JPH02168237A - Thin-film two-terminal element type active matrix liquid crystal display device - Google Patents
Thin-film two-terminal element type active matrix liquid crystal display deviceInfo
- Publication number
- JPH02168237A JPH02168237A JP63325206A JP32520688A JPH02168237A JP H02168237 A JPH02168237 A JP H02168237A JP 63325206 A JP63325206 A JP 63325206A JP 32520688 A JP32520688 A JP 32520688A JP H02168237 A JPH02168237 A JP H02168237A
- Authority
- JP
- Japan
- Prior art keywords
- silicon nitride
- liquid crystal
- boron
- crystal display
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 18
- 239000011159 matrix material Substances 0.000 title claims description 14
- 239000010409 thin film Substances 0.000 title claims description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 24
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims abstract description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 26
- 239000010408 film Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract description 11
- 239000011521 glass Substances 0.000 abstract description 11
- 229910052796 boron Inorganic materials 0.000 abstract description 10
- 229910052580 B4C Inorganic materials 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 3
- 229910001936 tantalum oxide Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- LFVLUOAHQIVABZ-UHFFFAOYSA-N Iodofenphos Chemical compound COP(=S)(OC)OC1=CC(Cl)=C(I)C=C1Cl LFVLUOAHQIVABZ-UHFFFAOYSA-N 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、金属−絶縁体−金属からなる薄膜二端子素子
を用いたアクティブマトリクス液晶表示装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an active matrix liquid crystal display device using a thin film two-terminal element composed of metal-insulator-metal.
近年ツィステッド・ネマチック型を中心とした液晶表示
装置(LCD)の応用が発展し、腕時計や電卓の分野で
大量に用いられている。それに加え、近年、画素をマト
リクス状に配置し、文字図形等の任意の表示が可能なマ
トリクス型LCDも使われ始めている。このマトリクス
型LCDの応用分野を広げるためには、表示容量の増大
が必要である。しかし、従来のLCDの電圧−透過率変
化特性の立ち上がりはあまり急峻ではないので、表示容
量を増加させるためにマルチプレックス駆動の走査本数
を増加させると、選択画素と非選択画素との各々にかか
る実効電圧比は低下し、選択画素の透過率低下と非選択
画素の透過率増加というタロストークが生じる。その結
果、表示コントラストが著しく低下し、ある程度満足で
きるコントラストが得られる視野角も狭くなり、従来の
LCDでは、走査本数は60本ぐらいが限界である。BACKGROUND ART In recent years, applications of liquid crystal display devices (LCDs), mainly twisted nematic type, have been developed and are being used in large quantities in the fields of wristwatches and calculators. In addition, in recent years, matrix type LCDs have begun to be used, which have pixels arranged in a matrix and are capable of displaying arbitrary characters and graphics. In order to expand the field of application of this matrix type LCD, it is necessary to increase the display capacity. However, since the rise of the voltage-transmittance change characteristic of conventional LCDs is not very steep, when the number of scans in multiplex drive is increased to increase the display capacity, the The effective voltage ratio decreases, and a Talostalk occurs in which the transmittance of selected pixels decreases and the transmittance of non-selected pixels increases. As a result, the display contrast is significantly reduced, and the viewing angle at which a somewhat satisfactory contrast can be obtained is also narrowed, and in conventional LCDs, the maximum number of scan lines is about 60 lines.
このマトリクス型LCDの表示容量を大幅に増加させる
ために、LCDの各画素にスイ・ンチング素子を直列に
配置したアクティブマトリクスLCDが考案されている
。これまでに発表されたアクティブマトリクスLCDの
試作品のスイッチング素子には、アモルファスSLや多
結晶Stを半導体材料とした薄膜トランジスタ素子(T
PT)が多く用いられている。また一方では、製造及び
構造が比較的簡単であるため、製造工程が簡略化でき、
高歩留まり、低コストかが期待される薄膜二端子素子(
以下TFDと略す)を用いたアクティブマトリクスLC
Dも注目されている。In order to significantly increase the display capacity of this matrix type LCD, an active matrix LCD has been devised in which switching elements are arranged in series in each pixel of the LCD. The switching elements of active matrix LCD prototypes announced so far include thin film transistor elements (T
PT) is often used. On the other hand, since the manufacturing and structure are relatively simple, the manufacturing process can be simplified.
