JPH02167659A - Surface polishing device and manufacture of polishing work having aligned abrasive trace direction - Google Patents
Surface polishing device and manufacture of polishing work having aligned abrasive trace directionInfo
- Publication number
- JPH02167659A JPH02167659A JP63321699A JP32169988A JPH02167659A JP H02167659 A JPH02167659 A JP H02167659A JP 63321699 A JP63321699 A JP 63321699A JP 32169988 A JP32169988 A JP 32169988A JP H02167659 A JPH02167659 A JP H02167659A
- Authority
- JP
- Japan
- Prior art keywords
- polished
- polishing
- rotation
- holder
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、磁気ディスク用アルミニウム基板その他の
被研磨物の研磨加工に用いる平面研磨装置及び研磨跡の
方向の揃った研磨加工品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a flat surface polishing apparatus used for polishing an aluminum substrate for a magnetic disk or other objects to be polished, and a method for manufacturing a polished product with polished marks aligned in the same direction.
従来の技術
この種の平面研磨装置の1つとして、回転可能に設けら
れた1対の砥石と、これら砥石の間で自転しながら公転
可能に設けられた被研磨物保持器とを備え、該保持器を
自転、公転させつつ被研磨物に圧接した前記砥石を回転
させて被研磨物の研磨加工を行うものとなされている平
面研磨装置が知られている。このような研磨装置によれ
ば、被研磨物保持器自体が自転、公転しているため被研
磨物を砥石の研磨面全体でまんべんなく研磨でき、砥石
の片減りを防虫できるとともに加工精度の良好な研磨面
を得ることができる。2. Description of the Related Art One type of surface polishing apparatus of this type is equipped with a pair of grinding wheels that are rotatably provided, and a holder for an object to be polished that is able to rotate and revolve between these grinding stones. 2. Description of the Related Art A surface polishing apparatus is known that polishes an object by rotating a grindstone pressed against the object while rotating and revolving a cage. According to such a polishing device, since the workpiece holder itself rotates and revolves, the workpiece can be polished evenly over the entire polishing surface of the grindstone, preventing insects from wearing the whetstone unevenly, and achieving high processing accuracy. A polished surface can be obtained.
発明が解決しようとする課題
ところが上記の平面研磨装置において、従来では、砥石
の回転停止と被研磨物保持器の回転停止が常に同時に行
われるものであったため、次のような欠点があった。Problems to be Solved by the Invention However, in the above-mentioned surface polishing apparatus, conventionally, the rotation of the grindstone and the rotation of the workpiece holder were always stopped at the same time, resulting in the following drawbacks.
即ち、被研磨物保持器自体の自転・公転により、披研磨
物の研磨方向は加工中常時変化しているが、保F′4′
I器の回転停止と同時に砥石も停止するため、研磨終了
に至るまでの彼V[磨物の研磨跡の方向が一定に揃わな
いことか多い。このため、例えば磁気ディスク用AQ基
板のように研磨跡を一定方向に揃えることが製品品質と
して要求されるものを、この研磨装置で歩留り良く製作
することは困難であるという欠点があった。That is, due to the rotation and revolution of the polishing object holder itself, the polishing direction of the object to be polished changes constantly during processing, but the
Because the whetstone stops at the same time as the rotation of the grinder stops, the direction of the polishing marks on the polished object is often not aligned until the polishing is finished. For this reason, there has been a drawback in that it is difficult to use this polishing apparatus to produce with a high yield a product quality that requires the polishing marks to be aligned in a certain direction, such as AQ substrates for magnetic disks.
この発明はかかる技術的背景に鑑みてなされたものであ
って、研磨跡の方向を一定に揃えることのできる平面研
磨装置の提供を目的とし、さらには研磨跡の方向の揃っ
た研磨加工品の製造方法の提供を目的とするものである
。The present invention has been made in view of the above technical background, and aims to provide a flat surface polishing device that can uniformly align the direction of polishing marks, and furthermore, it aims to provide a flat surface polishing device that can uniformly align the direction of polishing marks, and furthermore, it aims to provide a flat surface polishing device that can uniformly align the direction of polishing marks, and furthermore, it aims to provide a flat surface polishing device that can uniformly align the direction of polishing marks. The purpose is to provide a manufacturing method.
