JPH0217849U - - Google Patents

Info

Publication number
JPH0217849U
JPH0217849U JP1988096282U JP9628288U JPH0217849U JP H0217849 U JPH0217849 U JP H0217849U JP 1988096282 U JP1988096282 U JP 1988096282U JP 9628288 U JP9628288 U JP 9628288U JP H0217849 U JPH0217849 U JP H0217849U
Authority
JP
Japan
Prior art keywords
resin sealing
semiconductor device
sealing part
semiconductor chip
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988096282U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988096282U priority Critical patent/JPH0217849U/ja
Publication of JPH0217849U publication Critical patent/JPH0217849U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988096282U 1988-07-19 1988-07-19 Pending JPH0217849U (th)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988096282U JPH0217849U (th) 1988-07-19 1988-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988096282U JPH0217849U (th) 1988-07-19 1988-07-19

Publications (1)

Publication Number Publication Date
JPH0217849U true JPH0217849U (th) 1990-02-06

Family

ID=31321150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988096282U Pending JPH0217849U (th) 1988-07-19 1988-07-19

Country Status (1)

Country Link
JP (1) JPH0217849U (th)

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