JPH0217855Y2 - - Google Patents

Description

[Detailed description of the invention] Technical field: This invention relates to an encapsulation molding machine that encapsulates and molds each element of a lead frame, which is made up of a large number of small electric elements arranged in an array, with synthetic resin. The present invention relates to a device for efficiently transporting molding materials into a molding section, that is, a lower mold.

Purpose of the invention: Small electric devices such as ICs or LSIs are used in a state where they are encapsulated and molded into chips using synthetic resin. Using a base material, that is, a lead frame on which a large number of these elements are arranged in an array, is used as an intermediate process means, and the lead frame is sandwiched between the upper mold and the lower mold of the mold, and each element is encapsulated with synthetic resin. It's on.

In order to position the lead frame correctly on the lower mold, several positioning holes are drilled in it, and the positioning is performed by engaging the positioning holes with the positioning pins on the lower mold. The engagement is performed manually by an operator. Moreover, in this molding, several lead frames are arranged in parallel on the lower mold in order to obtain a large number of elements in one molding process in order to make this a mass production system. Therefore, the operator must arrange a large number of lead frames one by one on the rotating frame for each molding process, which is extremely inefficient. At the same time, such work increases worker fatigue and leads to incorrect placement, which is a problem.

This invention aims to provide a lead frame loading device that eliminates the conventional manual system and becomes an automatic system, which is capable of continuous automatic high efficiency, and also has a simple structure that allows accurate loading and is compatible with mass production systems. That is.

Composition of the invention: The lead frame loading device for an encapsulation molding machine provided by this invention has a lead frame holding frame that holds the lead frame received from the storage section with a forward downward slope and whose lower side end can be opened and closed. The lower end of this holding frame is opened, the lead frame is slid down, and while it is engaged with the positioning pin of the lower die, the holding frame is retreated and the lead frame is pulled out from the holding frame. The lead frame is adapted to be locked to the lower die, and is also provided with a mechanism for holding the lead frame inclined in its longitudinal direction and reciprocating the holding frame in this direction.

This invention will be explained below with reference to embodiments shown in the drawings. Fig. 1 is a front view showing the external appearance of an encapsulation molding machine equipped with a device according to this invention, in which a support 2 is installed on a machine base 1, a fixed platen 3 is installed at the upper end, and a movable platen 4 is installed in the middle. . As this movable platen 4 is raised by a drive mechanism K, the upper mold 7 and the lower mold 8 of the molds are brought into alignment. 5 is an upper die plate to which an upper die 7 is attached, and 6 is a lower die plate to which a lower die 8 is attached, each having a pin 9 opposed to a guide 10 so as to ensure reliable and accurate matching. has been done. 12 is a pot (cylinder) that presses the synthetic resin directly into the mold cavity and is installed in the upper mold 7, and 13 is a plunger that is inserted into this pot 12 by a drive mechanism 14 and extrudes the synthetic resin. . Further, 11 is a supply mechanism for supplying fluid synthetic resin material to each pot 12.

The above configuration is not directly related to the features of this invention, so a detailed explanation will be omitted.
In this encapsulation molding machine, a lead frame loading device FD, which is the essential part of this invention, is installed at the relative position shown in the figure.

As is clear from FIG. 2 showing its principle, the structure of the lead frame carrying device according to this invention includes a lead frame holding frame 15 that holds the lead frame LF at a forward downward slope. The lead frame LF is reciprocated up to the carry-in position H, and the lower end of the slope is opened at the lower die position H. Therefore, at this carry-in position H, the lead frame LF is removed from the holding frame 15. When the holding frame 15 retreats after sliding down and engaging with the pin 8P of the lower mold 8, the lead frame LF is pulled out from the holding frame 15 and is locked to the lower mold 8.

That is, as shown in FIG. 2, the holding frame 15 receives the lead frame LF at its accommodating portion position F and holds the lead frame LF at an angle (FIG. A). Next, the holding frame 15 is moved forward and brought to the position of the lower mold 8, that is, the carry-in position H (Figure B). From state A to state B, the support portion 16 of the holding frame 15 is in the closed state shown in the figure, preventing the lead frame LF from sliding down and holding it at an angle.
At this position, the arm 17 rotates clockwise about the support shaft 18, and the end of the support portion 16 is opened as shown in FIG. Then, the lead frame LF slides down and its positioning hole h engages with the positioning pin 8P of the lower mold 8. Next, when the holding frame 15 is moved backward or backward (Fig. D), the lower end of the lead frame LF is engaged with the lower die 8, so it is pulled out from the holding frame 15, and when the holding frame 15 returns (E
(Figure), the lead frame LF is completely locked onto the lower mold 8 and the loading is completed. Restored holding frame 1
5 is replenished with a new lead frame LF from above as shown in (Figure A).

The above is a lead frame loading device based on this invention.
The basic operation of the FD is shown, and the configuration of a specific device for realizing such operation is shown in FIGS. 3 to 5. In the specific equipment shown in these drawings, multiple rectangular lead frames LF are molded at the same time, so the carrying device also carries in multiple pieces (four in the illustrated example) in parallel at the same time. shown on the device. FIG. 3 is a side view showing more specifically the relationship between the holding frame 15 and the lower die 8 in the principle explanatory diagram of FIG. 2, and parts with the same reference numerals as those in FIG. Explanation will be omitted.

