JPH02177462A - Metal head with positioning projection - Google Patents

Abstract

PURPOSE:To obtain a metal head with positioning projection at a low price which is easly to manufacture without requiring coining by disposing a plurality of positioning projections for a cap so as to project on the side in which the cap is covered by a half-punch technique. CONSTITUTION:A metal head 14 forming a semiconductor package with a cap 12 covered is disposed by a half-punch technique so that a plurality of positioning projections 18 for the cap 12 project on the side in which the cap 12 is covered. For example, four column-like positioning projections 18 are disposed on one flat-plate metal base 16 by the half-punch technique, glass 8 is sealed in a hole disposed on the metal base 16, an electrical signal input- output terminal 10 is extracted via the glass 8, and the metal head 14 is formed. After an IC chip 24 is joined and bonded, the cap 12 is positioned so that four projections 18 fit in the inner peripheral surface 20 of the cap 12. The metal head 14 is covered with the metal cap 12, then projection welding is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a metal header used in a base body of a microwave IC or the like.

[Conventional technology]

Conventionally, this type of metal header is shown in FIG. 5(a).

In both the round shape and the square shape shown in FIG. 3(b), the peripheral edge constitutes a thin flange portion 2, and the cross section generally has a positioning step 4 with a two-step structure. metal header 6
A glass 8 is sealed in the hole provided in the hole, and an electrical signal input/output terminal 10 is drawn out through the glass, thereby forming a hermetic electrical signal input/output terminal portion.

A semiconductor chip or a substrate (not shown) is mounted on such a metal header 6, and after bonding, the metal cap 12 is positioned using the positioning step 4, and the metal cap 12 is placed on the metal header 6. Cover weld.

FIG. 6 is a sectional view of the metal header 6 covered with the metal cap 12, and the positioning step 4 is located inside the inner peripheral surface of the metal cap 12. In the figure, l
indicates the distance of step 4.

[Problem to be solved by the invention]

Although the metal base of conventional metal headers is a small part,
Coining is essential, requiring the power of a press of 100 mm or more, and the material of the coining mold must be made of an expensive special carbide material with high hardness and toughness. Furthermore, in order to smoothly perform plastic flow of the metal material, annealing of the metal material is required. Therefore,
Such metal headers cannot be easily manufactured by any sheet metal manufacturer, and their manufacture is limited to manufacturers with large-capacity press equipment and heat treatment equipment.The metal header itself is expensive (and the cost of coining is The ratio was high.

In addition, since the desired processing rate of metal materials is high and the residual internal stress is large, the header metal during heating, such as decarburization heat treatment, oxidation heat treatment, glass sealing, strain relief, etc. during the hermetic process in the subsequent process of the metal header. It also caused thermal deformation of the main body. Furthermore, in the case of small-lot production, the allocation of expensive molds was expensive and was a factor in high costs.

An object of the present invention is to solve the above-mentioned problems and provide a metal header with positioning projections that is easy to manufacture and inexpensive.

[Means to solve the problem]

The present invention relates to a metal header that is covered with a cap to constitute a semiconductor package, and in which a plurality of protrusions for positioning with respect to the cap are provided by a half-punch method so as to protrude toward the side on which the cap is covered. It is characterized by

【Example〕

Next, the present invention will be explained in detail.

FIG. 1 is a diagram for explaining a round metal header as an example, FIG. 1(a) is a perspective view of a metal header and a metal cap, and FIG. 1(b) is a perspective view of a metal header. It is a sectional view in a state where it is covered with a metal cap. In FIG. 1, the same components as those of the conventional metal header shown in FIG. 5 are designated by the same numbers.

The round metal header 14 of this embodiment is constructed by providing four cylindrical positioning protrusions 18 by half punching on a single flat metal base 16.

This positioning protrusion 18 protrudes toward the inner side covered by the metal cap 12, and as shown in FIG. They are placed at equal angular intervals. These four positioning protrusions 18 are shown in FIG.
As shown in the figure, the inner peripheral surface 20 of the metal cap 12
It is arranged inside the inner peripheral surface 20 and substantially along the inner circumferential surface 20.

Such a cylindrical positioning projection 18 is formed by pressing a single flat metal base 16 with a half punch having a round cross section. Therefore, the metal base 16
A half-punch recess 22 is formed on the outer side of. At this time, the height of the positioning protrusions 18 is made to be the same as the distance l of the positioning steps in the conventional metal header, so that these protrusions 18 function in the same manner as the conventional positioning steps. There is.

A glass 8 is inserted into the hole provided in such a metal base 16.
are sealed and passed through the glass to connect electrical signal input/output terminals 10.
is pulled out to form the metal header 14. An IC chip 24 is joined and bonded to the metal header 14. When bonding IC chips, the recess 22 can be used as a hole for positioning the bonding device.

When covering the metal cap 12 on the metal solder 14, first, the four protrusions 1 provided on the metal solder 14 are
8 into the inner circumferential surface 20 of the metal cap 12,
Position the metal cap 12. Then, the metal cap 12 is placed on the metal header 14 and, for example, projection welded.

In this way, the metal header of this embodiment is provided with a positioning protrusion that has the same function as a conventional positioning step, so that the positioning of the metal cap is made easy and the positioning protrusion is made easier during welding. Improves work efficiency.

3 and 4 are diagrams for explaining a rectangular metal header as another embodiment, and FIG. 3 shows a metal header 26
and a perspective view of the metal cap 12, and FIG. 4 is a plan view of the metal cap 12 covered with the metal cap 12.

In the metal header 26 of this embodiment, six half-punched cylindrical positioning projections 18 are arranged in two rows of three, and in each row, the positioning projections 18 are
They are arranged at equal intervals. As shown in FIG. 4, these six positioning protrusions 18 are arranged inside the inner circumferential surface 28 of the metal cap 12 and substantially along the inner circumferential surface 28. It functions in the same way as the positioning step.

According to such a metal header, as in the case of the embodiment shown in FIG. 1, the use of the positioning protrusion facilitates positioning of the metal cap 12, thereby improving workability during welding.

Note that the metal header described in the above embodiments does not require coining processing, so it can be processed using a small-capacity press, and since this half-punch method is also a general press technology, it can be manufactured easily.

(Effects of the Invention) As explained above, the metal header of the present invention eliminates the need for an annealing process and also eliminates the need for a special carbide mold.
It has the advantage of requiring less initial investment and significantly reducing running costs. In addition, since it can be easily manufactured by any general press sheet metal manufacturer, mass production, small quantity production,
This structure is advantageous for any type of prototype production.

[Brief explanation of the drawing]

Figure 1 and figure, Figure 3 and Figures 5 and 5 It is a diagram. 12... 14... 16... 18... 20, 28... 22... 24... 26... Figure 2 shows an embodiment of the present invention. Figure 4 shows another embodiment; Figure 6 shows a conventional metal header metal cap round metal header metal base Positioning protrusion Inner surface of metal cap recess IC chip square metal header

Claims (1)

[Claims] (1) A metal header that is covered with a cap to form a semiconductor package, in which a plurality of protrusions for positioning with respect to the cap are provided using a half-punch method so as to protrude toward the side on which the cap is covered. A metal header with positioning protrusions.