JPH0216572U - - Google Patents
Info
- Publication number
- JPH0216572U JPH0216572U JP8197589U JP8197589U JPH0216572U JP H0216572 U JPH0216572 U JP H0216572U JP 8197589 U JP8197589 U JP 8197589U JP 8197589 U JP8197589 U JP 8197589U JP H0216572 U JPH0216572 U JP H0216572U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- thickness
- connecting terminal
- aluminum
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図及び第２図は従来のアルミ端子を示す説
明図、第３図は本考案のアルミ端子の一実施例を
示す説明図、第４図は実験方法を示す説明図であ
る。
１は接続端子、２は銅メツキ、３はニツケルメ
ツキ層である。
1 and 2 are explanatory diagrams showing a conventional aluminum terminal, FIG. 3 is an explanatory diagram showing an embodiment of the aluminum terminal of the present invention, and FIG. 4 is an explanatory diagram showing an experimental method. 1 is a connection terminal, 2 is a copper plating layer, and 3 is a nickel plating layer.
Claims (1)
子底面のみに厚さが０．１〜１０μのニツケルメ
ツキ層を介して厚さが５０〜６００μの銅メツキ
層を施してなることを特徴とする接続端子。 A connecting terminal comprising a connecting terminal made of aluminum or an aluminum alloy, and a copper plating layer having a thickness of 50 to 600 μm is applied only to the bottom surface of the terminal via a nickel plating layer having a thickness of 0.1 to 10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8197589U JPH0216572U (en) | 1989-07-12 | 1989-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8197589U JPH0216572U (en) | 1989-07-12 | 1989-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216572U true JPH0216572U (en) | 1990-02-02 |
Family
ID=31306743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8197589U Pending JPH0216572U (en) | 1989-07-12 | 1989-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216572U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53122790A (en) * | 1977-04-01 | 1978-10-26 | Sumitomo Electric Ind Ltd | Aluminum terminal and preparation |
| JPS5475585A (en) * | 1977-11-29 | 1979-06-16 | Sumitomo Electric Ind Ltd | Aluminium terminal |
-
1989
- 1989-07-12 JP JP8197589U patent/JPH0216572U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53122790A (en) * | 1977-04-01 | 1978-10-26 | Sumitomo Electric Ind Ltd | Aluminum terminal and preparation |
| JPS5475585A (en) * | 1977-11-29 | 1979-06-16 | Sumitomo Electric Ind Ltd | Aluminium terminal |
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