課題を解決するたための手段
上記目的において、この発明は、図面の符号を参照して
示すと、回転可能に設けられた1χ1の砥石(3)(4
)と、これら砥石の間で自転しながら公転可能に設けら
れた被研磨物保持器(7)とを備え、該保持器を自転、
公転させつつ披研磨物(B)に圧接した前記砥石(3)
(4)を回転させて披研磨物の研磨を行うものとなされ
ている平面研磨装置において、前記被研磨物保持器(7
)の回転停止特産より後に所定のタイムラグを置いて前
記砥石(3)(4)の回転を停止する機構が設けられて
いることを特徴とするものである。さらにはまた、回転
rJ能に設けられた1対の砥石(3)(4)の間で、被
研磨物保持器(7)を自転させつつ公転させるとともに
、披研磨物(B)に圧接した前記砥石(3)(4)を回
転させて披研磨物(B)の研磨を行う研磨加工品の製造
方法において、前記被研磨物保持器(7)の回転をまず
停止したのち、所定のタイムラグを置いて前記砥石(3
)(4)の回転を停止することを特徴とするものである
。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides rotatably provided grindstones (3) (4
) and a polished object holder (7) that is provided to be able to revolve while rotating between these grindstones,
The whetstone (3) is brought into pressure contact with the workpiece (B) while rotating.
In the surface polishing apparatus which polishes the workpiece by rotating the workpiece holder (7), the workpiece holder (7
) is characterized in that it is provided with a mechanism for stopping the rotation of the grindstones (3) and (4) after a predetermined time lag after the rotation stop special feature. Furthermore, between a pair of grindstones (3) and (4) provided in the rotating rJ function, the workpiece holder (7) is rotated and revolved, and is pressed against the workpiece to be polished (B). In the method for manufacturing a polished product in which the grindstone (3) (4) is rotated to polish the workpiece (B), the rotation of the workpiece holder (7) is first stopped, and then a predetermined time lag is performed. and then turn the whetstone (3
) (4) is characterized by stopping the rotation.
ここに、砥石(3)(4)は−膜内には第1図及び第2
図に示すように、1対の回転対向定盤(1)(2)の内
面に取着されることにより、回転可能に支持されるもの
となされる。また、被研磨物保持器(7)を自転・公転
可能となすための最も一般的な構成としては、該保持器
(7)を、砥石(3)(4)の回転中心に配した太陽歯
車(5)とこの太陽歯車(5)の同心外方に配した内歯
歯車(6)のいずれにもその外周面を噛合された状態に
配置し、これら太陽歯車(5)と内歯歯車(6)を回転
するようにしたものを挙げうる。また、砥石即ち定盤(
1)(2)や遊星歯車(5)、内歯歯車(6)の回転駆
動はモーター(11)〜(13)により行われ、これら
モーターの駆動はタイマー(21) (22)により
行われるのが一般的である。従って、被研磨物保持器(
7)の自転・公転の停止時点よりも後に所定のタイムラ
グを置いて砥石(3)(4)の回転を停止する機構はタ
イマー(21)(22)に組込むのが良い。Here, the grinding wheels (3) and (4) are
As shown in the figure, it is rotatably supported by being attached to the inner surfaces of a pair of rotating opposing surface plates (1) and (2). In addition, the most common configuration for making the holder (7) for the workpiece to be polished capable of rotation and revolution is that the holder (7) is mounted on a sun gear arranged at the center of rotation of the grinding wheels (3) and (4). (5) and an internal gear (6) arranged concentrically outward of the sun gear (5), the outer peripheral surfaces of which are meshed with both the sun gear (5) and the internal gear (6). 6) can be rotated. In addition, a grindstone or surface plate (
1) The rotation of (2), the planetary gear (5), and the internal gear (6) are driven by motors (11) to (13), and these motors are driven by timers (21) and (22). is common. Therefore, the workpiece holder (
7) A mechanism for stopping the rotation of the grindstones (3) and (4) after a predetermined time lag after the point in time when the rotation and revolution stop is preferably incorporated into the timer (21) and (22).
