JPH02178992A - Manufacture of thick film circuit substrate - Google Patents
Manufacture of thick film circuit substrateInfo
- Publication number
- JPH02178992A JPH02178992A JP63333331A JP33333188A JPH02178992A JP H02178992 A JPH02178992 A JP H02178992A JP 63333331 A JP63333331 A JP 63333331A JP 33333188 A JP33333188 A JP 33333188A JP H02178992 A JPH02178992 A JP H02178992A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- copper conductor
- electronic component
- solder
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器に使用される厚膜回路基板の電子部
品接着用半田と厚膜銅導体酸化防止用半田とを同時形成
を有する厚膜回路基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is directed to a thick film circuit that simultaneously forms a solder for bonding electronic components of a thick film circuit board used in electronic equipment and a solder for preventing oxidation of a thick film copper conductor. The present invention relates to a method of manufacturing a substrate.
従来の技術
近年、アルミナ基板上に厚膜印刷法を用いて、導体や抵
抗体を形成し、かつ電子部品もその基板上に搭載をして
モジュール化することで、小型化および高密度実装がな
されている。Conventional technology In recent years, miniaturization and high-density packaging have been achieved by forming conductors and resistors on alumina substrates using thick film printing, and by mounting electronic components on the substrates to create modules. being done.
以下、図面を参照しながら、従来の厚膜囲路基板の一例
について説明する。An example of a conventional thick film enclosure substrate will be described below with reference to the drawings.
第２図は、従来の厚膜回路基板の断面図を示すものであ
る。第２図において、１はアルミナ基板、２は銅導体、
３は絶縁体、４′は半田、６は電子部品である。すなわ
ち、従来の厚膜回路基板では、アルミナ基板１上に銅導
体２は形成され、電子部品５を搭載する箇所の銅導体２
上に半田４の塗布を行い電子部品５を搭載したのち、リ
フロー等によシ半田４は固着され銅導体２と電子部品５
が接続される。FIG. 2 shows a cross-sectional view of a conventional thick film circuit board. In Figure 2, 1 is an alumina substrate, 2 is a copper conductor,
3 is an insulator, 4' is a solder, and 6 is an electronic component. That is, in the conventional thick film circuit board, the copper conductor 2 is formed on the alumina substrate 1, and the copper conductor 2 is formed on the alumina substrate 1, and the copper conductor 2 is formed on the alumina substrate 1.
After applying the solder 4 on the top and mounting the electronic component 5, the solder 4 is fixed by reflow etc., and the copper conductor 2 and the electronic component 5 are bonded together.
is connected.
発明が解決しようとする課題
ところが、」二記の様な構成では、アルミナ基板１上に
形成された銅導体２の半田４が塗布されていない部分の
銅導体２は、リフロー等の熱により銅導体２の表面が酸
化されることにより、半田４１１４れ性や信頼性に犬き
寿障害となるという課題があった。Problem to be Solved by the Invention However, in the configuration as described in Section 2, the portions of the copper conductor 2 formed on the alumina substrate 1 to which the solder 4 is not applied are exposed to copper due to heat such as reflow. When the surface of the conductor 2 is oxidized, there is a problem in that the wearability and reliability of the solder 4114 are impaired.
本発明はこの様な従来の課題の解決に大きく貢献できる
ものであシ、半田濡れ性や信頼性の良い厚膜回路基板の
製造方法を提供するものである。The present invention can greatly contribute to solving these conventional problems, and provides a method for manufacturing a thick film circuit board with good solder wettability and reliability.
３１＼−ノ
課題を解決するための手段
本発明の厚膜回路基板の製造方法は、アルミナ基板上の
厚膜銅導体に形成された電子部品接着用半田と厚膜銅導
体酸化防止用半田とを同時形成されることを備えたもの
である。31\-Means for Solving the Problems The method for manufacturing a thick film circuit board of the present invention includes a solder for bonding electronic components formed on a thick film copper conductor on an alumina substrate, a solder for preventing oxidation of the thick film copper conductor, and are formed at the same time.
作 用
本発明の厚膜回路基板の製造方法は、アルミナ基板上に
形成された銅導体の全電極部分にクリーム半田を印刷形
成するものであるから、リフロー等による熱の影響によ
る銅導体の酸化は防止されることにより、後工程による
電子部品の半田付けは、半田濡れ性や信頼性の高いもの
が得られる。Function: Since the method for manufacturing a thick film circuit board of the present invention prints cream solder on all electrode parts of a copper conductor formed on an alumina substrate, oxidation of the copper conductor due to the influence of heat due to reflow etc. By preventing this, it is possible to obtain high solder wettability and reliability in soldering of electronic components in a post-process.
