ここで、上記アルミナ基板は、メタノール中で10分間
超音波洗浄した後、乾燥をへたものであった。Here, the alumina substrate was ultrasonically cleaned in methanol for 10 minutes and then dried.
また、この実験に使われたスクリーンプリント装置は、
イギリスのDEに1202自動スクリーンプリンターで
あった。In addition, the screen printing equipment used in this experiment was
It was a 1202 automatic screen printer in UK DE.
上記により得たY、Ba2Cu、0.−δ膜が形成され
たアルミナ基板は、次いで、900〜950°C温度の
大気中で約1時間加熱した後、炉内を酸素または他のガ
スにより酸化性雰囲気にして徐々に温度を室温まで下げ
、もしくは、−旦中途で800〜400°C温度範囲内
に約20時間アニールした。Y obtained above, Ba2Cu, 0. The alumina substrate on which the -δ film has been formed is then heated in the atmosphere at a temperature of 900 to 950°C for about 1 hour, and then the inside of the furnace is made into an oxidizing atmosphere with oxygen or other gas, and the temperature is gradually raised to room temperature. The temperature was lowered or annealed for about 20 hours in the temperature range of 800 to 400°C.
上記酸化性雰囲気においてアニール処理することによっ
て、また、アニール温度は上記範囲内で高温なほど(す
なわち、好ましくは700〜800°C範囲)より安定
して90″に付近の超伝導臨界温度が得易いことは、す
でに知られている。By annealing in the above oxidizing atmosphere, the higher the annealing temperature within the above range (i.e., preferably in the range of 700 to 800°C), the more stable the superconducting critical temperature near 90'' can be obtained. It is already known that it is easy.
上記手順により作成した各異なる厚さの試料について、
次のいくつかのテストをした。For each sample of different thickness prepared by the above procedure,
I did some tests:
(1)アルファ・ステップ厚さ計により膜厚さを測定し
、かつ走査型電子顕微鏡(SEM)によりマイクロ組織
観察をすると共に、厚さ方向についてエネルギー分散X
線解析(EDXA)を行なった。(1) Measure the film thickness using an alpha step thickness meter, observe the microstructure using a scanning electron microscope (SEM), and perform energy dispersion X in the thickness direction.
Linear analysis (EDXA) was performed.
(2)X線回折測定(XRDA)を行ない、膜を形成す
る物質の結晶構造を確認した。(2) X-ray diffraction measurement (XRDA) was performed to confirm the crystal structure of the substance forming the film.
(3)四探針法により各温度の抵抗を測定し、Ton*
at+Tz。、。を求めた。(3) Measure the resistance at each temperature using the four-point probe method, and
at+Tz. ,. I asked for
ただし、
T On I Q t:単位’K(以下も同じ)、抵抗
減少開始温度。However, T On I Q t: Unit 'K (same below), temperature at which resistance decreases.
T zero : はぼ抵抗が0になった温度。Tzero: The temperature at which the resistance becomes 0.
以下本実験において得られた各データを表〜lに示す。The data obtained in this experiment are shown in Tables 1 to 1 below.
表−1において、例1のグループの試料1.2゜3は、
アニール条件の相違の影響を示し、高温な程高いT z
* r。が得られている。例2のグループの試料4,
5.6は、いずれもT o ri s e tがほぼ9
0〜95′Kにあり、膜厚はさほど超伝導臨界温度に影
響しないかにええるが、薄めの試料6は、著しくT2゜
、。が低く、界面近くで膜の組成が、超伝導特性を示す
Y:Ba:Cuのモル比1:2:3:(7−δ)からず
れているためと解される。例3のグループの試料7〜1
0は、膜厚の範囲を大幅に変化させ、アニール温度を9
25°Cとした場合の結果を示し、膜厚が16μmの試
料7は、超伝導性でな(半伝導性を示し、解析の結果が
アルミナ基板と膜の成分間に反応が起き、超伝導Y、B
a、Cu、O,−δ相をなす組成がIQなわれたことを
示し、試料8゜9は試料5,6よりT。n5eLが90
〜936に範囲に丁がり、試料IOのT z e r
oは85℃と例1,2のグループに比して落ちたことは
、高いアニール温度による基板との間の拡散に影響され
たものと思われる。続く例4のグループの試料11〜1
3は、焼結温度を950°Cとした他は、例3グループ
と同じ処理条件であり、結果としては、T z tt
r oが高くなり、試料12 、13は液体窒素温度7
7°により高温となっている。In Table 1, sample 1.2゜3 of the group of Example 1 is
This shows the influence of differences in annealing conditions; the higher the temperature, the higher the T z
*r. is obtained. Sample 4 of the group of example 2,
5.6, the total value is almost 9.
