JPH02167724A - Method for high frequency stitching of conductive sheet material - Google Patents

Abstract

PURPOSE:To perform high frequency stitching without generating a spark and forming discontinuity and to enhance utility value by abutting two end parts of a conductive sheet so as to position the same on the same side and forming a bonding layer composed of an insulating polymer to a bonding part and applying high frequency thereto to integrate both of them. CONSTITUTION:One or more conductive sheet having at least one conductive surface layer having surface resistivity of 10<9>OMEGA-cm or less is stitched so that the conductive surface thereof continues. At this time, two end parts to be stitched of the conductive sheet are abutted or superposed so that the conductive surface layer thereof is positioned on the same side. A bonding layer composed of a high dielectric loss insulating polymer material is formed to the part to be bonded of said surface layer and high frequency is applied to the part to be bonded through the bonding layer to integrally stitch the end parts of the conductive sheet and the bonding layer. A high frequency stitching method for a conductive sheet material contains operation forming a conductive coating layer composed of a conductive polymer material and having surface resistivity of 10<9>OMEGA-cm or less on the bonding layer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for high-frequency stitching of conductive sheet materials. More particularly, the present invention relates to a method for high frequency sewing conductive sheet materials without generating sparks and optionally without discontinuing their conductivity.

[Conventional technology]

A base layer of an insulating polymer material with high dielectric loss, such as a sheet material made of polyvinyl chloride material, or a woven, knitted or nonwoven fabric made of fiber material, and a surface made of an insulating polymer material with high dielectric loss on top of the base layer. To suture and connect waterproof sheet materials in which layers are formed, there are known methods such as a suture suture method using a sewing machine and sewing thread, and a hot air heat fusion suture method using Leister. High-frequency heating suturing methods that utilize dielectric loss properties (dielectric heat generation properties) are widely used.

On the other hand, it is difficult to perform heat fusion suturing using high-frequency irradiation on sheet materials whose surface layer is made of a polymer material with low dielectric loss, such as PET. In order to
As described in No. 613 or Japanese Utility Model Publication No. 60-28606, it is known to form a coating layer made of a high-frequency dielectric heating substance or a synthetic resin with a large dielectric loss on the surface of a PET layer. However, sheet materials whose surface layer is made of a material with high conductivity, for example, a surface resistance of 10'Ω-cm or less, even if the matrix is made of an insulating polymer with high dielectric loss, ,
It was believed that applying a high frequency suturing process to it would create sparks and thus make suturing impossible.

For this reason, conventional 1. High-frequency stitching has not been used to stitch sheet materials having highly conductive surface layers, and suture stitching or heated stitching using hot air has generally been used.

[Problem to be solved by the invention]

The present invention overcomes the above-mentioned problems of sheet materials with highly conductive surface layers, and furthermore, without the generation of sparks and without the formation of discontinuities with respect to the high conductivity of the surface, as desired. The present invention aims to provide a method for performing high-frequency suturing.

[Means to solve the problem]

The high-frequency suturing method of conductive sheet material of the present invention is based on
When sewing one or more conductive sheets having a conductive surface layer of at least IN and having a surface resistance of Ω-0 or less so that their conductive surfaces are continuous with each other, two of the conductive sheets to be sewn are The ends are butted or overlapped so that their conductive surfaces are located on the same side, and a bonding layer made of an insulating polymer material with high dielectric loss is formed on the bonded portion, and a bonding layer is formed through the bonding layer. The method is characterized in that a high frequency is applied to the bonded portion to stitch together the end portion of the conductive sheet and the bonding layer.

Furthermore, the high-frequency suturing method for conductive sheet material of the present invention includes:
If necessary, the method further includes forming an electrically conductive coating layer made of an electrically conductive polymer material and having a surface resistance of 10<9 >Ω-cm or less on the bonding layer.