The holding frame 15 is installed on a movable plate 26 with a base plate 20 interposed therebetween at a constant forward and downward inclination angle. Movable plate 26
are spaced apart in the vertical direction in the drawing at intervals that allow the four lead frames LF to be aligned, and their upper portions are vertically disposed on the reciprocating frame 27. This movable frame 27 is a fixed frame 2 fixed to the molding machine.
It is inserted into a guide rod 30 interposed between 8 and 29 so as to be able to slide left and right, and is reciprocated by an output rod 33 of an air cylinder 34. 32 is a fixture for fixing the connecting rod 31 fixed to the movable frame 27 to the output rod 33. The air cylinder 34 is fixedly installed on the machine base 36 via a fixture 35, and air is introduced from a pipe (not shown) in accordance with the operation of the mold, that is, the operation of encapsulation molding, and is operated and held in sequence. The frame 15 is reciprocated from the storage position F to the carry-in position H. Two guide rods 30 are provided. Reference numeral 40 denotes a storage case in which a large number of lead frames LF are tilted and loaded in accordance with the inclination angle of the holding frame 15, and 39 is a storage case when the holding frame 15 is located at this storage position F (FIG. 2A, Figure E)
This is a feed roller that feeds one lead frame LF from the storage case 40 onto the upper surface of the holding frame 15. The operation of this roller 39 and the operation of sequentially lifting the storage case 40 upward as the sheets are fed out one by one are all related to the molding operation and are accomplished by operating a drive mechanism in response to a signal from a sequence circuit.

The relationship between the loading device FD and the lower mold 8 is shown in Fig. 4 when viewed from above, but this Fig. 4 is similar to Fig. 2 E.
Each lead frame LF shows the state on the verge of reaching the figure.
This shows the state immediately after being carried into the lower mold 8. The positioning hole h of each lead frame LF is fitted with a similar pin 8P, so that the lead frame is correctly positioned (positioned) and transported. Carrying in is performed by the backward movement (arrow M) of the holding frame 15.

By the way, in FIG. 3, when the holding frame 15 moves forward and reaches the carry-in position H, the fixed frame 28 and the movable frame 27
Proximity switches (or microswitches) 37 and 38 attached to the corresponding surfaces of are activated to detect the arrival of the carry-in position. In response to this detection signal, the support portion 16 in the holding frame 5 performs an opening operation, and the details of this opening/closing operation mechanism are shown in FIG. FIG. 5 is a side view showing an enlarged portion of the holding frame 15 in FIG. 3. FIG.

The right end of 21 is the flange portion 20 of the board 20.
An air cylinder is pivotally connected to F by a pin 21P and is actuated by the detection signal to cause the rod 22 to protrude by a certain amount. Support part 16
The arm 17, which is attached to the left end, is swingably supported by a pin 19, and further has a lever 25 integrally attached thereto. This lever 25 is connected to the board 20
The end 23 of the rod 22 is swingably connected to the rod 22 via a pin 24, which extends downward through the penetrating portion 20M. Therefore, when the rod 22 protrudes by a certain amount due to the detection signal, the lever 25 moves to 2.
The arm 17 swings as shown by the dotted chain line, and accordingly, the arm 17 similarly swings as shown by the two-dot chain line, displacing the support part (stopper) 16 upward, opening the lower end of the lead frame LF, and lowering the mold. This allows for a descent to 8.

The features and principles of the lead frame loading device according to this invention are as described above, but its specific configuration is not limited to the devices shown in FIGS. 3 to 5.

For example, although the reciprocating movement of the holding frame is performed using an air cylinder method, it may also be performed using a chain mechanism. Further, in the illustrated example, four lead frames are brought in at the same time, but any number of lead frames may be used.
The opening/closing mechanism of the end portion for allowing the lead frame to slide down and down is also shown in the embodiment shown in FIG. 5 as an example, and various other methods other than the air cylinder method may be adopted, such as a cam method, a pinion/rack method, etc. .

This invention encompasses all of these variations.

Effects of the invention: The lead frame loading device in the encapsulation molding machine according to this invention is as detailed above.
It has become possible to carry out the operation of carrying the lead frame into the lower die extremely efficiently. Moreover, it is possible to carry in multiple lead frames simultaneously, accurately and quickly, and it is also possible to carry in them repeatedly, which greatly contributes to automation and mass production, and significantly improves the performance of the encapsulation molding machine.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing the external appearance of an encapsulation molding machine equipped with this invention, Fig. 2 is a diagram for explaining the principle of this invention, and Figs. 3 to 5 are details of a lead frame loading device according to this invention. FIG. 3 is a side view, FIG. 4 is a plan view, and FIG. 5 is an enlarged side view of main parts. 7...Upper die, 8...Lower die, 8P...Positioning pin, 15...Holding frame, 16...Support part, 17...
...Arm, 18...Spindle, 19, 21P, 24...
...Pin, 20... Board, 20F... Flange part,
21...Air cylinder, 22...Rod, 25...
...Lever, 26...Movable plate, 27...Movable frame, 2
8, 29... Fixed frame, 30... Guide rod, 3
3...Output rod, 34...Air cylinder, 3
7,38...Proximity switch.

Claims (1)

[Scope of utility model registration request] After carrying in a lead frame in which a large number of small electric elements are aligned and positioned by engaging its positioning hole with the positioning pin in the lower mold of the mold, the lead frame is placed between the upper mold and the lower mold of the mold. Scissors In an encapsulation molding machine that encapsulates and molds the elements on each of these lead frames with synthetic resin, the lead frame received from the storage position is held tilted forward and downward, and its lower end can be opened and closed. a lead frame holding frame configured, a reciprocating mechanism that reciprocates the lead frame holding frame between a lead frame housing position and a lower die position;
The lower end of the lead frame holding frame is opened at the lower mold position and the lead frame slides down to the lower mold position. Encapsulated molding characterized by being configured so that it slides down by opening the side end and is engaged with a positioning pin in the lower mold, and as the holding frame moves back, it is pulled out from the holding frame and locked to the lower mold. Lead frame loading device in the machine.