Thin film two-terminal devices expected to have high yield and low cost (
Active matrix LC using TFD (hereinafter abbreviated as TFD)
D is also attracting attention.
このような1膜二端子素子型アクテイブマトリクスLC
D (以下TFD−LCDと略す)において−香臭用化
に近いと考えられているLCDはT F Dに金属−絶
縁体−金属構造の素子(以下MIM素子またはMIMと
略す)を用いたLCDである。M I MのようなTF
Dを各画素の液晶と直列に接続することにより、TFD
の電圧−電流特性の高非線形性により、TFD−液晶素
子の電圧−透過率変化特性の立ち上がりは急峻になり、
液晶表示装置の走査本数を大幅に増やすことが可能にな
る。Such a one-film, two-terminal element type active matrix LC
In D (hereinafter abbreviated as TFD-LCD), an LCD that is considered to be close to the one for use in fragrances is an LCD that uses a metal-insulator-metal structure element (hereinafter abbreviated as MIM element or MIM) in TFD. It is. TF like M I M
By connecting D in series with the liquid crystal of each pixel, TFD
Due to the highly non-linearity of the voltage-current characteristic of the TFD-liquid crystal element, the rise of the voltage-transmittance change characteristic becomes steep.
It becomes possible to significantly increase the number of scan lines of a liquid crystal display device.
このようなMIMをもちいたLCDの従来例は論文では
デイ・アールバラフ他著(ジ・オンチマイゼイション・
オフ・メタル・インシュレータ・メタル・ノンリニア・
デバイシズ・フォア・ユース・イン・マルチプレクスド
・リキッド・クリスタル・デイスプレィズ)、アイ・イ
ー・イー・イー・トランザクション・オン・エレクトロ
ン・アバ491,28巻、6号1頁736−739゜1
981年発行) (D、R,Baraff、 eta
l、 、 ”TheOptimization o
f Metal −1nsufator −Meta
lNon −1inear Devices fo
r Use in Multipfexed Li
quid Crystal Displays” I
EEE Trans。A conventional example of an LCD using such an MIM is described in a paper by Day Arbalaf et al.
Off metal insulator metal nonlinear
Devices for Use in Multiplexed Liquid Crystal Displays), IE Transactions on Electron AB 491, Vol. 28, No. 6, pp. 1, 736-739゜1
(Published in 981) (D, R, Baraff, eta
l, , ”The Optimization o
f Metal-1nsulfator-Meta
1Non-1inear Devices for
r Use in Multipfexed Li
quid Crystal Displays”I
EEE Trans.
Electron Devices 、 vol E
D −28,pp736−739 (1981) )
に代表的に示される。Electron Devices, vol E
D-28, pp736-739 (1981))
Representatively shown.
MIMにおいて、最も重要な材料は絶縁体層の材料であ
る。最も知られている絶縁体材料とじては酸化タンタル
がある(例えば、両角仲治、他。In MIM, the most important material is that of the insulator layer. The most well-known insulating material is tantalum oxide (for example, Nakaji Ryozumi et al.