The conductive sheet to which the method of the present invention can be applied is made of a conductive polymer material, and has a resistance of 10 9 Ω-cm or less,
Preferably, it has at least one conductive surface layer having a surface resistance of 10 5 to 10′ Ω-cm. Of course, the surface resistance of the surface layer may be 10' to 10' Ω-cm or less.

Such conductive sheets are widely useful as antistatic sheets, electromagnetic shielding sheets, etc., and the conductive surface layer may be formed over the entire sheet or partially. may be formed.

The conductive sheet may be formed only of the conductive surface layer, or may consist of a conductive surface layer and at least an IN conductive or non-conductive base layer, or a backing layer laminated thereon. It may be. This base layer may be formed from an electrically conductive or non-conductive fibrous fabric.

The conductive surface layer of the conductive sheet includes a matrix made of a flexible polymer with high dielectric loss, and at least one type of material dispersed in the matrix and in close proximity to or in contact with each other to form a conductive system. The conductive material may be either an attached film layer or a coating layer formed from a paint. That is, the conductive surface layer contains as a matrix a flexible polymer with high dielectric loss that can be melted by high frequency heating. Such high dielectric loss flexible polymers generally include flexible polyvinyl chloride resins, ethylene-vinyl acetate copolymer resins,
Known examples include ethylene-vinyl chloride-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate copolymer resin, vinylidene chloride resin, nylon 6, nylon 66, and nylon 12.

The conductive material contained in the conductive surface layer is, for example, amorphous metal material, non-amorphous metal material, powder, spherical body, fibrous body, flake body made of conductive non-metallic inorganic material, and conductive organic material. Selected from etc. The amount of conductive material contained in the conductive surface layer can be arbitrarily set depending on its type, shape, required degree of conductivity, etc., but is generally 0.01 to 70% (by weight). , preferably from 8l to 50% by weight.

As mentioned above, the amorphous metal material dispersed and contained in the matrix of the conductive surface layer may be in the form of spheres, granules, flakes, fibers, etc., and there are no particular restrictions on the size. No, but generally 0.1 to 5 m
It is preferable to have a diameter of about m. The content of amorphous metal powder in the base material is not particularly limited as long as the purpose of the present invention is achieved, but it is generally preferably 0.01 to 70% by weight, and 0.1 to 50% by weight. More preferably it is % by weight.

The amorphous metal used in the present invention is generally selected from amorphous alloys obtained by adding one or more selected from boron, silicon, carbon, nickel, cobalt, molybdenum, etc. to iron as a main component. It is preferable that For example, Allied's product name METGLA
S No, 2602SC (Fe: 81%, B:
13.5%, St: 3.5%, C: 2% amorphous alloy), Na2605 S-2 (Fe: 78%
, B: 13%, St: 9% amorphous alloy), Nα
2605-CO (Fe: 87 parts, B: 14 parts, 5il1
parts, co=18 parts of amorphous alloy), Nα282
6-MB (Fe: 40%, Ni: 38%, Mo: 4%,
B: 1B% amorphous alloy), etc. can be used.

In addition to the above-mentioned alloys containing iron as a main component, alloys containing cobalt as a main component (for example, Co, Zrl, etc.) are also available.

CotaSi+oB+z+ C05hCrtbC+m
1CoaaFjOzbCto+Co3aCrisMoz
aC+ s), alloy system mainly composed of nickel (for example, N1qoZr+o+ N1tsSi+oB+z+N15
aCr zaMozac+ s), and other metal-based alloy systems (e.g. pds.S1□., C
u,. Zrz. .

Nb5oNjso+Ti5oCuso) etc. can also be used.

The amorphous metal powder used in the present invention may have a plating layer made of a conductive metal formed on at least a portion of its outer peripheral surface.

The conductive metal used for forming the plating layer is, for example,
copper, nickel, cobalt, iron, aluminum, gold, silver,
It can be selected from tin, zinc, and alloys of two or more of these.

