JPH02155111A - Tin oxide-based electrically conductive film - Google Patents
Tin oxide-based electrically conductive filmInfo
- Publication number
- JPH02155111A JPH02155111A JP28497288A JP28497288A JPH02155111A JP H02155111 A JPH02155111 A JP H02155111A JP 28497288 A JP28497288 A JP 28497288A JP 28497288 A JP28497288 A JP 28497288A JP H02155111 A JPH02155111 A JP H02155111A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrically conductive
- tin oxide
- based electrically
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910001887 tin oxide Inorganic materials 0.000 title claims description 31
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 150000001875 compounds Chemical class 0.000 abstract 2
- 230000000593 degrading effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 68
- 238000002834 transmittance Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 239000002772 conduction electron Substances 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
- Conductive Materials (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、酸化錫系電気伝導膜に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a tin oxide-based electrically conductive film.
(従来の技術)
従来、この種の酸化錫系電気伝導膜としては、5n02
膜、或いはI T O(Indyum−Tin−Oxi
de)膜は知られている。これらの薄膜は優れた電気伝
導性、光透過性を有するため、これらの薄膜を透明な基
板の表面に形成して、太陽電池、エレクトロクロミック
素子、液晶表示素子等の種々の透明電極として多用され
ている。(Prior art) Conventionally, as this type of tin oxide-based electrically conductive film, 5n02
film or ITO (Indium-Tin-Oxi)
de) membranes are known. Because these thin films have excellent electrical conductivity and optical transparency, they are often used as transparent electrodes in solar cells, electrochromic devices, liquid crystal display devices, etc. by forming them on the surface of transparent substrates. ing.
前記酸化錫系電気伝導膜のうち前者の5n02膜は後者
のITO膜に比して硬度が高いためキズ付きにくいので
取り扱いが容易であり、また耐熱性に優れているため5
n02膜上に他の薄膜材料を重ねて成膜する際に施され
る加熱に対して比抵抗の増加が少ないという利点を有し
ている反面、ITO膜に比しては電気伝導度が著しく小
さいという欠点を有していた。Among the tin oxide-based electrically conductive films, the former 5N02 film has higher hardness than the latter ITO film and is less likely to be scratched, making it easier to handle, and has excellent heat resistance.
Although it has the advantage that the resistivity does not increase much due to the heating applied when depositing other thin film materials on the N02 film, on the other hand, the electrical conductivity is significantly lower than that of the ITO film. It had the disadvantage of being small.
そこで5n02膜の電気伝導度の向上即ち比抵抗の低下
を計るため5n02にsbまたはFを添加することが行
なわれている。この5n02へのsbまたはFの添加は
、5n02膜内部における伝導電子の濃度を増加させる
ものであり、該sbまたはFの添加に加え、51102
膜の結晶粒界部分において伝導電子やホール等が移動す
る際にその妨げとなる結晶粒界の影響を減少させるため
、SnO□膜を成膜する際の成膜速度および成膜温度の
条件を選択して5n02膜の結晶粒径を大きくさせるよ
うにしている。Therefore, in order to improve the electrical conductivity of the 5n02 film, that is, to lower the specific resistance, sb or F is added to the 5n02 film. The addition of sb or F to 5n02 increases the concentration of conduction electrons inside the 5n02 film, and in addition to the addition of sb or F, 51102
In order to reduce the influence of grain boundaries that impede the movement of conduction electrons, holes, etc. in the grain boundary portion of the film, the deposition rate and deposition temperature conditions when depositing the SnO□ film are adjusted. The crystal grain size of the 5n02 film is selectively increased.
(発明が解決しようとする課題)
しかしながら、5n02にsbまたはFを添加すること
により5n02膜の比抵抗を低下させることが出来るが
、Snに対するこれら成分の添加量が2%を超えるとS
nO□膜の光透過率が著しく低下するため、光透過率を
良好に維持しつつ比抵抗の低下を行うには限度があった
。例えば、5n02にsbを2.0モル%添加し、成膜
速度を1.2人/秒、成膜(基板)温度を450℃とし
た最良条件下で成膜して得られた5n02膜の比抵抗は
3.5 Xl0−’Ω・cm、光透過率は70%であっ
て、該5n02膜の比抵抗はITO膜の比抵抗1.5〜
2.2 Xl0−’Ωφ印に比して依然として大きいと
いう問題がある。(Problem to be Solved by the Invention) However, the resistivity of the 5n02 film can be lowered by adding sb or F to 5n02, but if the amount of these components added to Sn exceeds 2%, the
Since the light transmittance of the nO□ film is significantly reduced, there is a limit to the ability to reduce the specific resistance while maintaining good light transmittance. For example, a 5n02 film obtained by adding 2.0 mol% of sb to 5n02, forming a film under the best conditions with a film-forming rate of 1.2 people/second and a film-forming (substrate) temperature of 450°C. The specific resistance is 3.5 Xl0-'Ωcm, the light transmittance is 70%, and the specific resistance of the 5n02 film is 1.5 to 1.5 to that of the ITO film.
