JPH0215360U - - Google Patents
Info
- Publication number
- JPH0215360U JPH0215360U JP9238388U JP9238388U JPH0215360U JP H0215360 U JPH0215360 U JP H0215360U JP 9238388 U JP9238388 U JP 9238388U JP 9238388 U JP9238388 U JP 9238388U JP H0215360 U JPH0215360 U JP H0215360U
- Authority
- JP
- Japan
- Prior art keywords
- driving
- board
- thermal head
- resin
- type thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案による端面型サーマルヘツドの
一実施例を示す斜視図、第２図は第１図の−
′線に沿つた断面図、第３図は従来の端面型サー
マルヘツドの一例を示す斜視図、第４図は第３図
の−′線に沿つた断面図である。
１……基体、２……下基板、３……配線基板、
４……発熱抵抗体、６……駆動用ＩＣ、８……樹
脂、１０……上基板、１１……中空部。
FIG. 1 is a perspective view showing an embodiment of the end face type thermal head according to the present invention, and FIG.
3 is a perspective view showing an example of a conventional end face type thermal head, and FIG. 4 is a sectional view taken along line -' in FIG. 3. 1...Base body, 2...Lower board, 3...Wiring board,
4... Heat generating resistor, 6... Drive IC, 8... Resin, 10... Upper substrate, 11... Hollow part.
Claims (1)
基板を固定し、上記発熱抵抗体を上基板によつて
保護すると共に、上記下基板又は上記配線基板に
駆動用ＩＣを搭載し、該駆動用ＩＣを樹脂によつ
て保護するように成された端面型サーマルヘツド
において、 上記上基板を、環体と成し、上記駆動用ＩＣを
上記上基板の中空部内に囲み、該中空部内に上記
樹脂を充填して上記駆動用ＩＣを保護するように
したことを特徴とする端面型サーマルヘツド。[Claims for Utility Model Registration] A lower board and a wiring board on which a heat generating resistor is formed are fixed to a base, the heat generating resistor is protected by the upper board, and the lower board or the wiring board is provided with a drive board. In an edge-type thermal head mounted with an IC and configured to protect the driving IC with a resin, the upper substrate is formed into a ring, and the driving IC is placed in a hollow part of the upper substrate. An end face type thermal head characterized in that the driving IC is protected by enclosing the driving IC and filling the resin into the hollow part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9238388U JPH0215360U (en) | 1988-07-12 | 1988-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9238388U JPH0215360U (en) | 1988-07-12 | 1988-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215360U true JPH0215360U (en) | 1990-01-31 |
Family
ID=31316824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9238388U Pending JPH0215360U (en) | 1988-07-12 | 1988-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215360U (en) |
-
1988
- 1988-07-12 JP JP9238388U patent/JPH0215360U/ja active Pending