作用
披研磨物(B)を保持器(7)にセットしたのち定盤(
1)(2)を接近させて所定の加圧力で砥石(3)(4
)を披研磨物(B)に圧接させる。次いで、太陽歯車(
5)、内歯歯車(6)、定盤(1)(2)を回転駆動す
る第1〜第3モーター(11)〜(13)の作動を制御
する第1、第2タイマー(21) (22)が同時に
ONとなる。これにより、第3図に示すように、太陽歯
車(5)、内歯歯車(6)、定盤(1)(2)は回転を
開始したのち速度か徐々に上昇する。太陽歯車(5)と
内歯歯車(6)の回転により、被研磨物保持器(7)は
砥石のlL!1転中心に対して自転しつつ公転をはじめ
る。速度上昇後、太陽歯車(5)、内歯歯車(6)、定
盤(1)(2)は各定速度回転(Nl)(N2)(N3
) (N4 )となり、砥石(3)(4)の作用で
被研磨物(B)の研磨加工が遂行される。After setting the workpiece (B) on the holder (7), place it on the surface plate (
1) Bring the (2) closer together and apply a predetermined pressure to the grindstones (3) and (4).
) is pressed against the polished object (B). Next, the sun gear (
5), first and second timers (21) that control the operation of the first to third motors (11) to (13) that rotationally drive the internal gear (6) and the surface plates (1) and (2). 22) are turned ON at the same time. As a result, as shown in FIG. 3, the sun gear (5), internal gear (6), and surface plates (1, 2) start rotating and then gradually increase in speed. By the rotation of the sun gear (5) and the internal gear (6), the workpiece holder (7) is moved to the lL of the grinding wheel! It begins to revolve while rotating around the center of rotation. After the speed increases, the sun gear (5), internal gear (6), and surface plate (1) (2) rotate at constant speeds (Nl) (N2) (N3).
) (N4), and the object to be polished (B) is polished by the action of the grindstones (3) and (4).
一定i時間(T2)経過後まず第2タイマー(22)が
OFFとなる。これにより第2、第3モーター(12)
(13)がOFFになるが太陽歯車(5)と内歯歯
車(6)は慣性力で回転しつつ徐々に減速しやがて停止
する。第2タイマー(22)のOFF後(T1−T2
)のタイムラグを置いて第1タイマー(2I)がOFF
になる。これにより第1モーター(l()がOFFにな
るが定盤(1)(2)は徐々に減速しつつち慣性力で回
転しており、この間に、既に停止した保持器(7)の被
研磨物(B)が研磨されることになる。このように研磨
加工の終了間際に、保持器(7)が停止した状態で砥石
(3)(4)のみ回転して加工が遂行される期間が生し
るから、被研磨物(B)の研磨方向が一定方向となり、
fL+られる研磨加工品の研磨跡も一定方向に崩うこと
となる。After a certain period of time (T2) has elapsed, the second timer (22) is first turned off. This allows the second and third motors (12)
(13) is turned off, but the sun gear (5) and internal gear (6) rotate due to inertia and gradually decelerate and eventually stop. After the second timer (22) turns off (T1-T2
), the first timer (2I) turns off after a time lag.
become. As a result, the first motor (l()) is turned off, but the surface plates (1) and (2) are rotating due to inertia while gradually decelerating, and during this time, the cage (7), which has already stopped, is covered. The object to be polished (B) will be polished.In this way, near the end of the polishing process, there will be a period in which only the grinding wheels (3) and (4) are rotated while the holder (7) is stopped and the process is carried out. occurs, so the polishing direction of the object to be polished (B) is constant,
The polishing marks on the polished product subjected to fL+ will also collapse in a certain direction.
実施例
次にこの発明の構成を第1図〜第3図に示す実施例に基
いて説明する。Embodiment Next, the structure of the present invention will be explained based on the embodiment shown in FIGS. 1 to 3.