2.2 There is a problem that it is still large compared to the mark Xl0-'Ωφ.
本発明は、光透過率を損なうことなく、比抵抗を低下さ
せた酸化錫系電気伝導膜を提供することを目的とする。An object of the present invention is to provide a tin oxide-based electrically conductive film with reduced specific resistance without impairing light transmittance.
(課題を解決するための手段)
本発明者等は、前記目的を達成すべく酸化錫系電気伝導
膜について鋭意研究した結果、5n02から成る組成物
中のSnの一部をZrとsbに置換することにより、光
透過率を損なうことなく比抵抗が低下することを見知し
た。(Means for Solving the Problems) In order to achieve the above object, the present inventors conducted extensive research on tin oxide-based electrically conductive films, and as a result, they replaced a portion of Sn in a composition consisting of 5n02 with Zr and sb. It has been found that by doing so, the specific resistance can be lowered without impairing the light transmittance.
また、5n02から成る組成物中のSnの一部をZrに
置換すると共に、組成物中のOの一部をFに置換するこ
とにより、光透過率を損なうことなく比抵抗が低下する
ことを見知した。Furthermore, by substituting a part of Sn in the composition consisting of 5n02 with Zr and substituting a part of O in the composition with F, it was found that the specific resistance was reduced without impairing the light transmittance. I recognized it.
本発明は、前記見知に基づいてなされたものであって、
第1の発明は、組成物中のSnの一部をZ「とsbに置
換した酸化錫系電気伝導膜に関するもので、
一般式
%式%
ただし
1.80< w < 2.05
0.001 < x < 0.030
0.015 < y < 0.020
で表わされる組成から成ることを特徴とする。The present invention has been made based on the above findings, and includes:
The first invention relates to a tin oxide-based electrically conductive film in which a part of Sn in the composition is replaced with Z' and sb, and has the general formula % where 1.80 < w < 2.05 0.001 < x < 0.030 0.015 < y < 0.020.
第1発明に用いるSnの一部を置換するZ「の組成比(
Sn十x + y −1)ニおけるx(7)値を0.0
01〜0.030としたのはXの値がこの範囲を外れた
場合、比抵抗が大きくなる等の理由からである。The composition ratio (
Set the x(7) value at Sn + y - 1) to 0.0
The reason for setting the value to be 01 to 0.030 is that when the value of X is outside this range, the specific resistance becomes large.
またsbの組成比におけるyの値を0.015〜0、0
20としたのはyの値が0.015以下の場合には比抵
抗が大きく、yの値が0.020以上の場合には光透過
率が70%以下となる等の理由がらである。Also, the value of y in the composition ratio of sb is 0.015 to 0,0
The reason for setting it to 20 is that when the value of y is 0.015 or less, the specific resistance is large, and when the value of y is 0.020 or more, the light transmittance is 70% or less.
またOのWの値を1.80〜2.05としたのはWの値
が1.80以下の場合には膜中にSnOが生成して光透
過率が低下し、Wの値が2.05以上のものは存在しな
い等の理由からである。In addition, the W value of O was set to 1.80 to 2.05 because if the W value is less than 1.80, SnO will be generated in the film and the light transmittance will decrease. This is because there are no cases with a value of .05 or higher.
また、第2の発明は、組成物中のSnの一部をZrに置
換すると共に、組成物中のOの一部をFに置換した酸化
錫系電気伝導膜に関するもので、一般式
%式%
ただし
1.80< w < 2.05
0.003 < x < 0.030
0.015 < z < 0.020
で表わされる組成から成ることを特徴とする。Further, the second invention relates to a tin oxide-based electrically conductive film in which a part of Sn in the composition is replaced with Zr and a part of O in the composition is replaced with F, and the film has the general formula %. % However, it is characterized by having a composition expressed as 1.80<w<2.05 0.003<x<0.030 0.015<z<0.020.