著 250 X240画素のラテラル、M I M −
L CDテレビジョン学会技術報告(I PD83−8
)p39−44.1983年12月発行)。このよう
なMIM素子を大容量のデイスプレィに適用するときに
要求される特性は、素子を流れる電流(I)と印加電圧
(V)をニーaV’ と表わしたときの非線形係数αが
大きいこと、電流−電圧特性が印加電圧の極性に無関係
に正負対称であること、及びMIM素子の容量が小さい
ことである。ところが、酸化タンタルを用いたMIM素
子は対称性はよいが非線形係数が5〜6とそれほど大き
くなく、また誘電率も大きいため素子容量が大きい等の
欠点を有している。そこで、誘電率の小さい窒化シリコ
ンがMIM素子用絶縁体材料として開発されているで例
えば エム スズキ 他(ア ニュー アクティブ ダ
イオード マトリクス エルシープイー ユージング
オフ ストイキオメトリツク5INx レイヤー、ブ
ロシーデインダス オフ ザ ニスアイデイ−28巻
101−104頁。Written by 250 x 240 pixel lateral, M I M -
L CD Television Society Technical Report (I PD83-8
) p39-44. Published December 1983). When applying such an MIM element to a large-capacity display, the characteristics required are that the nonlinear coefficient α is large when the current (I) flowing through the element and the applied voltage (V) are expressed as aV'; The current-voltage characteristics are positive and negative symmetrical regardless of the polarity of the applied voltage, and the capacitance of the MIM element is small. However, although the MIM element using tantalum oxide has good symmetry, it has a nonlinear coefficient of 5 to 6, which is not so large, and also has a large dielectric constant, so it has drawbacks such as a large element capacitance. Therefore, silicon nitride, which has a low dielectric constant, has been developed as an insulator material for MIM devices.
Off Stoichiometric 5INx Layer, Blossom Deindus Off the Varnish ID-Volume 28
Pages 101-104.
1987年発行) (M、 5uzuki et a
t ”A New ActiveDiode Ma
trix LCD using Off−sto
ichiometricSiNx Layer P
roceedings of the SID、Vol
、28ρ101−104.1987))。Published in 1987) (M, 5uzuki et a.
t”A New Active Diode Ma
trix LCD using Off-sto
ichiometric SiNx Layer P
roceedings of the SID, Vol.
, 28ρ101-104.1987)).
この窒化シリコンを用いたMIM素子は非線形係数が7
〜9と酸化タンタルに比べて大きいものの、第2図の破
線で示されるように電圧−電流特性が印加電圧の極性に
より非対称になることが多い、このためこのMIM素子
を液晶表示装置に利用した場合にはフリッカ−が生じて
しまい、画像品質の低下をもたらしていた。This MIM element using silicon nitride has a nonlinear coefficient of 7.
~9, which is larger than that of tantalum oxide, but as shown by the broken line in Figure 2, the voltage-current characteristics often become asymmetric depending on the polarity of the applied voltage, which is why this MIM element was used in liquid crystal display devices. In some cases, flicker occurs, resulting in a reduction in image quality.
本発明の目的は、このような画像品質の低下をもたらす
MIM素子特性の電圧−電流特性の非対称性を改善し、
高画質の大容量液晶表示装置を提供することにある。The purpose of the present invention is to improve the asymmetry of the voltage-current characteristics of the MIM element characteristics that cause such deterioration of image quality,
An object of the present invention is to provide a high-quality, large-capacity liquid crystal display device.
本発明は透明電極が形成されている基板と、窒化シリコ
ン膜を絶縁体として用いた金属−絶縁体−金属構造を有
する薄膜二端子素子が形成されている基板との間に液晶
を挾持した薄膜二端子素子型アクティブマトリクス液晶
表示装置において、前記金属と絶縁体の間にほう素をド
ープした窒化シリコン層また炭化シリコン層をはさんだ
ことを特徴とする薄膜二端子素子型アクティブマトリク
ス液晶表示装置である。The present invention provides a thin film in which a liquid crystal is sandwiched between a substrate on which a transparent electrode is formed and a thin film two-terminal element having a metal-insulator-metal structure using a silicon nitride film as an insulator. A thin film two-terminal active matrix liquid crystal display device characterized in that a boron-doped silicon nitride layer or silicon carbide layer is sandwiched between the metal and the insulator. be.