Non-amorphous metal materials used in the present invention include, for example, copper, nickel, cobalt, iron, aluminum, gold, silver, tin, zinc, and compounds containing at least one of these, and alloys such as stainless steel, brass, You can choose from bronze, nickel silver, etc., and these are spherical bodies,
It may be a granular material, a flake material, a fibrous material, etc., and its size is preferably about 0.1 to 5 mm, and its content in the base material also varies depending on the content in the base material. It is preferable to set the total content of additives within a range of 0.01 to 70%.

Further, the amorphous metal and non-amorphous metal used in the present invention may be in the form of a film or a sheet, and may form - layers.

The non-metal conductive inorganic material used in the present invention can be selected from carbon black, graphite, carbon fiber, etc., and its size and content can be set similarly to those of the non-amorphous metal material.

The conductive organic material used in the present invention can be selected from, for example, a conductive plasticizer or a conductive polymer material.

The conductive plasticizer is, for example, a polycarboxylic acid ester compound of 7-N and poly-alkylene glycol monoalkyl ether, and is represented by the following general formula (1).
, (If) and (■):Z (Coo(A
sO)IRs) nz (III) (However, in the above formula, X is selected from aliphatic, alicyclic and aromatic polybasic acid residues with and without substituents having 2 to 8 carbon atoms. Y represents a member selected from epoxidized cyclohexane rings with and without substituents, and Z represents aliphatic, alicyclic and aromatic rings having 2 to 22 carbon atoms. Represents a member selected from polybasic carboxylic acid residues, A+, Am, A3, A4 and A,
each independently represents a member selected from alkylene groups having 2 to 4 carbon atoms, R,, R2, R3, R.

and R5 each independently represent a member selected from straight chain and branched chain alkyl groups having 1 to 15 carbon atoms, provided that the number of carbon atoms in A, and Rl, A2 and R2, and A, and R1 The total of N is 5 to 17, m,, mt,
m and m4 each independently represent an integer of 1 to 7, n represents an integer of 1 to 5, R2 represents 1 or an integer of 3 to 6, and l is an integer of 1 to 7. represents R
When 2 is 3 to 6, l and R2 in the n2 C00(^5o)fRs groups may be different from each other or may be the same. ) can be selected from a group of compounds represented by

The mono- and poly-alkylene glycol monoalkyl ethers used in the production of the above-mentioned conductive ester compound include propatool and 1 to 7 moles of ethylene oxide, 1 to 4 moles of propylene oxide, or 1 to 4 moles of butylene oxide.
Addition compound with 3 mol: butanol and 1-6 mol of ethylene oxide, 911-4 mol of propylene oxide or 1-3 mol of butylene oxide: Addition compound of hexanol with 1-5 mol of ethylene oxide, 1 mol of propylene oxide
-3 mol or addition compound with 1-2 mol of butylene oxide: heptanol with 1-5 mol of ethylene oxide, 1-3 mol of propylene oxide or 1-2 mol of butylene oxide
Addition compound with octanol and 1 to 4 mol of ethylene oxide, 1 to 3 mol of propylene oxide or 1 to 2 mol of butylene oxide: Addition compound of nonanol with 1 to 4 mol of ethylene oxide, 1 to 2 mol of propylene oxide
mol or addition compound with 1 to 2 mol of butylene oxide:
Addition compounds of decanol with 1 to 3 moles of ethylene oxide, 1 to 2 moles of propylene oxide, or 1 mole of butylene oxide.Addition compounds of nidodecanol with 1 to 2 moles of ethylene oxide, 1 mole of propylene oxide, or 1 mole of butylene oxide.Nitridecanol and ethylene oxide. -2 mol, addition compound with 1 mol of propylene oxide or 1 mol of butylene oxide; addition compound with tetradecanol and 1 mol of ethylene oxide, 1 mol of propylene oxide; and addition compound with pentadecanol and 1 mol of ethylene oxide, etc. I can give an example.

