JPH02181994A - Flexible board mounting structure - Google Patents

Flexible board mounting structure

Info

Publication number
JPH02181994A
JPH02181994A JP247689A JP247689A JPH02181994A JP H02181994 A JPH02181994 A JP H02181994A JP 247689 A JP247689 A JP 247689A JP 247689 A JP247689 A JP 247689A JP H02181994 A JPH02181994 A JP H02181994A
Authority
JP
Japan
Prior art keywords
mounting structure
flexible board
pattern
board mounting
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP247689A
Other languages
Japanese (ja)
Inventor
Kiyoyuki Shibata
柴田　清幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP247689A priority Critical patent/JPH02181994A/en
Publication of JPH02181994A publication Critical patent/JPH02181994A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 ［産業上の利用分野コ 本発明は、ラジアル部品をフレキシブル基板に半田付け
する際の実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure for soldering a radial component to a flexible substrate.

［従来の技術］ 従来のフレキシブル基板実装構造を第４図及び第５図を
用いて説明する。[Prior Art] A conventional flexible board mounting structure will be described with reference to FIGS. 4 and 5.

フレキシブル基板３上に配置した銅箔パターン４の表側
にリードｔｌ！極２を半田付けすることにより、ラジア
ル部品１を実装していた。A lead tl! is attached to the front side of the copper foil pattern 4 placed on the flexible substrate 3. The radial component 1 was mounted by soldering the pole 2.

［発明が解決しようとする課題］ 上記の従来例の場合には隣り合ったリード電極２を銅箔
ハタ−２４０表側でのみ半田付けしている為、パターン
間が半田によりショートしてしまうという間諒点があっ
た。[Problems to be Solved by the Invention] In the case of the above conventional example, since the adjacent lead electrodes 2 are soldered only on the front side of the copper foil layer 240, short circuits may occur between the patterns due to soldering. There was a point.

そこで本発明は、銅箔パターン間を半田によりショート
させることなく、ラジアル部品をフレキシブル基板に実
装することを目的とする。Therefore, an object of the present invention is to mount a radial component on a flexible substrate without causing a short circuit between copper foil patterns by soldering.

［課題を解決するための手段］ 本発明のフレキシブル基板実装構造は、同一方向に２本
以上のリード電極を有する部品を半田付けするのに、基
板の銅箔パターンを１個おきにオーバーハングさせて形
成し、パターンの表と裏とを交互に使用することを特徴
とする特 ［実施例］ 第１図は、本発明の一実施例の平面図であり、第２図は
その断面図である。[Means for Solving the Problems] The flexible board mounting structure of the present invention requires overhanging every other copper foil pattern on the board when soldering components having two or more lead electrodes in the same direction. [Embodiment] Fig. 1 is a plan view of an embodiment of the present invention, and Fig. 2 is a sectional view thereof. be.

ラジアル部品１をフレキシブル基板５に実装するの釦、
基板上に配置された銅箔パターン４のリード電極２′側
をオーバーハングさせて形成してオイて、リード電極２
をパターンの表側に、リード電極２′をパターンの裏側
に半田付けしているまた、第３図は本発明の他の実施例
のフレキシブル基板実装構造を示す図である。A button for mounting the radial component 1 on the flexible board 5,
The lead electrode 2' side of the copper foil pattern 4 arranged on the substrate is formed by overhanging the lead electrode 2' side.
is soldered to the front side of the pattern, and the lead electrode 2' is soldered to the back side of the pattern. FIG. 3 is a diagram showing a flexible board mounting structure according to another embodiment of the present invention.

図面中１１′は共にラジアル部品であり、これらをフレ
キシブル基板３に実装するのに、基板上に配置されたｍ
箔パターン４のリード電極２′側をオーバーハングさせ
て形成しておいて、部品１のリード電極２をパターンの
表側に、部品１′のリード電極２′を裏側にと交互に半
田付けしている。In the drawing, 11' are both radial parts, and in order to mount these on the flexible board 3,
The lead electrode 2' side of the foil pattern 4 is formed to overhang, and the lead electrode 2 of component 1 is soldered to the front side of the pattern, and the lead electrode 2' of component 1' is soldered to the back side of the pattern. There is.

尚、上記発明中のラジアル部品１１′については、同一
方向に２本以上のリード？Ｗ　％があれば、同じ部品で
も種類の違う部品でもかまわない。In addition, regarding the radial component 11' in the above invention, are there two or more leads in the same direction? As long as there is a W%, it doesn't matter whether the parts are the same or different types.

［発明の効果］ 以上説明した様に、本発明によれば、同一方向に２本以
上のリード電極を有する部品を半田付けするのに、基板
の銅箔パターンを１（ＩＩＩ！おきにオーバーハングさ
せて形成し、パターンの表と裏とを交互に使用すること
により、パターン間をショートさせることな（、部品の
フレキシブル基板への実装が可能である。[Effects of the Invention] As explained above, according to the present invention, when soldering a component having two or more lead electrodes in the same direction, the copper foil pattern on the board is overhanged every 1 (III!). By forming the pattern in parallel and using the front and back sides of the pattern alternately, it is possible to mount components on a flexible substrate without shorting between the patterns.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の平面図、第２図はその断面
図。第５図は本発明の他の実施例の断面図。 Ｗ、４図は従来の実装＋＋４造の平面図、第５図はその
断面図。 １　１’・・・・・・ラジアル部品 ２　　、　２　′　　・・・　・・・　リ　−　　ド　
電　極３　　　・・・・・・７レキシプル基板４・・・
・・・・・・銅箔パターン ５・・・・・・・・・半　田 以上FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view thereof. FIG. 5 is a sectional view of another embodiment of the invention. W, Figure 4 is a plan view of a conventional mounting ++4 construction, and Figure 5 is a cross-sectional view thereof. 1 1'... Radial parts 2, 2'... Lead
Electrode 3...7 Lexiple board 4...
・・・・・・Copper foil pattern 5・・・・・・More than solder

Claims (1)

【特許請求の範囲】[Claims] 　同一方向に２本以上のリード電極を有する部品を半田
付けするのに、基板の銅箔パターンを１個おきにオーバ
ーハングさせて形成し、パターンの表と裏とを交互に使
用することを特徴としたフレキシブル基板実装構造。When soldering parts that have two or more lead electrodes in the same direction, the copper foil pattern on the board is formed by overhanging every other piece, and the front and back sides of the pattern are used alternately. Flexible board mounting structure.
JP247689A 1989-01-09 1989-01-09 Flexible board mounting structure Pending JPH02181994A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP247689A JPH02181994A (en) 1989-01-09 1989-01-09 Flexible board mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP247689A JPH02181994A (en) 1989-01-09 1989-01-09 Flexible board mounting structure

Publications (1)

Publication Number Publication Date
JPH02181994A true JPH02181994A (en) 1990-07-16

Family

ID=11530389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP247689A Pending JPH02181994A (en) 1989-01-09 1989-01-09 Flexible board mounting structure

Country Status (1)

Country Link
JP (1) JPH02181994A (en)

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