し作用〕
本発明においては金属電極と窒化シリコン層との間にほ
う素を含んだ窒化シリコン層または炭化シリコン層をは
さむことにより正孔の電極からの注入を阻害する障壁を
小さくでき、正電圧および負電圧印加時のそれぞれの電
極からの正孔の注入に対する障壁の違いによる電流値の
非対称性がなくなる。この結果フリッカ−がない良画哲
の液晶表示装置が実現できる。In the present invention, by sandwiching a boron-containing silicon nitride layer or silicon carbide layer between the metal electrode and the silicon nitride layer, the barrier that inhibits the injection of holes from the electrode can be reduced, and the positive voltage Also, the asymmetry in the current value due to the difference in the barrier to hole injection from each electrode when applying a negative voltage is eliminated. As a result, a liquid crystal display device with good image quality and no flicker can be realized.
以下に本発明の実施例を示す。 Examples of the present invention are shown below.
本実施例によりえられるTFD素子の代表例の断面図を
第1図に示す、まず下部ガラス基板1を5i02等のガ
ラス保護層2で被覆する。この保護層2は不可欠なもの
ではないので省略することもできる6次にこの上に金属
電極としてCrを1000A形成しフォトリングラフィ
法により島状にパターン化しリード電極3を形成する。A cross-sectional view of a typical example of the TFD element obtained in this example is shown in FIG. 1. First, a lower glass substrate 1 is coated with a glass protective layer 2 such as 5i02. This protective layer 2 is not indispensable and may be omitted.Next, a 1000A Cr film is formed as a metal electrode on this layer and patterned into an island shape by photolithography to form a lead electrode 3.
続いてSiH4ガスとN2ガスの混合ガスにB2H6ガ
スを1%混合したガスを用いてグロー放電分解法により
ガラス基板上にほう素をドープした第1の窒化シリコン
層4を50OA形成したのち、SiH4とN2の混合ガ
スから窒化シリコン層5を120OA 、SiH4とN
2の混合ガスに821(6ガスを0.5%混合したガス
を用いてほう素をドープした第2の窒化シリコン層6を
20OA形成することにより3層構造を形成する。この
ときの窒Cヒシリコン層を形成するときのガス混合比S
iH4/N2は0.08.またほう素をドープした第1
及び第2の窒化シリコン層を形成するときのガス混合比
SiH4/N2は0.2であった。その後上部電極7と
してCrを100OA形成しフォトリソグラフィ法によ
りパターン化し、M I M素子アレイを形成する。そ
の後画素電極としてITOをパターン化して形成する。Next, a first boron-doped silicon nitride layer 4 of 50 OA was formed on the glass substrate by a glow discharge decomposition method using a mixed gas of SiH4 gas and N2 gas mixed with 1% B2H6 gas, and then SiH4 The silicon nitride layer 5 was heated at 120OA from a mixed gas of SiH4 and N2.
A three-layer structure is formed by forming a boron-doped second silicon nitride layer 6 of 20 OA using a mixed gas of 821 (0.5% of 6 gases). Gas mixture ratio S when forming a hissilicon layer
iH4/N2 is 0.08. Also, the first doped with boron
The gas mixture ratio SiH4/N2 when forming the second silicon nitride layer was 0.2. Thereafter, 100 OA of Cr is formed as the upper electrode 7 and patterned by photolithography to form an M I M element array. Thereafter, ITO is patterned and formed as a pixel electrode.
上部ガラス基板上の保護N9.上部透明電極10の膜形
成、パターン化は通常の単純マルチプレックスLCDと
殆ど同一である。下部ガラス基板1と上部ガラス基板8
とは配向処理を施したのちガラスファイバ等のスペーサ
を介して張り合わせ、通常のエポキシ系接着剤によりシ
ールした。セル厚は5ミクロンとした。その後TN形液
晶11であるZLI−1565(メルク社製)を基板間
に注入しTFD−LCDを完成した。Protection on top glass substrate N9. The film formation and patterning of the upper transparent electrode 10 are almost the same as in a normal simple multiplex LCD. Lower glass substrate 1 and upper glass substrate 8
After being subjected to orientation treatment, they were pasted together with spacers such as glass fibers interposed therebetween, and sealed with a regular epoxy adhesive. The cell thickness was 5 microns. Thereafter, ZLI-1565 (manufactured by Merck & Co., Ltd.), which is a TN type liquid crystal 11, was injected between the substrates to complete a TFD-LCD.