In addition, examples of the dicarboxylic acid used in the production of the conductive ester compound of the formula (2) include adipic acid, azelaic acid, sebacic acid, succinic acid, brassylic acid, tetrahydrophthalic acid, and phthalic acid.

In addition, the carboxylic acids used in the production of the conductive ester compounds of formulas (II) and (I It is an acid. These carboxylic acids may have a substituent containing a lower alkyl group such as a methyl group or an ethyl group, a hydroxyl group, or a heteroatom such as oxygen, silicon, or halogen.

As the monocarboxylic acid, an aliphatic monocarboxylic acid having 2 to 22 carbon atoms can be used. Furthermore, the polybasic acid is an aliphatic, alicyclic, or aromatic polybasic acid consisting of a carboxylic acid residue having 3 to 8 carbon atoms, and specifically, citric acid,
Aliphatic polycarboxylic acids such as aconitic acid, butanetricarboxylic acid, butanetetracarboxylic acid, alicyclic carboxylic acids such as epoxyhexahydrophthalic acid, trimellitic acid,
Aromatic polycarboxylic acids such as pyromellitic acid, acid anhydrides of these carboxylic acids, and the like can be used. These carboxylic acids may be used alone or as a mixture of two or more.

In the present invention, when the conductive plasticizer as described above is mixed into the matrix, the conductive plasticizer has chemical and physical properties similar to those of the fishing plasticizer. Depending on the amount of this conductive plasticizer added, the amount of other plasticizers added can be reduced as appropriate.

Conductive organic materials include conductive polymers such as π-electron conjugated polymer materials such as polyacetylene and polyphenylene, metal coordination polymer materials such as metal phthalocyanine, tetrathiofulvalene and tetracyanoxydimethane. A charge transfer complex polymeric material such as a complex consisting of an electron donor and an electron acceptor, a quaternary ammonium salt type polymeric material, a chlorsulfonic acid type polymeric material, etc. can also be used.

The content of the conductive organic material is not particularly limited, but it is preferably set within a range such that the total content of additive substances in the base material is 0.01 to 70% by weight.

The flexible polymer resin base material and additives can be mixed and kneaded using conventional methods such as roll kneading, ξ mixer mixing, and kneading.
Kneading or the like may be used.

The conductive sheet used in the present invention may have at least one conductive surface layer as described above,
At least one conductive or non-conductive layer may be laminated thereon in any desired arrangement. In addition, for the purpose of improving the durability and strength of the conductive sheet, it may have a base layer or a backing layer, and this may be a non-conductive base layer impregnated with a conductive resin. good. The base layer or backing layer is preferably made of fiber cloth for reinforcing the surface layer.

The fibers used for the fiber base fabric for the conductive sheet include natural fibers such as cotton and linen, inorganic fibers such as glass fiber, carbon fiber and metal fiber, and recycled fibers such as viscose rayon and cupro. , semi-synthetic fibers such as cellulose di- and triacetate fibers, and synthetic fibers such as nylon 6, nylon 66, polyester (polyethylene terephthalate)
, aromatic polyamides, aromatic polyesters, acrylic polymers, polyvinyl chloride, vinylon, and polyolefin fibers, especially high-strength fibers (1
5 to 50 g/d) and/or highly heat-resistant fibers can also be used.

The fibers in the base fabric may be in any form such as short fiber spun yarn, long fiber yarn, split yarn, tape yarn, etc., and the base fabric may be woven, knitted, nonwoven, paper-like, and Any composite sheet of two or more of these may be used. Generally, the fibers used in the sheet of the present invention are preferably polyester fibers, and these fibers are preferably in the form of long fibers (filaments). The fibrous base fabric is useful for maintaining the resulting sheet's mechanical strength at a high level.

Further, useful woven fabrics include twill weave, plain weave, leno weave, sari weave, special knitted fabric, and other common textures.

