JPH0217483Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The present invention is housed in a closed container of a boiling refrigerant type cooling device that performs cooling by utilizing circulation involving a phase change of vapor and liquid of a boiling refrigerant. The present invention relates to a support device for a semiconductor stack connected to an external electrical circuit through an airtight terminal joined to the sealed container. Semiconductor stacks of this type are usually coupled via their support frame to the base of the hermetic terminal, the coupling being completely enclosed within the hermetically sealed container and thus requiring no maintenance over a long period of time. It is necessary to take care to ensure that the material has both thermal and mechanical durability to avoid any damage.

[Prior art and its problems]

Generally, in a boiling refrigerant type cooling device that houses a semiconductor stack, as shown in Fig. 2, a sealed container 1
A refrigerant 12 is stored inside the refrigerant 1 to the extent that the semiconductor stack 1 is completely immersed therein, and the upper part of the closed container 11 is provided with a large number of heat dissipating fins 14 around the condensation chamber into which the gas phase portion 13 of the refrigerant 12 flows. 15 is formed.

In the cooling device configured as described above, the vapor phase portion 13 of the refrigerant 12, which has absorbed the heat loss of the semiconductor stack 1 and is boiled and vaporized, rises due to the pressure difference inside the closed container 1 and moves to the condensation chamber 15. death,
It comes into contact with the inner surface of the wall of the condensing chamber 15 equipped with the heat dissipation fins 14, removes heat, condenses and liquefies, and flows back into the liquid phase portion of the refrigerant 12 in the lower part under the action of gravity. The semiconductor stack 1 is cooled by the circulation of the coolant 12 accompanied by a gas-liquid phase change as described above.

In this case, as a means for supporting the semiconductor stack 1 inside the hermetic container 11, conventionally, as shown in FIG. Generally, the hermetic terminal 3, which is adapted to lead the terminal 6 to the outside, is connected to the semiconductor stack support frame 2. At that time, the airtight terminals 3 are usually inserted through the openings into the upper airtight container 11 to which the airtight terminals 3 are directly connected and fixed to both ends of the support frame 2 externally, and the bases 4 of the airtight terminals 3 are inserted into the upper airtight container 11 which is directly connected and fixed to both ends of the support frame 2. The parts are welded airtight. In this case, in order to facilitate the work, the opening of the airtight container 11 and the base 4 of the airtight terminal 3 to be hermetically welded thereto are both formed to have a circular cross-sectional shape and are adapted to fit each other. In order to insert the support frame 2 coupled to the airtight terminal 3 into the airtight container 11 by passing through the opening, the base 4 of the airtight terminal 3 has a cylindrical outer diameter. It is necessary that the outer diameter of the supporting frame 2 and the base 4 be equal to or smaller than the outer diameter of the support frame 2 and that the coupling means between the support frame 2 and the base 4 do not protrude beyond the outer periphery of the base 4.

In order to satisfy the above-mentioned conditions, conventionally, as shown in FIG. A mounting seat 4a with a small outer diameter is formed, and the connecting portion 2a formed at the end of the support frame 2 is fitted into the mounting seat 4a, and the two are connected and fixed together with a countersunk screw 5 whose head does not protrude from the surface. Do as you please. However, in this case, the space at which the support frame 2 and the base 4 of the airtight terminal 3 are connected is cramped, and it is difficult to completely prevent the countersunk screws 5 from loosening. This support means is difficult to rely on for applications with large vibrations such as vehicles,
Furthermore, since the joint is completely fixed in the axial direction by countersunk screws, repeated axial expansions of the support frame 2 due to temperature changes in the closed container 11 caused by the operation of the semiconductor stack 1 can be avoided. It has the disadvantage that shrinkage cannot be absorbed and stress is likely to occur in the semiconductor stack support frame 2.

[Purpose of invention]

In view of the above-mentioned drawbacks of the conventional means for supporting a semiconductor stack in a closed container of a boiling refrigerant type cooling device, the present invention has an extremely simple structure, eliminates the possibility of loosening due to vibration, and provides a means for supporting a semiconductor stack in a closed container of a boiling refrigerant type cooling device. An object of the present invention is to provide a support device for a semiconductor stack that can absorb expansion and contraction in the axial direction due to temperature changes.

[Key points of the idea]

In order to achieve the above-mentioned object, the present invention provides the above-mentioned support device, which comprises a support frame for the semiconductor stack, an airtight terminal for connecting the semiconductor stack, and an adapter interposed between the support frame and the airtight terminal. , the support frame, the airtight terminal, and the adapter have the same outer diameter, and the adapter and the airtight terminal are integrally coupled by mechanically strong coupling means,
Further, the semiconductor stack is stably supported within the closed container by coupling the adapter and the support frame with a coupling means that allows appropriate sliding relative to each other in the axial direction.

[Example of idea]

Next, the present invention will be explained in detail based on the embodiments shown in the drawings.