本発明により形成した二端子素子の電圧−電流特性を測
定しなところ第2図の実線で示されるように電圧の極性
に対して対称であり、従来の窒化シリコンの単層構造よ
り得られた二端子素子の電圧−電流特性(破線)に比べ
て対称性が改善されていることがわかった。また、非線
形係数も8と太きく1000本以上の高走査線を有する
TFD−LCDへの適応も可能なことがわかった。When the voltage-current characteristics of the two-terminal device formed according to the present invention were measured, it was found to be symmetrical with respect to the voltage polarity, as shown by the solid line in FIG. It was found that the symmetry was improved compared to the voltage-current characteristics (broken line) of the two-terminal element. Furthermore, it was found that the nonlinear coefficient was as thick as 8, and that it could be applied to a TFD-LCD having a high scanning line of 1000 or more.
この二端子素子の窒化シリコン層を形成するときのガス
混合比SiH4/N2は0.02以上0.6以下が非線
形性の大きい二端子素子をつくるなめに必要である。ま
たほう素をドープした第1及び第2の窒化シリコン層を
形成するときのガス混合比SiH4/N2は0.01以
−ヒであり、はう素の混合比は50ρp rn以上であ
れば電圧−電流特性の対称性に効果があった。本実施例
においてはSiH4とN2の混合ガスを用いて窒化ジノ
コン層を成膜しているが、SiH4とN I−1、の混
合ガスを用いても良好なダイオード特性が得られた。ま
た、本実施例においては、グロー放電分解法を用いて3
層構造を形成しているがスパッタ法、CVD法等の他の
成膜方法においても本発明は有効である。The gas mixture ratio SiH4/N2 when forming the silicon nitride layer of this two-terminal element is required to be 0.02 or more and 0.6 or less in order to produce a two-terminal element with large nonlinearity. In addition, when forming the first and second boron-doped silicon nitride layers, the gas mixture ratio SiH4/N2 is 0.01 or more, and the boron mixture ratio is 50ρrn or more. -It had an effect on the symmetry of current characteristics. In this example, the nitrided dinocon layer was formed using a mixed gas of SiH4 and N2, but good diode characteristics were also obtained using a mixed gas of SiH4 and NI-1. In addition, in this example, 3
Although a layered structure is formed, the present invention is also effective in other film forming methods such as sputtering and CVD.
本実施例においては、はう素をドープした窒化シリコン
層を用いているが同様な方法でほう素を含んだ炭化シリ
コン層を窒化シリコン層の両側にはさんだ3層構造でも
対称性のよいダイオード特性が得られた。この時、ガス
混合比SiH4/CH4が0.1以上のガスをグロー放
電分解法により炭化シリコン層を成膜した。In this example, a silicon nitride layer doped with boron is used, but a diode with good symmetry can also be obtained using a three-layer structure in which boron-containing silicon carbide layers are sandwiched on both sides of the silicon nitride layer. characteristics were obtained. At this time, a silicon carbide layer was formed using a glow discharge decomposition method using a gas having a gas mixture ratio of SiH4/CH4 of 0.1 or more.
本実施例においては電極としてクロム電極を用いている
が、AI、Ta、Mo、W等他の金属及びシリサイドを
上部及びリード電極に用いても本発明は有効である。ま
た、画素電極として使用しているITO等の透明電極を
二端子素子の上部及び下部電極と兼ねても本発明は有効
である。In this embodiment, a chromium electrode is used as the electrode, but the present invention is also effective even if other metals such as AI, Ta, Mo, W, and silicide are used for the upper and lead electrodes. Further, the present invention is also effective even if the transparent electrode such as ITO used as the pixel electrode also serves as the upper and lower electrodes of the two-terminal element.
