JPH0217381U - - Google Patents
Info
- Publication number
- JPH0217381U JPH0217381U JP9617188U JP9617188U JPH0217381U JP H0217381 U JPH0217381 U JP H0217381U JP 9617188 U JP9617188 U JP 9617188U JP 9617188 U JP9617188 U JP 9617188U JP H0217381 U JPH0217381 U JP H0217381U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- module
- chip
- card
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案によるＩＣモジユールおよびＩ
Ｃカードの一実施例を示す側断面図である。
１０……ＩＣカード、１１……ＩＣモジユール
、１２……基板、１３……外部端子、１４……ス
ルーホール、１４ａ……導電メツキ、１５……パ
タン層、１７……ＩＣチツプ、１８……ボンデイ
ングワイヤ、１９……樹脂モールド部、２０……
ダイボンデイング接着剤、３０……カード基材、
３４……接着剤、３５……凹部。
Figure 1 shows the IC module and I according to the present invention.
It is a side sectional view showing one example of a C card. 10...IC card, 11...IC module, 12...board, 13...external terminal, 14...through hole, 14a...conductive plating, 15...pattern layer, 17...IC chip, 18... Bonding wire, 19...Resin mold part, 20...
Die bonding adhesive, 30...Card base material,
34...adhesive, 35...recess.
Claims (1)
の他方の面にＩＣチツプおよびパタン層を設け、
このＩＣチツプならびに配線部の周囲に樹脂モー
ルド部を形成してなるＩＣモジユールにおいて、
前記基板に垂直な切断面における前記樹脂モール
ド部の断面形状を略逆台形としたことを特徴とす
るＩＣモジユール。 ２ カード基材の表面に形成された凹部内に請求
項１記載のＩＣモジユールを装着してなるＩＣカ
ード。[Claims for Utility Model Registration] 1. An external terminal is provided on one side of a substrate, an IC chip and a pattern layer are provided on the other side of the substrate,
In the IC module formed by forming a resin mold part around the IC chip and the wiring part,
An IC module characterized in that the cross-sectional shape of the resin molded portion in a cut plane perpendicular to the substrate is approximately an inverted trapezoid. 2. An IC card comprising the IC module according to claim 1 installed in a recess formed on the surface of a card base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096171U JPH084310Y2 (en) | 1988-07-20 | 1988-07-20 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096171U JPH084310Y2 (en) | 1988-07-20 | 1988-07-20 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217381U true JPH0217381U (en) | 1990-02-05 |
| JPH084310Y2 JPH084310Y2 (en) | 1996-02-07 |
Family
ID=31321008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096171U Expired - Lifetime JPH084310Y2 (en) | 1988-07-20 | 1988-07-20 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084310Y2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6146655U (en) * | 1984-08-31 | 1986-03-28 | カシオ計算機株式会社 | IC card |
| JPS6253895A (en) * | 1985-08-31 | 1987-03-09 | 凸版印刷株式会社 | Manufacture of integrated circuit card |
| JPS6296847U (en) * | 1985-12-09 | 1987-06-20 | ||
| JPS62187780U (en) * | 1986-05-19 | 1987-11-30 | ||
| JPS6391294A (en) * | 1986-10-06 | 1988-04-21 | 松下電器産業株式会社 | Ic card |
| JPS63233892A (en) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Ic card |
-
1988
- 1988-07-20 JP JP1988096171U patent/JPH084310Y2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6146655U (en) * | 1984-08-31 | 1986-03-28 | カシオ計算機株式会社 | IC card |
| JPS6253895A (en) * | 1985-08-31 | 1987-03-09 | 凸版印刷株式会社 | Manufacture of integrated circuit card |
| JPS6296847U (en) * | 1985-12-09 | 1987-06-20 | ||
| JPS62187780U (en) * | 1986-05-19 | 1987-11-30 | ||
| JPS6391294A (en) * | 1986-10-06 | 1988-04-21 | 松下電器産業株式会社 | Ic card |
| JPS63233892A (en) * | 1987-03-23 | 1988-09-29 | 松下電子工業株式会社 | Ic card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH084310Y2 (en) | 1996-02-07 |