In order to form a conductive surface layer on a fiber base fabric, a conductive film having the above-mentioned composition may be attached onto the base fabric,
Alternatively, a conductive composition paint having the composition described above may be applied onto the base fabric. Due to the formation of such a surface layer,
A calendering method, a ξnate method, a topping method, a coating method, an impregnating method and other covering methods can be used.

Alternatively, the fibrous base fabric may be impregnated with the conductive composition.

The method of the present invention attempts to stitch together one or more conductive sheets having at least one conductive surface layer having a surface resistance of 109 Ω-cm or less so that their conductive surfaces are continuous with each other. .

In the method of the invention, the two ends of the conductive sheet to be sewn are butted or overlapped such that their conductive surfaces are located on the same side. When a conductive surface layer is laminated with a non-conductive layer in a conductive sheet, the end faces of the conductive surface layer to be joined are butted together, or
Alternatively, the conductive surface layer of one of the two ends to be joined may be peeled off from the non-conductive layer and the back side of this conductive surface layer may be placed on the conductive surface layer of the other end. May be superimposed on

A bonding layer made of a high dielectric loss I@edge polymer material is formed on the bonded portion of the conductive surface layer formed as described above. This bonding layer may be formed by applying and drying a paint containing an insulating polymer material with high dielectric loss, or may be formed by pasting or interposing a sheet-like body made of the polymer material.

The high dielectric loss insulating polymer material used to form the bonding layer can be selected from the aforementioned polymer materials forming the matrix of the conductive surface layer, and these may be the same or different from each other. However, it is preferable that they are at least adhesively bondable to each other. The bonding layer is preferably insulative and has a surface resistance of 10 qΩ-0 or more, more preferably 10 10 Ω-cm or more.

It is generally preferable that the bonding layer is transparent, but it may have the same color as the edges to be bonded. Of course, in order to create a decorative effect, the bonding layer may be
It may have any color.

Further, the sheet-like body forming the bonding layer may be a film made of an insulating polymer with high dielectric loss, or may be a composite sheet of a fiber cloth, a film, and a lume. In the above composite sheet, the fiber fabric may be a reinforcing material that does not have dielectric properties.

There is no particular restriction on the size and shape of the bonding layer formed on the bonding portion, and it may be appropriately set as desired.

However, in general, it is preferable for the width of the bonding layer to be slightly larger than the high frequency application width from the viewpoint of work safety and stability. Further, the thickness of the bonding layer is preferably 0.05 mm or more, for example, 0.1 mm or more, or 0.3 mm or more.
It may be more than mm.

The thickness, width, and size of the bonding layer can be appropriately set in consideration of the appearance, surface resistance, high frequency application conditions, etc. of the conductive sheet.

In the method of the present invention, the bonding layer formed on the bonding portion is subjected to high-frequency treatment to heat and melt it, thereby stitching the ends of the conductive sheets together or the bonding layer together. When high-frequency treatment is applied, the bonding layer heats up and melts, so even if there is a hole in it, it will get caught in the molten polymer material and will be cast and filled to form a uniform insulating layer, making it conductive. There is no risk of creating sparks in the surface layer. Additionally, a portion of the matrix of the conductive surface layer softens or melts due to the heat of the molten polymeric material and readily adheres thereto. Thus, the abutted or overlapping bonded ends of the conductive surface layers are adhered to each other while being protected by the bonding layer.

Furthermore, if the matrix of the conductive surface layer has high-frequency dielectric heating properties, it will adhere even more firmly to itself, making it more preferable. Conventionally, when high-frequency suturing is performed by interposing a high-frequency dielectric heat-generating polymer in a joint, the material is interposed between non-adhesive materials that do not have high-frequency dielectric heat-generating properties, and the material is subjected to high-frequency treatment to be joined. In the method of the present invention, a high-frequency dielectric heat generating/insulating polymer is placed on the outer periphery, and in contrast to the conventionally well-known high-frequency suturing method,
They are clearly different in terms of the intervening location of the high-frequency dielectric heating/insulating polymer, the purpose of use, etc.