第2発明に用いるSnの一部を置換するZrの組成比(
Sn十x −1)におけるXの値を0゜003〜0.0
30としたのはXの値がこの範囲を外れると比抵抗が大
きくなる等の理由からである。Composition ratio of Zr (
The value of
The reason for setting the value to 30 is that when the value of X is out of this range, the specific resistance becomes large.
またOの一部を置換するFの組成比(0+z−1,80
〜2.05)における2の値を0.015〜0.020
としたのは2の値が0.015以下の場合には比抵抗が
大きく、2の値が0.020以上の場合には光透過率が
70%以下になる等の理由からである。In addition, the composition ratio of F (0+z-1,80
~2.05) 0.015~0.020
The reason for this is that when the value of 2 is 0.015 or less, the specific resistance is large, and when the value of 2 is 0.020 or more, the light transmittance is 70% or less.
(作 用)
Sn0w中のSnの一部をZrで置換することにより、
5no2の結晶粒子の成長が促進される。更に4(il
Ii金属のSnの一部を5価金属のsbで置換すること
により膜中の伝導電子の濃度が増大する。(Function) By substituting a part of Sn in Sn0w with Zr,
Growth of 5no2 crystal grains is promoted. Furthermore, 4 (il
By replacing a portion of Sn in the Ii metal with sb, a pentavalent metal, the concentration of conduction electrons in the film increases.
またSn0w中の02−イオンの一部をF−イオンに置
換することにより膜中の伝導電子の濃度が増大する。Furthermore, by replacing some of the 02- ions in Sn0w with F- ions, the concentration of conduction electrons in the film increases.
(実施例)
次に本発明の酸化錫系電気伝導膜を実施例に基づき説明
する。(Example) Next, the tin oxide-based electrically conductive film of the present invention will be described based on Examples.
まず組成物中のSnの一部を2「とsbに置換した酸化
錫系電気伝導膜の場合について本発明の具体的実施例を
比較例と共に説明する。First, specific examples of the present invention will be described together with comparative examples regarding the case of a tin oxide-based electrically conductive film in which a portion of Sn in the composition is replaced with 2'' and sb.
実施例として、まず光透過性ガラス基板(コニング社製
No7059)をアセトンで洗浄し、更にメタノールで
洗浄した後、温度450℃に保持されたCVD装置の成
膜形成室内に装着した。次に原料となるZ r Cis
、5bCj!x、SnCム、N20を夫々キャリアガス
となるN2に混合し、更に表−1に示す各種組成比率と
なるように前記夫々の原料ガスを混合した後、前記CV
D装置の成膜形成室内に成膜速度が1.2人/秒となる
ように供給して、光透過性ガラス基板上に厚さ2000
人の酸化錫系電気伝導膜を形成し、これらを実施例1な
いし9とし、また厚さ2000人の酸化錫系電気伝導膜
を形成した後、液膜に更に酸素雰囲気中で温度450℃
、30分間のアニール処理を施したものを実施例10と
し、また厚さ2000人の酸化錫系電気伝導膜を形成し
た後、液膜に更に窒素ガス98%と水素ガス2%の還元
雰囲気中で温度300℃、30分間のアニール処理を施
したものを実施例11とした。As an example, a light-transmitting glass substrate (No. 7059 manufactured by Conning Corporation) was first cleaned with acetone and further cleaned with methanol, and then placed in a film formation chamber of a CVD apparatus maintained at a temperature of 450°C. Next, the raw material Z r Cis
,5bCj! The CV
The film was supplied to the film forming chamber of the D apparatus at a film forming rate of 1.2 people/second, and a film was deposited on a light-transmitting glass substrate to a thickness of 2,000 yen.
After forming a tin oxide-based electrically conductive film and forming these as Examples 1 to 9, and forming a tin oxide-based electrically conductive film with a thickness of 2000, the liquid film was further heated at a temperature of 450°C in an oxygen atmosphere.
Example 10 was annealed for 30 minutes, and after forming a tin oxide-based electrically conductive film with a thickness of 2000 mm, the liquid film was further heated in a reducing atmosphere of 98% nitrogen gas and 2% hydrogen gas. Example 11 was obtained by annealing at a temperature of 300° C. for 30 minutes.
