JPH0217839U - - Google Patents

Info

Publication number: JPH0217839U
Authority: JP; Japan
Prior art keywords: conductor layer; integrated circuit; layer; hybrid integrated; insulating substrate
Prior art date: 1988-07-19
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1988096284U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-07-19

Filing date

1988-07-19

Publication date

1990-02-06

1988-07-19 Application filed filed Critical

1988-07-19 Priority to JP1988096284U priority Critical patent/JPH0217839U/ja

1990-02-06 Publication of JPH0217839U publication Critical patent/JPH0217839U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

Wire Bonding (AREA)

JP1988096284U 1988-07-19 1988-07-19 Pending JPH0217839U (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1988096284U JPH0217839U (fr)	1988-07-19	1988-07-19

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1988096284U JPH0217839U (fr)	1988-07-19	1988-07-19

Publications (1)

Publication Number	Publication Date
JPH0217839U true JPH0217839U (fr)	1990-02-06

Family

ID=31321152

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1988096284U Pending JPH0217839U (fr)	1988-07-19	1988-07-19

Country Status (1)

Country	Link
JP (1)	JPH0217839U (fr)

1988
- 1988-07-19 JP JP1988096284U patent/JPH0217839U/ja active Pending

Publication	Publication Date	Title
JPH0217839U (fr)	1990-02-06
JPS6395271U (fr)	1988-06-20
JPH024281U (fr)	1990-01-11
JPH0193771U (fr)	1989-06-20
JPH01176936U (fr)	1989-12-18
JPH0183340U (fr)	1989-06-02
JPS63191637U (fr)	1988-12-09
JPS6393672U (fr)	1988-06-17
JPS61140573U (fr)	1986-08-30
JPH0165148U (fr)	1989-04-26
JPH0381678U (fr)	1991-08-21
JPH0187544U (fr)	1989-06-09
JPH0260280U (fr)	1990-05-02
JPS6393637U (fr)	1988-06-17
JPH0463653U (fr)	1992-05-29
JPH0233438U (fr)	1990-03-02
JPH0467369U (fr)	1992-06-15
JPH01116446U (fr)	1989-08-07
JPH0231190U (fr)	1990-02-27
JPS63124744U (fr)	1988-08-15
JPH0244328U (fr)	1990-03-27
JPH0351872U (fr)	1991-05-20
JPH0245642U (fr)	1990-03-29
JPS63185250U (fr)	1988-11-29
JPS63112371U (fr)	1988-07-19