When a high-frequency dielectric heat-generating material is sandwiched between materials that do not have high-frequency heat-generating properties and a high frequency is applied to it, as in the past, this high-frequency dielectric heat-generating material does not necessarily have to be insulating. be.

By the method of the present invention as described above, it has become possible to perform high-frequency stitching of conductive sheets, which was previously thought to be impossible to perform high-frequency stitching.

The surface of the bonded portion formed by the above method is non-conductive. Even in this state, the stitched state is sufficient for use as an electromagnetic shield, but like an antistatic sheet,
If the surface of the bonding part is also required to be conductive, the bonding layer should be made of a conductive polymer and 1O9Ω-c
It is sufficient to form a conductive coating layer having a surface resistance of m or less.

Such a conductive coating layer can be formed by applying or pasting a paint or film containing the conductive material used to form the conductive surface layer and a matrix. Alternatively, the conductive film may be attached as a single-sided adhesive tape.

Although there are no particular limitations on the dimensions and shape of the conductive coating layer, it is preferable that the conductive coating layer sufficiently covers the bonding layer and contacts the conductive surface layer at both ends. This conductive coating layer is 0.01 to 0.5
Preferably, it has a thickness of pm. Further, the conductive coating layer may be colorless and transparent, or may be colored in a desired color.

〔Example〕

The present invention will be further explained below with reference to Examples.

Example 1 and Comparative Example 1 In Example 1, the following set la: 1000 d /192 f X 1000 d
/192 f22 pieces/25.4mm x 22 pieces/
A polyester multifilament yarn plain fabric having a diameter of 25.4 mm and a gray fabric type of 1185 g/rd was scoured and dried by a conventional method to obtain a base fabric.

Separately, the following composition: 100 parts by weight of polyvinyl chloride resin, O, P
40 Epoxidized soybean oil
3 Ni flake IIC 8-knee 1
60 (manufactured by Nikko Fine Products ■) was diluted with 45 parts by weight of perchlorethylene to prepare a conductive coating liquid.

The base fabric was dipped in the conductive coating liquid, and the pickup 1
The resin was squeezed to 50%, dried, and gelled and fixed at 180''C.A conductive waterproof fabric with a total weight of 360 g/bo was produced.The surface resistance of this conductive waterproof fabric was 10'Ω. It had no electrostatic chargeability and was useful as a sheet for wind pipes.

Separately, the following: 100 parts by weight of polyvinyl chloride resin, OlP
40 Ba-Zn stabilizer
0.7〃Ultraviolet absorber 0.2〃
A transparent insulating film having a thickness of 0.3M was prepared from the following resin composition. The surface resistance of this film is 10
'3Ω-equipment. This film was slit to a width of 4 cm to create a bonding tape.

The two ends of the conductive waterproof fabric were overlapped to a width of 3.0 cm, the joining tape was overlaid on the joint surface, and a high frequency oscillator with an output of 2 kW and a frequency of 40.68 MIIz was applied from above. High-frequency suturing was performed with a weld width of 3 cm and a duration of 3 seconds. The joint was evenly and firmly adhesively sutured.

In Comparative Example 1, the same operation as in Example 1 was performed. However, no joining tape was used. When high-frequency suturing was performed, sparks were generated and adhesive suturing was unsuccessful.

Examples 2 and 3 In Example 2, the same operations as in Example 1 were performed. However, 5 parts by weight of a coating solution prepared by diluting 203 parts by weight of the same conductive resin composition as described in Example 1 with 25 parts by weight of perchlorethylene was applied onto the surface of the bonded joint.
It was applied to a coating amount of 0 g/rrf (dry weight), dried, and gelled and fixed by blowing hot air to form a conductive coating layer.

