JPS642440Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, and particularly to a semiconductor device in which a plurality of semiconductor chips are assembled in the same container.

Conventionally, there is an example of this type of semiconductor device as shown in FIG. 1 is a Darlington transistor chip, 2 and 3 are diode chips, 4 is a heat sink including a lead plate, 5 is a ceramic substrate, 6 is a conductive pattern, 7 is an external lead plate, and 8 is a connector. Such a structure has the disadvantage that the force applied from the outside to the external lead plate 7 is directly applied to the semiconductor chips 1, 2, and 3, easily destroying them. Another conventional example is one in which external lead plates are individually connected to necessary locations on a semiconductor chip by wires made of aluminum, copper, or the like. The roller-like structure had drawbacks such as an increase in the number of parts and increased costs.

The present invention aims to solve the above-mentioned drawbacks of the conventional device, and provides a semiconductor device that reduces the number of parts, is easy to manufacture, has a robust structure, and is inexpensive.

Hereinafter, the present invention will be explained in detail with reference to the drawings.

FIG. 2 is a perspective view showing an embodiment of the present invention, in which the same reference numerals as in FIG. 1 indicate the same parts.
The additional code 9 is a connector with a branched tip;
10 is a conductive connection point that relays the connector 9 and the external lead plate 7. Reference numeral 11 denotes a temporary connection part of the connector during the manufacturing process, which is provided as necessary to facilitate production, and is separated when completed. Further, 9' indicates a common part of the connector 9.

In FIG. 2, the connector 9 is formed of the same metal plate as the external lead plate 7, which has advantages such as a reduction in the number of parts and ease of handling.

Briefly, a Darlington transistor chip 1 on which a diode and a chip 2 are mounted, and a diode and a chip 3 are soldered onto a heat sink 4. This is placed on the conductive pattern on the ceramic substrate 5, and the ends of the external lead plate 7 and the connector 9 are placed on the conductive connection point 10 using a jig, and the connector 9 is placed at the required position on the semiconductor chip. I made sure that there was a connection at the end and soldered it. The structure of the present invention eliminates the manufacturing complexity of individually connecting wires from required locations on a semiconductor chip, and facilitates assembly in a belt furnace. In addition, there is also a temporary connection part 1 that integrates a plurality of connectors 9 to facilitate connection of the end connection parts of the connectors 9 to multiple electrodes of a semiconductor chip at the same time.
1 can be easily provided. Temporary connection part 11
is to be separated after assembly.

Therefore, as a structure for improving productivity, it is more effective to arrange the common portions 9' of the plurality of connectors 9 so as to face each other as shown in FIG. 2 so as to facilitate the provision of the temporary connection portions 11.

In the embodiment, a Darlington transistor and a diode are shown as semiconductor chips, but it goes without saying that other semiconductor chips, passive elements, etc. can be selectively combined as required.

The semiconductor device of the present invention reduces the number of parts, and the external force to the lead plate is not directly applied to the semiconductor chip, resulting in less breakage and damage during assembly and after the product is manufactured. Furthermore, it is easy to manufacture and inexpensive, and is useful in practice as an integrated circuit or a composite semiconductor device.

[Brief explanation of the drawing]

Figure 1 is an internal perspective view of a conventional semiconductor device; Figure 2 is an internal perspective view of a conventional semiconductor device;
The figure is an internal perspective view of the semiconductor device of the present invention. In the figure, 1 is a Darlington transistor chip, 2 and 3 are diode chips, 4 is a heat sink, 5 is a ceramic substrate, 6 is a conductive pattern, 7 is an external lead plate, 8 is a connector, 9 is a connector, and 9' is a A common part of the connector 9, 10 is a conductive connection part, and 11 is a temporary connection part.

Claims (1)

[Claims for Utility Model Registration] (1) In a semiconductor device in which a plurality of semiconductor chips are assembled in the same container via an insulating substrate, a connector with a branched end connection portion and an external lead are formed from the same metal plate. A semiconductor device comprising: a conductive connection point that relays the connector and the external lead; (2) Utility model registration claim No. 1 in which the connector and part of the external lead plate are fixed to the container via an insulator.
The semiconductor device described in (1). (3) A semiconductor device according to claim (1) or (2) of the utility model registration, in which common parts of a plurality of connectors are arranged facing each other.