0 to 95'K, and it can be said that the film thickness does not significantly affect the superconducting critical temperature, but the thinner sample 6 has a significantly higher T2°. It is understood that this is because the composition of the film near the interface deviates from the Y:Ba:Cu molar ratio of 1:2:3:(7-δ), which exhibits superconducting properties. Samples 7-1 of the group of Example 3
0 changes the range of film thickness significantly and increases the annealing temperature to 9
The results are shown at 25°C, and sample 7 with a film thickness of 16 μm is not superconducting (it shows semiconductivity, but the analysis results indicate that a reaction occurs between the alumina substrate and the film components, resulting in superconductivity). Y, B
This indicates that the composition of a, Cu, O, and -δ phases is IQ, and sample 8°9 has a higher T than samples 5 and 6. n5eL is 90
~936, T z e r of sample IO
The fact that o was 85° C., which was lower than that of the groups of Examples 1 and 2, seems to be due to the influence of diffusion with the substrate due to the high annealing temperature. Samples 11-1 of the following Example 4 group
3 had the same processing conditions as the Example 3 group, except that the sintering temperature was 950°C, and as a result, T z tt
r o increases, and samples 12 and 13 have a liquid nitrogen temperature of 7.
The temperature is 7°.
例1〜4の各グループの組織解析については、X線回折
によると、試料4〜6における膜のY1Ba2Cu30
t−δ相が、成る程度分解または非超伝導相への転換に
よる劣化が見られ、試ネミ17では、主なる超伝導相の
結晶面(013) / (110)の強度比60/10
0が100/60に逆転し、非超伝導相Y2BaCuO
5が形成され、結晶構造が斜方晶から正方晶へ転換した
ことを示し、試料8.9ではこのような相の転換が起き
ていず、膜厚及びアニール温度を増加した試料13では
、Y1BatC+g07.y相の斜方晶のみしか現われ
ず、膜と基板との界面に直交してなされたY、Ba、C
u及びA1についてのEDX八によれば、超伝導体−半
導体転移が界面側膜の約20μm厚さ範囲にわたって起
きていることを示している。Regarding the structure analysis of each group of Examples 1-4, according to X-ray diffraction, Y1Ba2Cu30 of the membranes in Samples 4-6
Deterioration of the t-δ phase due to decomposition or conversion to a non-superconducting phase was observed, and in test Nemi 17, the intensity ratio of the crystal planes (013)/(110) of the main superconducting phase was 60/10.
0 is reversed to 100/60 and the non-superconducting phase Y2BaCuO
5 was formed, indicating that the crystal structure had changed from orthorhombic to tetragonal. In sample 8.9, such phase conversion did not occur, and in sample 13, in which the film thickness and annealing temperature were increased, Y1BatC+g07 .. Only y-phase orthorhombic crystals appear, and Y, Ba, and C are formed orthogonally to the interface between the film and the substrate.
EDX8 for u and A1 shows that the superconductor-semiconductor transition occurs over a thickness range of about 20 μm on the interface side film.
表−1
〔発明の効果〕
上記から明らかなように、本発明はY−Ba−Cu−0
系超伝導体混合物を、有機粘結剤と混ぜ合わせてペース
ト状にし、スクリーン印刷法により直接アルミナ基材に
プリントすることによって、前記混合物の膜をアルミナ
基材の表面に形成した後、乾燥、焼結及びアニール処理
を施すだけで、Y−Ba−Cu−0系超伝導体膜をアル
ミナ基材に形成することができ、プラズマスプレー法な
どのようにプラズマスプレー装置を必要としない。Table 1 [Effects of the invention] As is clear from the above, the present invention provides Y-Ba-Cu-0
A superconductor mixture is mixed with an organic binder to form a paste, and a film of the mixture is formed on the surface of the alumina base material by directly printing it on the alumina base material using a screen printing method, followed by drying. A Y-Ba-Cu-0 based superconductor film can be formed on an alumina base material simply by performing sintering and annealing treatment, and unlike the plasma spray method, a plasma spray device is not required.
また、直接アルミナ基材面に、20IM以上のI7さに
Y−Ba−Cu−0系超伝導体の膜を形成することによ
り、20μln以内の厚さの相互拡散層を形成させ、こ
れによりその表面のY−Ba−Cu−0系超伝導体層を
保護し、別途保護層の形成工程を要しない。In addition, by forming a Y-Ba-Cu-0 based superconductor film with an I7 of 20 IM or more directly on the alumina base material surface, an interdiffusion layer with a thickness of 20 μl or less is formed. The Y-Ba-Cu-0 superconductor layer on the surface is protected, and a separate process for forming a protective layer is not required.