The obtained conductive waterproof sheet exhibited substantially uniform surface resistance over the entire surface.

In Example 3, the following composition: 100 parts by weight of polyvinyl chloride resin, O
, P 40 ・Ba-Zn stabilizer 0.7 Ultraviolet absorber
A conductive resin tape with a thickness of 0.05 mm was prepared from a resin composition of 0.2〃Ni flakes 60〃. The surface resistance of this tape is 10'Ω-C11
Met.

The same operations as in Example 1 were performed to bond the conductive waterproof sheets, and the conductive resin tape was bonded onto the bonding layer using an adhesive. The obtained conductive waterproof sheet exhibited uniform and good conductivity over its entire surface.

Example 4 The same operations as in Example 1 were performed to create a conductive waterproof cloth and a transparent insulating film. However, the thickness of the transparent insulating film was 0.15 mm.

Separately, the following l11 weave using 250 denier polyester multifilament yarn: 250 d/I
X 250 d / 145 pieces / 2.54cm
X 45 pieces/2.54cm plain woven fabric (grey weight?9
0g/po) was woven.

The transparent insulating film is heated and adhered to both sides of this plain woven fabric to create a fiber base fabric-transparent insulating film composite sheet,
This composite sheet was slit to a width of 3 cm to create a joining tape.

The two ends of the conductive waterproof fabric were high-frequency sewn using the joining tape described above according to the joining method described in Example 1. In the resulting joint, the two ends were uniformly and firmly adhesively sutured.

Since the joining tape used had a fiber base fabric, even though the ends of the conductive waterproof fabric were simply butt-bonded and sewn together, the joining tape that bridged the two ends was This made the strength of this joint extremely high.

In addition, since the joining tape has a fiber base fabric, even if the joint is crimped by a weld bar when high frequency is applied, the flow movement due to the pressure of the molten resin is suppressed by the fiber base fabric, and there is almost no bonding. The suturing work was extremely stable, and the joints were uniform and strong.

Example 5 The same operation as in Example 2 was performed. However, the bonding tape described in Example 4 was used.

The bonded conductive waterproof fabric exhibited uniform and good conductivity over its entire surface.

Example 6 The same operation as in Example 3 was performed. However, the bonding tape described in Example 4 was used.

The bonded conductive waterproof fabric exhibited uniform and good conductivity over its entire surface.

〔Effect of the invention〕

By means of the method of the present invention, high-frequency stitching of sheets with a highly conductive surface layer, which was previously thought to be impossible due to the generation of sparks, can be carried out without the generation of sparks and, if desired, with respect to the high conductivity of the surface. This is possible without forming discontinuities, and its practical value is extremely high.

Claims (1)

[Claims] One or more conductive sheets having at least one conductive surface layer having a surface resistance of 1,10^9 Ω-cm or less are sewn together so that their conductive surfaces are continuous with each other. At this time, the two ends of the conductive sheet to be sewn are butted or overlapped so that their conductive surfaces are located on the same side, and a layer made of an insulating polymer material with high dielectric loss is placed on this joint. 1. A high-frequency sewing method for conductive sheet materials, comprising forming a joining layer, applying high frequency to the joining layer, and sewing together the ends of the conductive sheet and the joining layer. 2. When sewing one or more conductive sheets having at least one conductive surface layer having a surface resistance of 10^9 Ω-cm or less so that their conductive surfaces are continuous with each other, the conductive sheet abutting or overlapping the two ends to be sewn together such that their conductive surfaces are located on the same side, and forming a bonding layer made of a high dielectric loss insulating polymer material on this bonded portion, A high frequency is applied to this bonding layer to stitch the ends of the conductive sheet and the bonding layer together, and further, a conductive polymer material of 10^9 Ω-cm or less is placed on the bonding layer. 1. A high-frequency suturing method for a conductive sheet material, the method comprising: forming a conductive coating layer having a surface resistance of .