次に比較例としてZrCj!4.5bCJj、SnCム
、N20を夫々表−1に示す比率になるように混合した
以外は前記実施例と同一方法で酸化錫系電気伝導膜を形
成し、これらを比較例1ないし6とした。Next, as a comparative example, ZrCj! 4.5b Tin oxide-based electrically conductive films were formed in the same manner as in the previous example except that CJj, SnC, and N20 were mixed in the ratios shown in Table 1, and these were used as Comparative Examples 1 to 6. .
この実施例工ないし11および比較例工ないし6の酸化
錫系電気伝導膜をケイ光X線分析装置により元素分析を
行って膜の組成比を調べ、また液膜の結晶粒径を走査型
電子顕微m(SEM)の写真撮影により調べたところ表
−1に示す結果が得られた。The tin oxide-based electrically conductive films of Examples No. 1 to 11 and Comparative Examples No. 1 to No. 6 were subjected to elemental analysis using a fluorescent X-ray analyzer to examine the composition ratio of the films, and the crystal grain size of the liquid film was measured using a scanning electron beam analyzer. When investigated by microscopic (SEM) photography, the results shown in Table 1 were obtained.
また実施例1ないし11および比較例1ないし6の各光
透過性ガラス基板上の酸化錫系電気伝導膜の表面にスク
リーン印刷法によりプチルセルゾルブを主成分とするエ
ツチングレジストを所定形状に塗布し、温度120℃で
10分間乾燥した後、これを濃度3526塩酸、濃度4
5%塩化鉄水溶液、純水の混合比率が2:1:4から成
るエツチング液中に10分間浸漬した後、十分に水洗し
て残留するエツチングレジストをアセトンで除去して、
光透過性ガラス基板(1)上に図示のような四方に切り
込みをいれた円形パターンの酸化錫系電気伝導膜(2)
から成る比抵抗測定用試料を形成し、更に形成された比
抵抗測定用試料の所定位置A、B、C,Dに夫々リード
線(3)を半田付けした。そして各比抵抗151定用試
料のAB端子間に直流電流[11を流した状態でCD端
子間の電圧[D、 (V) ]を測定した後、同様にし
て、BC端子間の直流電流[11を流した状態でAD端
子間の電圧[D2(V)]を測定し、次式、
により比抵抗[ρ(Ω・(至))コを調べたところ、表
−1に示す結果が得られた。Furthermore, an etching resist containing Butyl Celsolve as a main component was coated in a predetermined shape on the surface of the tin oxide-based electrically conductive film on each of the light-transmitting glass substrates of Examples 1 to 11 and Comparative Examples 1 to 6 by a screen printing method. After drying at 120°C for 10 minutes, this was mixed with 3526 hydrochloric acid and 4
After immersing for 10 minutes in an etching solution consisting of a 5% iron chloride aqueous solution and pure water at a mixing ratio of 2:1:4, the sample was thoroughly washed with water and the remaining etching resist was removed with acetone.
A tin oxide-based electrically conductive film (2) in a circular pattern with cuts on all sides as shown on a light-transmitting glass substrate (1).
A sample for resistivity measurement was formed, and lead wires (3) were soldered to predetermined positions A, B, C, and D of the formed sample for resistivity measurement, respectively. Then, after measuring the voltage [D, (V)] between the CD terminals with the DC current [11] flowing between the AB terminals of each resistivity 151 constant sample, the DC current [D, (V)] between the BC terminals was similarly measured. The voltage [D2 (V)] between the AD terminals was measured with 11 flowing, and the specific resistance [ρ (Ω・(to)) was investigated using the following formula, and the results shown in Table 1 were obtained. It was done.
ただし、d:膜厚、I −500μAである。However, d: film thickness, I -500 μA.
また実施fq1ないし11および比較例工ないし6の各
光透過性ガラス基板上の酸化錫系電気伝導膜に波長λ−
0,5pmの可視光を照射し、その光透過率(%)を調
べたところ、表−1に示す結果が得られた。In addition, the tin oxide-based electrically conductive film on each of the light-transmitting glass substrates of Examples FQ1 to FQ11 and Comparative Examples FQ to FQ6 was coated with a wavelength λ-
When visible light of 0.5 pm was irradiated and the light transmittance (%) was examined, the results shown in Table 1 were obtained.