本実施例を用いて形成された640 X400素子のT
FD−LCDの画像評価を行なったところコン・トラス
ト20:1以上、フリッカー−37dBと従来の窒化シ
リコンの単層構造のT F D −L CDの一25d
Bに比べて大幅に改善されていることか明らかになった
。T of 640×400 element formed using this example
An image evaluation of the FD-LCD revealed that the contrast was 20:1 or higher and the flicker was -37 dB, compared to a conventional TFD-LCD with a single layer structure of silicon nitride.
It is clear that this is a significant improvement compared to B.
以上説明したように、本発明によれば対称性が良く、非
線形性の高い薄膜二端子素子特性が得られるので大容量
でフリッカ−の少ない液晶表示装置を提供することがで
きる。As described above, according to the present invention, thin film two-terminal device characteristics with good symmetry and high nonlinearity can be obtained, so that a liquid crystal display device with large capacity and less flicker can be provided.
例の断面図、第2図は本発明による薄膜二端子素子と従
来例による薄膜二端子素子の電圧−電流特性を示した図
である。FIG. 2, which is a cross-sectional view of an example, is a diagram showing voltage-current characteristics of a thin film two-terminal device according to the present invention and a thin film two-terminal device according to a conventional example.
1・・・下部ガラス基板、2.9・・・ガラス保護膜、
3・・・リード電極、4・・・はう素がドープされた第
1の窒化シリコン層、5・・・窒化シリコン層、6・・
・はう素がドープされた第2の窒化シリコン層、7・・
・上部電極、8・・・上部ガラス電極、10・・・上部
透明電極、11・・・液晶。1... Lower glass substrate, 2.9... Glass protective film,
3... Lead electrode, 4... First silicon nitride layer doped with boron, 5... Silicon nitride layer, 6...
- Second silicon nitride layer doped with boron, 7...
- Upper electrode, 8... Upper glass electrode, 10... Upper transparent electrode, 11... Liquid crystal.
Claims (1)
縁体として用いた金属−絶縁体−金属構造を有する薄膜
二端子素子がマトリクス状に形成されている基板との間
に液晶を挾持して成る薄膜二端子素子型アクティブマト
リクス液晶表示装置において、前記金属と絶縁体の間に
ほう素をドープした窒化シリコン層または炭化シリコン
層をはさんだことを特徴とする薄膜二端子素子型アクテ
ィブマトリクス液晶表示装置。A liquid crystal is sandwiched between a substrate on which a transparent electrode is formed and a substrate on which thin film two-terminal elements having a metal-insulator-metal structure using a silicon nitride film as an insulator are formed in a matrix. A thin film two-terminal active matrix liquid crystal display device comprising a thin film two-terminal active matrix liquid crystal display device, characterized in that a boron-doped silicon nitride layer or silicon carbide layer is sandwiched between the metal and the insulator. Device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63325206A JPH02168237A (en) | 1988-12-22 | 1988-12-22 | Thin-film two-terminal element type active matrix liquid crystal display device |
| US07/455,259 US5122889A (en) | 1988-12-22 | 1989-12-22 | Active matrix liquid crystal display using mim diodes having symmetrical voltage-current characteristics as switching elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63325206A JPH02168237A (en) | 1988-12-22 | 1988-12-22 | Thin-film two-terminal element type active matrix liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02168237A true JPH02168237A (en) | 1990-06-28 |
Family
ID=18174209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63325206A Pending JPH02168237A (en) | 1988-12-22 | 1988-12-22 | Thin-film two-terminal element type active matrix liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02168237A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8295123B2 (en) | 2007-07-18 | 2012-10-23 | Panasonic Corporation | Current rectifying element, memory device incorporating current rectifying element, and fabrication method thereof |
-
1988
- 1988-12-22 JP JP63325206A patent/JPH02168237A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8295123B2 (en) | 2007-07-18 | 2012-10-23 | Panasonic Corporation | Current rectifying element, memory device incorporating current rectifying element, and fabrication method thereof |
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