第1図及び第2図において、(A)は平面研磨装置であ
り、該装置は上下一対の対向定盤(1)(2)と、各定
盤の内面に取着された上下砥石(3)(4)と、各砥石
(3)(4)の間において砥石の軸心に配置された太陽
歯車(5)と、該太陽歯車(5)の同心外方に配置され
た内歯歯車(6)と、前記太陽歯車(5)と内歯歯車(
6)のいずれにも外周面を噛合された状態に配置された
1または2以上の薄板・14歯車状の被研磨物保持器(
7)とを備えている。In FIGS. 1 and 2, (A) is a surface polishing device, which includes a pair of upper and lower opposed surface plates (1) and (2), and upper and lower grindstones (3) attached to the inner surface of each surface plate. ) (4), a sun gear (5) arranged at the axis of the grinding wheels between each grinding wheel (3) (4), and an internal gear ( 6), the sun gear (5) and the internal gear (
6) One or more thin plate/14 gear-shaped object holders (
7).
また、各保持器(7)には複数の孔が形成されており、
この孔に保持器よりも厚内の円板状被研磨物(B)か嵌
め込み状態に保持されるものとなされている。さらに、
上下定盤(1)(2)は駆動9dl (la) (2
a)及びスプロケット(lb)(2b)を介して第1モ
ーター(11)に接続され、該モーター(11)の駆動
により回転するものとなされている。なお、上側定盤(
1)はシリンダー(図示せず)により昇降自在に支持さ
れ、第1図に示す下降位置において駆動軸(la)の上
端の係合部(la’)に係合して、下側定盤(2)と逆
方向の回転力を付与されるものとなされている。一方、
太陽歯車(5)は駆動軸(5a)及びスプロケット(5
b)を介して第2モーター(12)に、また内歯歯車(
6)は駆動軸(6a)及びスプロケット(6b)を介し
て第3モーター(13)にそれぞれ接続されており、こ
れらモーター(12) (13)の駆動によりそれぞ
れゲ(なる回転数で回転し、これにより保t!i器(7
)を遊星歯車状に自転させつつ公転させうるちのとなさ
れている。また、前記第1モーター(11)の作動は第
1タイマー(21)によって制御され、この第1タイマ
ーはON後T1時間経過したときにOFFするように設
定されている。一方、第2、第3各モーター(12)
(13)の作動は第2タイマー(22)によって制御
され、この第2タイマー(22)はONN後2時間経過
したときにOFFするものとなされている。而して、第
1タイマー(21)の作動時間T1は第2タイマー (
22)の作動時間T2よりも長く設定されている。これ
により、太陽歯車(5)及び内歯歯車(6)の回転が停
止したのち、はぼ(T1−T2)時間のタイムラグを置
いて上下定盤(1)(2)の回転が停止するものとなさ
れている。Furthermore, each retainer (7) is formed with a plurality of holes,
A disk-shaped object to be polished (B) having a thickness smaller than that of the retainer is fitted into this hole and held therein. moreover,
The upper and lower surface plates (1) and (2) are driven by 9dl (la) (2
It is connected to a first motor (11) via a) and sprockets (lb) and (2b), and is rotated by the drive of the motor (11). Note that the upper surface plate (
1) is supported by a cylinder (not shown) so as to be able to rise and fall freely, and in the lowered position shown in FIG. 2) is applied with a rotational force in the opposite direction. on the other hand,
The sun gear (5) has a drive shaft (5a) and a sprocket (5).
b) to the second motor (12) and also to the internal gear (
6) is connected to a third motor (13) via a drive shaft (6a) and a sprocket (6b), and rotates at a rotation speed of This keeps the t!i device (7
) is made to rotate and revolve like a planetary gear. Further, the operation of the first motor (11) is controlled by a first timer (21), and the first timer is set to be turned off when T1 time has elapsed after being turned on. On the other hand, the second and third motors (12)
The operation of (13) is controlled by a second timer (22), and this second timer (22) is set to turn off when two hours have elapsed after turning on. Therefore, the operating time T1 of the first timer (21) is the same as that of the second timer (
22) is set longer than the operating time T2. As a result, after the sun gear (5) and internal gear (6) stop rotating, the upper and lower surface plates (1) and (2) stop rotating after a time lag of time (T1-T2). It is said that
ここに、(T1−T2 )の好ましい値としては、1〜
10秒程度に設定するのが良い。なお、上下定盤(1)
(2)、太陽歯車(5)、内歯歯車(6)の回転数は、
被研磨物(B)の両面を等しく加工できるように予め清
明する比率に設定されている。Here, the preferable value of (T1-T2) is 1 to
It is best to set it to about 10 seconds. In addition, the upper and lower surface plates (1)
(2), the rotation speed of the sun gear (5) and internal gear (6) is
The ratio is set in advance to clarify so that both sides of the object to be polished (B) can be processed equally.