次に組成物中のSnの一部をZrに置換すると共に、組
成物中のOの一部をFに置換した酸化錫系電気伝導膜の
場合について本発明の具体的実施例を比較例と共に説明
する。Next, specific examples of the present invention will be described together with comparative examples regarding the case of a tin oxide-based electrically conductive film in which a part of Sn in the composition is replaced with Zr and a part of O in the composition is replaced with F. explain.
実施例として、まず光透過性ガラス基板(コニング社製
No7059)をアセトンで洗浄し、更にメタノールで
洗浄した後、温度450℃に保持されたCVD装置の成
膜形成室内に装むした。次に原料となるZrCム、NH
2F、 SnCム、N20を夫々キャリアガスとなる
N2に混合し、更に表−2に示す各種組成比率となるよ
うに前記夫々の原料ガスを混合した後、前記CVD装置
の成膜形成室内に成膜速度が1.2人/秒となるように
供給して、光透過性ガラス基板上に厚さ2000人の酸
化錫系電気伝導膜を形成し、これらを実施例12ないし
19とし、また厚さ2000人の酸化錫系電気伝導膜を
形成した後、波膜に更に酸素雰囲気中で温度450℃、
30分間のアニール処理を施したものを実施例20とし
、また厚さ2000人の酸化錫系電気伝導膜を形成した
後、波膜に更に窒素ガス98%と水素ガス2%の還元雰
囲気中で温度300℃、30分間のアニール処理を施し
たものを実施例21とした。As an example, a light-transmitting glass substrate (No. 7059 manufactured by Conning Corporation) was first cleaned with acetone and further cleaned with methanol, and then placed in a film formation chamber of a CVD apparatus maintained at a temperature of 450°C. Next, the raw materials ZrC, NH
After mixing 2F, SnC, and N20 with N2 as a carrier gas, and further mixing the respective raw material gases so as to have various composition ratios shown in Table 2, the film was deposited in the film formation chamber of the CVD apparatus. A tin oxide-based electrically conductive film was formed on a light-transmissive glass substrate with a thickness of 2000 m/s by supplying the film at a film speed of 1.2 m/sec, and these were named Examples 12 to 19. After forming a 2,000-layer tin oxide-based electrically conductive film, the wave film was further heated at a temperature of 450°C in an oxygen atmosphere.
Example 20 was annealed for 30 minutes, and after forming a tin oxide electrically conductive film with a thickness of 2000 mm, the wave film was further treated in a reducing atmosphere of 98% nitrogen gas and 2% hydrogen gas. Example 21 was obtained by annealing at a temperature of 300° C. for 30 minutes.
次に比較例としてZrCム、NH2F 、 5nCj
!4、N20を夫々表−2に示す比率になるように混合
した以外は前記実施例と同一方法で酸化錫系電気伝導膜
を形成し、これらを比較例7ないし11とした。Next, as a comparative example, ZrC, NH2F, 5nCj
! Comparative Examples 7 to 11 were obtained by forming tin oxide-based electrically conductive films in the same manner as in the example above, except that 4 and N20 were mixed in the ratios shown in Table 2.
そしてSnの一部を2「とsbに置換した酸化錫系電気
伝導膜と同一方法でこれら実施例12ないし21および
比較例7ないし11の酸化錫系電気伝導膜の組成比、結
晶粒径、比抵抗および光透過率を調べたところ、表−2
に示す結果が得られた。Then, the composition ratio, crystal grain size, When the specific resistance and light transmittance were investigated, Table 2
The results shown are obtained.
表−1および表−2から明らかなように、本発明のSn
の一部をZrとsbに置換した実施例1ないし11の酸
化錫系電気伝導膜および、Snの一部を2「に置換する
と共に、0の一部をFに置換した実施例12ないし21
の酸化錫系電気伝導膜は光透過率が高く、また比抵抗は
小さかった。As is clear from Table-1 and Table-2, the Sn of the present invention
Examples 1 to 11 in which a part of Sn was replaced with Zr and sb, and Examples 12 to 21 in which a part of Sn was replaced with 2'' and a part of 0 was replaced with F.
The tin oxide-based electrically conductive film had high light transmittance and low specific resistance.