In FIG. 2, a semiconductor stack 1 immersed in a refrigerant 12 stored in an airtight container 11 of a boiling refrigerant type cooling device is cooled by utilizing the circulation of the refrigerant 12 accompanied by a gas-liquid phase change. This is as already explained. At this time, in the case of a conventional boiling refrigerant type cooling device, the semiconductor stack 1 housed in the airtight container 11 is coupled and fixed via its support frame 2 to an airtight terminal that leads the connecting conductor of the stack 1 to the outside. However, in the case of the present invention, the support frame 2 of the semiconductor stack 1 is indirectly connected to the airtight terminal 3 via the fixing adapter 7, as shown in FIG. That is, a mounting seat 4a having a smaller outer diameter is formed along the axially inner outer circumference of the cylindrical base 4 of the airtight terminal 3, and the mounting seat 4a is connected to a ring having an outer diameter equal to that of the base 4 of the airtight terminal. At the same time, the protrusion 7a and the base 4 are connected by a strong pin 8, and the head of the pin 8 is attached to the surface of the adapter 7. The airtight terminal 3 and the adapter 7 are mechanically and strongly integrated by welding so that they do not protrude.

Next, the connecting part 2a of the support frame 2 of the semiconductor stack 1 is inserted into the inner peripheral surface of the other protruding part 7b of the adapter 7, and the upper fold washer is connected with the bolt 9 from the inner peripheral side of the support frame 2. The bolt 9 is prevented from loosening by a conventional means such as the following. At this time, bolts 9 provided on the connecting portion 2a of the support frame 2
The hole for this purpose is formed into a long hole.

By configuring the support device for the semiconductor stack 1 as described above, the base 4 of the airtight terminal and the adapter 7, which are limited in space, can be connected by welding the pins 8, and the support frame 2 of the semiconductor stack can be connected to the adapter 7 by welding the pin 8. Since the connection with the adapter 7 is made with a bolt 9 equipped with a loosening means and tightened to allow appropriate slippage in the axial direction, there is no risk of each connected part loosening due to vibration, and the semiconductor Since the bolt hole of the connecting portion of the support frame 2 of the stack to the adapter 7 is formed into an elongated hole, the expansion and contraction of the support frame in the axial direction that repeatedly occurs due to temperature changes inside the closed container can be prevented by the connection. This can be absorbed by the sliding of the parts and does not create stresses on the support frame 2 or on the adapter 7.

[Effect of idea]

As explained above, the present invention is an airtight terminal that is housed in a closed container of a boiling refrigerant type cooling device that performs cooling by utilizing the circulation of a boiling refrigerant accompanied by a phase change of vapor and liquid, and that is connected to the closed container. A support device for a semiconductor stack connected to an external electrical circuit via a semiconductor stack, comprising a support frame for the semiconductor stack, an airtight terminal for connecting the semiconductor stack, and an adapter interposed between the support frame and the airtight terminal, The support frame, the airtight terminal, and the adapter have the same outer diameter, the adapter and the airtight terminal are integrally coupled by a strong mechanical coupling means, and the adapter and the support frame are interconnected. By connecting with a connecting means that allows appropriate sliding in the axial direction, each joint does not loosen due to vibration, and the support that is repeatedly generated due to temperature changes in the closed container is prevented. This has the effect of absorbing expansion and contraction of the frame in the axial direction and preventing stress that may occur in the support frame or adapter.

[Brief explanation of the drawing]

FIG. 1 is a schematic partial vertical cross-sectional view showing the structure of the semiconductor stack support device of the present invention, FIG. 2 is a schematic vertical cross-sectional view of a boiling refrigerant type cooling device, and FIG. 3 is a partial vertical cross-sectional view showing the conventional semiconductor stack support means. A schematic diagram of a longitudinal section is shown in each case. 1...Semiconductor stack, 2...Support frame,
3... Airtight terminal, 4... Base of airtight terminal, 6...
…Connection conductor, 7…Adapter, 8…Pin, 9…
...Volt, 11...Airtight container, 12...Boiling refrigerant.

Claims (1)

[Scope of utility model registration request] A boiling refrigerant type cooling device that performs cooling by utilizing circulation involving a phase change of vapor and liquid of boiling refrigerant is housed in an airtight container, and is connected to an external electrical circuit through an airtight terminal with a base connected to the airtight container. A support device for a semiconductor stack to be connected includes a support frame for the semiconductor stack, an airtight terminal for connection of the semiconductor stack, and an adapter interposed between the support frame and the airtight terminal, the support frame, the airtight terminal and the adapter have the same outer diameter, the adapter and the base of the hermetic terminal are integrally coupled by a mechanically strong coupling means, and the adapter and the support frame are axially connected to each other. 1. A support device for a semiconductor stack, characterized in that the semiconductor stack is connected to the semiconductor stack by a connecting means capable of allowing appropriate slippage.