次に図示した平面研磨装置の動作を、第3図の動作特性
図を参照しつつ説明する。Next, the operation of the illustrated surface polishing apparatus will be explained with reference to the operational characteristic diagram of FIG.
まず、被研磨物(B)を被研磨物保持器(7)にセット
したのち、上下定盤(1)(2)を接近させて砥石(3
)(4)を所定の加圧力で被研磨物(B)に圧接させる
。続いて第1タイマー (21) 、第2タイマー(2
2)が同時にONになる。すると第1〜第3各モーター
(11) (12)(13)が駆動され、これにより
上下定盤(1)(2)、太陽歯車(5)、内歯歯車(6
)は回転を開始したのち第3図に示すように速度が徐々
に上昇する。一方、太陽歯車(5)と内歯歯車(6)の
回転により被研磨物保持器(7)は上下砥石(3)(4
)の回転中心のまわりを自転しつつ公転をはじめる。速
度上昇後、太陽歯車(5)、内歯歯車(6)、定盤(1
)(2)は各定速度回転(N1)(N2)(N3)(N
4)となる。第1、第2タイマーのON後H1p間T2
が経過したときにまず第2タイマー(22)がOFFと
なる。これにより第2、第3モーター (12) (
13)はOFFになるが、太陽歯車(5)と内歯歯車(
6)は慣性力で回転しつつ徐々に減速しやがて停止する
。第2タイマー(22)のOFFFFイタイムラグ1−
T2 )を置いて今度は第1タイマー(21)がOFF
になる。これにより第1モーター(11)がOFFにな
るが上下定盤(1)(2)は徐々に減速しつつも慣性力
で回転しており、この間に、停止した保持器の彼研磨物
(B)は引続き研磨加工を受ける。この被研磨物保持器
(7)の停止後の加工により彼研磨物(B)の研磨方向
が一定となり、得られた研磨加工品の研磨跡が一定方向
に揃うこととなる。なお、比較のために第4国に従来の
太陽歯車(5)、内歯歯車(6)、上下定盤(1)(2
)の動作特性を示す。First, the object to be polished (B) is set in the object holder (7), and then the upper and lower surface plates (1) and (2) are brought close together to bring the grinding wheel (3) closer to each other.
) (4) is pressed against the object to be polished (B) with a predetermined pressure. Next, the first timer (21) and the second timer (2
2) is turned ON at the same time. Then, the first to third motors (11), (12), and (13) are driven, which drives the upper and lower surface plates (1) and (2), the sun gear (5), and the internal gear (6).
) starts rotating, and then the speed gradually increases as shown in FIG. On the other hand, due to the rotation of the sun gear (5) and the internal gear (6), the workpiece holder (7) is moved between the upper and lower grinding wheels (3) (4).
) begins to revolve while rotating around the center of rotation. After the speed increases, the sun gear (5), internal gear (6), and surface plate (1
)(2) is each constant speed rotation (N1)(N2)(N3)(N
4). T2 between H1p after turning on the first and second timers
When the time period elapses, the second timer (22) is first turned off. This allows the second and third motors (12) (
13) is turned off, but the sun gear (5) and internal gear (
6) rotates due to inertia, gradually decelerates, and eventually stops. OFF time lag 1- of the second timer (22)
T2 ) is placed and the first timer (21) is turned off.
become. As a result, the first motor (11) is turned off, but the upper and lower surface plates (1) and (2) continue to rotate due to inertia while gradually decelerating. ) will continue to be polished. By this processing after the polishing object holder (7) is stopped, the polishing direction of the polishing object (B) becomes constant, and the polishing marks of the obtained polished product are aligned in a constant direction. For comparison, the conventional sun gear (5), internal gear (6), and upper and lower surface plates (1) (2) were manufactured in a fourth country.
).