以下余白Margin below
Claims (2)
ペーストをアルミナ基材上に成膜し、乾燥後、焼結、酸
化雰囲気下での熱アニール及び徐冷をへて、アルミナ基
材上にイットリウム−バリウム−銅の酸化物系超伝導体
膜を形成する方法において、前記ペーストをアルミナ基
材上に成膜して乾燥する工程を、該膜の厚さが20μm
以上になるまで繰り返すことを特徴とするアルミナを基
材とするY−Ba−Cu−O系超伝導体膜形成方法。1. A paste of yttrium-barium-copper oxide superconductor is formed into a film on an alumina base material, and after drying, sintering, thermal annealing in an oxidizing atmosphere, and slow cooling are performed to form yttrium on the alumina base material. - In a method for forming a barium-copper oxide superconductor film, the step of forming the paste onto an alumina base material and drying the paste until the film has a thickness of 20 μm.
A method for forming a Y--Ba--Cu--O based superconductor film using alumina as a base material, the method comprising repeating the steps until the above is achieved.
ム−バリウム−銅系の酸化物膜が形成され、該膜の少な
くとも表面層が超伝導体層であることを特徴とするアル
ミナを基材とするY−Ba−Cu−O系超伝導体膜。2. Yttrium-barium-copper based oxide film with a thickness of 20 μm or more is formed on an alumina base material, and at least the surface layer of the film is a superconductor layer. -Ba-Cu-O superconductor film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63299763A JPH02152109A (en) | 1988-11-29 | 1988-11-29 | Y-ba-cu-o group superconductor film formed onto alumina base material and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63299763A JPH02152109A (en) | 1988-11-29 | 1988-11-29 | Y-ba-cu-o group superconductor film formed onto alumina base material and forming method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02152109A true JPH02152109A (en) | 1990-06-12 |
Family
ID=17876676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63299763A Pending JPH02152109A (en) | 1988-11-29 | 1988-11-29 | Y-ba-cu-o group superconductor film formed onto alumina base material and forming method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02152109A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300591A (en) * | 1987-05-30 | 1988-12-07 | Nippon Cement Co Ltd | Manufacture of circuit board |
| JPS6465003A (en) * | 1987-01-30 | 1989-03-10 | Agency Ind Science Techn | Superconductive material and production thereof |
| JPH01215711A (en) * | 1988-02-24 | 1989-08-29 | Oki Electric Ind Co Ltd | Formation of superconducting thick film |
| JPH01234305A (en) * | 1988-03-11 | 1989-09-19 | I M C:Kk | Superconducting material and its production |
| JPH01246136A (en) * | 1988-03-28 | 1989-10-02 | Fujitsu Ltd | Superconductive ceramic paste |
| JPH01272011A (en) * | 1987-08-21 | 1989-10-31 | Ube Ind Ltd | superconducting material |
| JPH0230603A (en) * | 1988-07-19 | 1990-02-01 | Sanyo Electric Co Ltd | Coating for oxide superconductor thick film |
| JPH0248457A (en) * | 1988-08-08 | 1990-02-19 | Sanyo Electric Co Ltd | Oxide superconductor thick film paint |
| JPH0288410A (en) * | 1988-07-25 | 1990-03-28 | Xerox Corp | Production of copper oxide superconductor |
-
1988
- 1988-11-29 JP JP63299763A patent/JPH02152109A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6465003A (en) * | 1987-01-30 | 1989-03-10 | Agency Ind Science Techn | Superconductive material and production thereof |
| JPS63300591A (en) * | 1987-05-30 | 1988-12-07 | Nippon Cement Co Ltd | Manufacture of circuit board |
| JPH01272011A (en) * | 1987-08-21 | 1989-10-31 | Ube Ind Ltd | superconducting material |
| JPH01215711A (en) * | 1988-02-24 | 1989-08-29 | Oki Electric Ind Co Ltd | Formation of superconducting thick film |
| JPH01234305A (en) * | 1988-03-11 | 1989-09-19 | I M C:Kk | Superconducting material and its production |
| JPH01246136A (en) * | 1988-03-28 | 1989-10-02 | Fujitsu Ltd | Superconductive ceramic paste |
| JPH0230603A (en) * | 1988-07-19 | 1990-02-01 | Sanyo Electric Co Ltd | Coating for oxide superconductor thick film |
| JPH0288410A (en) * | 1988-07-25 | 1990-03-28 | Xerox Corp | Production of copper oxide superconductor |
| JPH0248457A (en) * | 1988-08-08 | 1990-02-19 | Sanyo Electric Co Ltd | Oxide superconductor thick film paint |
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