JPH0244047U - - Google Patents
Info
- Publication number
- JPH0244047U JPH0244047U JP11711888U JP11711888U JPH0244047U JP H0244047 U JPH0244047 U JP H0244047U JP 11711888 U JP11711888 U JP 11711888U JP 11711888 U JP11711888 U JP 11711888U JP H0244047 U JPH0244047 U JP H0244047U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- external connection
- connection pin
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツドの一実施例の
全体説明図、第２図は同実施例の要部の斜視図、
第３図は第２図の矢視部分の拡大図、第４図は
従来のサーマルヘツドの説明図である。
３……発熱抵抗体、６……プリント配線基板、
７……外部接続用配線、８……接続コネクタ、９
……接続ピン、１３……保護カバー、１６……接
着剤。
FIG. 1 is an overall explanatory diagram of an embodiment of the thermal head of the present invention, and FIG. 2 is a perspective view of the main parts of the embodiment.
FIG. 3 is an enlarged view of the portion shown by the arrow in FIG. 2, and FIG. 4 is an explanatory view of a conventional thermal head. 3... Heat generating resistor, 6... Printed wiring board,
7...Wiring for external connection, 8...Connector, 9
... Connection pin, 13 ... Protective cover, 16 ... Adhesive.
Claims (1)
択的に発熱させるための駆動用ＩＣおよび外部接
続用配線７が設けられるとともに、プリント配線
基板６の裏面に接続コネクタ８が設けられ、この
接続コネクタ８を前記外部接続用配線７に接続す
るための接続ピン９が前記プリント配線基板６の
表面に突出されるとともに、前記駆動用ＩＣおよ
び外部接続用配線７の上方を覆う保護カバー１３
が前記プリント配線基板６表面に取付けられたサ
ーマルヘツドにおいて、 前記接続ピン９および、この接続ピン９と前記
外部接続用配線７との接続部を封入するように配
設された接着剤１６を介して前記保護カバー１３
を前記プリント配線基板６表面に固定したことを
特徴とするサーマルヘツド。[Claim for Utility Model Registration] A driving IC for selectively generating heat in the heating resistor 3 and external connection wiring 7 are provided on the front surface of the printed wiring board 6, and a connecting connector is provided on the back surface of the printed wiring board 6. A connection pin 9 for connecting the connector 8 to the external connection wiring 7 is protruded from the surface of the printed wiring board 6 and above the drive IC and the external connection wiring 7. protective cover 13 that covers
is attached to the surface of the printed wiring board 6 through an adhesive 16 disposed so as to encapsulate the connection pin 9 and the connecting portion between the connection pin 9 and the external connection wiring 7. The protective cover 13
is fixed to the surface of the printed wiring board 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11711888U JPH0244047U (en) | 1988-09-06 | 1988-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11711888U JPH0244047U (en) | 1988-09-06 | 1988-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244047U true JPH0244047U (en) | 1990-03-27 |
Family
ID=31360279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11711888U Pending JPH0244047U (en) | 1988-09-06 | 1988-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244047U (en) |
-
1988
- 1988-09-06 JP JP11711888U patent/JPH0244047U/ja active Pending
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