これに対してZrとsbの組成比が本発明の組成比の範
囲外の比較例1ないし6の酸化錫系電気伝導膜および、
2「とFの組成比が本発明の組成比の範囲外の比較例7
ないし11の酸化錫系電気伝導膜は光透過率が高かった
が比抵抗は低下せずに大きかった。これは2「の含有量
がSnの置換可能な二を超え、5n02の結晶中に部分
的にZrの偏析が生じ、伝導電子やホールキャリアの移
動が妨げられるためと考えられる。In contrast, the tin oxide-based electrically conductive films of Comparative Examples 1 to 6 in which the composition ratio of Zr and sb was outside the range of the composition ratio of the present invention,
Comparative Example 7 in which the composition ratio of 2' and F is outside the range of the composition ratio of the present invention
Although the tin oxide-based electrically conductive films of Nos. 1 to 11 had high light transmittance, the specific resistance remained large without decreasing. This is considered to be because the content of 2' exceeds the 2 which can be substituted by Sn, causing partial segregation of Zr in the crystal of 5n02, which impedes the movement of conduction electrons and hole carriers.
また表−1,2から明らかなように、Snに対するZr
の置換量が多くなるにつれて5n02の結晶粒径が大き
くなることが確認された。Furthermore, as is clear from Tables 1 and 2, Zr relative to Sn
It was confirmed that the grain size of 5n02 increases as the amount of substitution increases.
(発明の効果)
このように本発明によるときは、Sn0w中のSnの一
部をZrに置換するようにしたので、Snowの結晶粒
径を大きくすることが出来、そして更にSnの一部をs
bで置換するようにしたので、膜中の伝導電子濃度を増
加することが出来、またSn0w中のOの一部をFで置
換するようにしたので、膜中の伝導電子濃度を増加する
ことが出来るため、光透過率を損なうことなく、小さな
比抵抗が得られて、優れた電気伝導度を有する酸化錫系
電気伝導膜を提供することが出来る効果がある。(Effects of the Invention) In this way, according to the present invention, since a part of Sn in Sn0w is replaced with Zr, the crystal grain size of Snow can be increased, and furthermore, part of Sn can be replaced with Zr. s
By replacing it with b, we were able to increase the conduction electron concentration in the film, and by replacing some of the O in Sn0w with F, we were able to increase the conduction electron concentration in the film. Therefore, it is possible to obtain a small specific resistance without impairing light transmittance, and it is possible to provide a tin oxide-based electrically conductive film having excellent electrical conductivity.
図面は酸化錫系電気伝導膜の比抵抗の測定方法を示す斜
視図である。
1・・・光透過性ガラス基板
2・・・酸化錫系電気伝導膜
3・・・リード線
外 3 ″6The drawing is a perspective view showing a method for measuring the specific resistance of a tin oxide-based electrically conductive film. 1...Light-transparent glass substrate 2...Tin oxide-based electrically conductive film 3...Outside lead wire 3''6
Claims (1)
wただし 1.80<w<2.05 0.001<x<0.030 0.015<y<0.020 で表わされる組成から成ることを特徴とする酸化錫系電
気伝導膜。 2.一般式 [Sn_1_−_x・Zr_x]O_w_−_z・F_
zただし 1.80<w<2.05 0.003<x<0.030 0.015<z<0.020 で表わされる組成から成ることを特徴とする酸化錫系電
気伝導膜。[Claims] 1. General formula [Sn_1_-_x_-y・Zr_x・Sb_Y]O_
A tin oxide-based electrically conductive film characterized by having a composition as follows: w, 1.80<w<2.05, 0.001<x<0.030, 0.015<y<0.020. 2. General formula [Sn_1_-_x・Zr_x]O_w_-_z・F_
A tin oxide-based electrically conductive film characterized by having a composition as follows: z, 1.80<w<2.05, 0.003<x<0.030, 0.015<z<0.020.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28497288A JPH02155111A (en) | 1988-08-26 | 1988-11-11 | Tin oxide-based electrically conductive film |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21219788 | 1988-08-26 | ||
| JP63-212197 | 1988-08-26 | ||
| JP28497288A JPH02155111A (en) | 1988-08-26 | 1988-11-11 | Tin oxide-based electrically conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02155111A true JPH02155111A (en) | 1990-06-14 |
Family
ID=26519065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28497288A Pending JPH02155111A (en) | 1988-08-26 | 1988-11-11 | Tin oxide-based electrically conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02155111A (en) |
-
1988
- 1988-11-11 JP JP28497288A patent/JPH02155111A/en active Pending
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