JPH02177U - - Google Patents
Info
- Publication number
- JPH02177U JPH02177U JP1988077414U JP7741488U JPH02177U JP H02177 U JPH02177 U JP H02177U JP 1988077414 U JP1988077414 U JP 1988077414U JP 7741488 U JP7741488 U JP 7741488U JP H02177 U JPH02177 U JP H02177U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- socket
- metal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の実施例の斜視図で、第２図は
ＬＣＣ型ＩＣを収納した状態を側面角を中心に真
横より見た側面図である。
１……ソケツトの底面、２……底面の溝、３，
３′……側面部、４……端子、５……金属片、６
……側面角よりの通し空間、７……ＬＣＣ型ＩＣ
。
FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a side view of a state in which an LCC type IC is housed, as seen from the side, centering on a side corner. 1...Bottom of the socket, 2...Groove on the bottom, 3,
3'... Side part, 4... Terminal, 5... Metal piece, 6
...Through space from the side corner, 7...LCC type IC
.
Claims (1)
装置を収納するための側面部および底面部と、前
記側面部において前記半導体集積回路装置の端子
と接続する金属片と、その金属片より外部に信号
を伝える為の端子とを具備する半導体集積回路装
置用ソケツトにおいて、前記底面の対角線の全範
囲に沿つて設けた溝と、該溝の両端部に結合し前
記側面部の上端部に達する切り欠き部とを具備す
ることを特徴とする半導体集積回路装置のソケツ
ト。 A side surface and a bottom surface for housing a leadless chip carrier type semiconductor integrated circuit device, a metal piece connected to a terminal of the semiconductor integrated circuit device on the side surface, and a metal piece for transmitting a signal to the outside. In the socket for a semiconductor integrated circuit device, the socket has a groove provided along the entire diagonal range of the bottom surface, and a notch portion connected to both ends of the groove and reaching an upper end portion of the side surface portion. 1. A socket for a semiconductor integrated circuit device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077414U JPH02177U (en) | 1988-06-10 | 1988-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077414U JPH02177U (en) | 1988-06-10 | 1988-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02177U true JPH02177U (en) | 1990-01-05 |
Family
ID=31302400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988077414U Pending JPH02177U (en) | 1988-06-10 | 1988-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02177U (en) |
-
1988
- 1988-06-10 JP JP1988077414U patent/JPH02177U/ja active Pending
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