発明の効果
この発明は、上述の次第で、被研磨物保持器の回転停止
時点より後に所定のタイムラフを置いて砥石の回転を停
止するしのであるから、研磨加工の終了間際に保持器が
停止した状態で砥石のみ回転して加工が遂行される期間
が生しることになる。従って、加工終了後の研磨加工品
の研磨跡を一定方向に揃えることができ、磁気ディスク
用AΩ基板等のように研磨跡を揃えることが製品品質と
して要求される部材を確実に歩留り良く製作堤供できる
。Effects of the Invention As described above, this invention stops the rotation of the grindstone after a predetermined time rough after the rotation of the workpiece holder stops, so that the holder stops just before the end of the polishing process. There will be a period in which only the grindstone rotates and machining is performed in this state. Therefore, it is possible to align the polishing marks on the polished product after finishing the process in a certain direction, and it is possible to reliably produce parts with a high yield, such as AΩ substrates for magnetic disks, which require uniform polishing marks as a product quality. I can provide it.
第1図は平面研磨装置の一部断面図、第2図は要部斜視
図、第3図は動作特性図、第4図は従来の動作特性図で
ある。
(A)・・・平面研磨装置、(B) ・・披研磨物、
(1)・・・主測定盤、(2)・・・下側定盤、(3)
・・・上側砥石、(4)・・・下側砥石、(5)・・太
陽歯車、(6)・・・内歯歯車、(7)・・・被研磨物
保持器。
以上
回 ぷ 増 セFIG. 1 is a partial cross-sectional view of a flat surface polishing apparatus, FIG. 2 is a perspective view of a main part, FIG. 3 is an operating characteristic diagram, and FIG. 4 is a conventional operating characteristic diagram. (A) ... Surface polishing device, (B) ... Polished object,
(1) Main measuring board, (2) Lower surface plate, (3)
... Upper grindstone, (4) ... Lower grindstone, (5) ... Sun gear, (6) ... Internal gear, (7) ... To-be-polished object holder. More than 100 times
Claims (2)
の間で自転しながら公転可能に設けられた被研磨物保持
器とを備え、該保持器を自転、公転させつつ被研磨物に
圧接した前記砥石を回転させて被研磨物の研磨を行うも
のとなされている平面研磨装置において、前記被研磨物
保持器の回転停止時点より後に所定のタイムラグを置い
て前記砥石の回転を停止する機構が設けられていること
を特徴とする平面研磨装置。(1) Equipped with a pair of grinding wheels that are rotatably provided, and a holder for the workpiece that is provided so that it can rotate and revolve between these grindstones, and that allows the holder to rotate and revolve while the workpiece is being polished. In a surface polishing apparatus configured to polish an object to be polished by rotating the grindstone that is in pressure contact with the object, the rotation of the grindstone is stopped after a predetermined time lag after the rotation of the object holder is stopped. A flat surface polishing device characterized by being provided with a mechanism for polishing.
保持器を自転させつつ公転させるとともに、被研磨物に
圧接した前記砥石を回転させて被研磨物の研磨を行う研
磨加工品の製造方法において、前記被研磨物保持器の回
転をまず停止したのち、所定のタイムラグを置いて前記
砥石の回転を停止することを特徴とする研磨跡の方向の
揃った研磨加工品の製造方法。(2) A polishing process in which the workpiece holder is rotated and revolved between a pair of rotatably provided grindstones, and the grindstone pressed against the workpiece is rotated to polish the workpiece. The method for manufacturing a polished product with polished marks in the same direction is characterized in that the rotation of the object holder is first stopped, and then the rotation of the grindstone is stopped after a predetermined time lag. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321699A JP2659235B2 (en) | 1988-12-19 | 1988-12-19 | Planar polishing apparatus and method for producing polished product with uniform polishing marks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321699A JP2659235B2 (en) | 1988-12-19 | 1988-12-19 | Planar polishing apparatus and method for producing polished product with uniform polishing marks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02167659A true JPH02167659A (en) | 1990-06-28 |
| JP2659235B2 JP2659235B2 (en) | 1997-09-30 |
Family
ID=18135436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63321699A Expired - Lifetime JP2659235B2 (en) | 1988-12-19 | 1988-12-19 | Planar polishing apparatus and method for producing polished product with uniform polishing marks |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2659235B2 (en) |
-
1988
- 1988-12-19 JP JP63321699A patent/JP2659235B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2659235B2 (en) | 1997-09-30 |
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