実施例
以下、本発明の一実施例の厚膜回路基板の製造方法を図
面を参照して説明する。EXAMPLE Hereinafter, a method for manufacturing a thick film circuit board according to an example of the present invention will be explained with reference to the drawings.
第１図は本発明の断面図である。第１図に示す様に、ア
ルミナ基板１上に形成された銅導体２上には、電子部品
５が搭載される導体と搭載されない導体にも最初に半田
５にて印刷をし、その次に電子部品６を搭載しりフロー
等によシ半田５が固着される。すなわち、電子部品が搭
載されない導体５にも半田４でコートされるのでリフロ
ー等の熱の影響による銅導体５の酸化は防止されること
になり、後工程時による電子部品５の半田側けは、半田
濡れ性の良い厚膜回路基板が得られる。FIG. 1 is a cross-sectional view of the present invention. As shown in FIG. 1, on the copper conductor 2 formed on the alumina substrate 1, the conductor on which the electronic component 5 is mounted and the conductor on which the electronic component 5 is not mounted are first printed with solder 5, and then After mounting the electronic component 6, the solder 5 is fixed by flow or the like. In other words, since the conductor 5 on which no electronic component is mounted is also coated with the solder 4, oxidation of the copper conductor 5 due to the influence of heat during reflow etc. is prevented, and the solder side of the electronic component 5 during post-processing is prevented. , a thick film circuit board with good solder wettability can be obtained.
発明の効果
以」二の様に本発明の厚膜回路基板の製造方法は、アル
ミナ基板上に形成される厚膜銅導体上にあらかじめ電子
部品接着用と厚膜銅導体酸化防止用半田とを同時形成す
ることにより、リフロー等の影響による銅導体酸化は防
止されることにより後工程時による半田付は作業は半田
濡れ性の良い厚膜回路基板が得られる。Effects of the Invention As described in Section 2, the method for manufacturing a thick film circuit board of the present invention includes applying solder for bonding electronic components and for preventing oxidation of the thick film copper conductor to the thick film copper conductor formed on the alumina substrate in advance. By forming them at the same time, oxidation of the copper conductor due to the effects of reflow etc. can be prevented, and a thick film circuit board with good solder wettability can be obtained during soldering in the subsequent process.
第１図は本発明の一実施例における厚膜回路基板の断面
図、第２図は従来の厚膜回路基板の断面図である。
１・・・・・・アルミナ基板、２・・・・・銅導体、３
・・・・−・絶縁体、４，４′・・・・・・半田、Ｓ・
・・・電子部品。FIG. 1 is a sectional view of a thick film circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional thick film circuit board. 1...Alumina substrate, 2...Copper conductor, 3
......Insulator, 4,4'...Solder, S.
...Electronic parts.
Claims (1)
用半田と厚膜銅導体酸化防止用半田とを同時形成してな
ることを特徴とした厚膜回路基板の製造方法。A method for producing a thick film circuit board characterized by simultaneously forming a solder for adhering electronic components to a thick film copper conductor on an alumina substrate and a solder for preventing oxidation of the thick film copper conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63333331A JPH02178992A (en) | 1988-12-29 | 1988-12-29 | Manufacture of thick film circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63333331A JPH02178992A (en) | 1988-12-29 | 1988-12-29 | Manufacture of thick film circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02178992A true JPH02178992A (en) | 1990-07-11 |
Family
ID=18264918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63333331A Pending JPH02178992A (en) | 1988-12-29 | 1988-12-29 | Manufacture of thick film circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02178992A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100906710B1 (en) * | 2008-01-24 | 2009-07-07 | 대덕전자 주식회사 | Copper foil pad structure and processing method for chip surface mounting |
| JP2011014620A (en) * | 2009-06-30 | 2011-01-20 | Yazaki Corp | Method for manufacturing metal core substrate |
| US8080731B2 (en) * | 2007-06-15 | 2011-12-20 | The Boeing Company | Restrained solar collector and method |
-
1988
- 1988-12-29 JP JP63333331A patent/JPH02178992A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8080731B2 (en) * | 2007-06-15 | 2011-12-20 | The Boeing Company | Restrained solar collector and method |
| KR100906710B1 (en) * | 2008-01-24 | 2009-07-07 | 대덕전자 주식회사 | Copper foil pad structure and processing method for chip surface mounting |
| JP2011014620A (en) * | 2009-06-30 | 2011-01-20 | Yazaki Corp | Method for manufacturing metal core substrate |
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