JPH0218590B2 - - Google Patents
Info
- Publication number
- JPH0218590B2 JPH0218590B2 JP310282A JP310282A JPH0218590B2 JP H0218590 B2 JPH0218590 B2 JP H0218590B2 JP 310282 A JP310282 A JP 310282A JP 310282 A JP310282 A JP 310282A JP H0218590 B2 JPH0218590 B2 JP H0218590B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- oxide film
- aluminum oxide
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
（発明の技術分野）
本発明はアルミニウム板を絶縁基板として用い
た印刷配線板に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a printed wiring board using an aluminum plate as an insulating substrate.
（発明の技術的背景とその問題点）
従来より、印刷配線板に使用される絶縁基板と
しては、紙基材フエノール樹脂積層板、紙基材エ
ポキシ樹脂積層板或いはガラス基材エポキシ樹脂
積層板などの合成樹脂積層板が主であつた。(Technical background of the invention and its problems) Conventionally, insulating substrates used for printed wiring boards include paper-based phenolic resin laminates, paper-based epoxy resin laminates, glass-based epoxy resin laminates, etc. The main product was synthetic resin laminates.
しかしながらこのような合成樹脂積層板を使用
した印刷配線板は、熱放散性が悪く、このため配
線回路やその搭載部品などから発生した熱が基板
に著積されて回路の温度上昇を招きやすく、この
ことが配線板或いはこれを用いた電子機器の信頼
性を低下させる一因となつていた。 However, printed wiring boards using such synthetic resin laminates have poor heat dissipation properties, and as a result, heat generated from the wiring circuits and their mounted components is likely to accumulate on the board, causing a rise in the temperature of the circuits. This has been a factor in reducing the reliability of the wiring board or electronic equipment using the same.
またはんだ付け作業などの際に基板が熱により
反りやねじれなどの変形を生じて寸法安定性が悪
く、また吸湿性も大きいため配線回路間の絶縁特
性が低下するという問題があつた。 Also, during soldering work, the board is deformed by heat such as warping and twisting, resulting in poor dimensional stability, and also has high moisture absorption, which causes problems in that insulation properties between wiring circuits deteriorate.
このため特に熱放散性を要求される分野に使用
される印刷配線板には、熱放散性の高いアルミニ
ウム板を基板として用いる試みがなされている
が、金属アルミニウムの表面に全ての特性に優れ
た絶縁層を形成することができないため、理想的
な印刷配線板を得ることができないのが今日まで
の現状である。 For this reason, attempts have been made to use aluminum plates with high heat dissipation properties as substrates for printed wiring boards used in fields where heat dissipation properties are particularly required. The current situation to date is that an ideal printed wiring board cannot be obtained because an insulating layer cannot be formed.
（発明の目的）
本発明はこれらの点に鑑みなされたもので、絶
縁基板の熱放散性が高いばかりでなく、熱による
変形や吸湿による絶縁劣化がないなど、理想的な
印刷配線板を提供することを目的とする。(Objective of the Invention) The present invention has been made in view of these points, and provides an ideal printed wiring board that not only has an insulating substrate with high heat dissipation properties, but also has no deformation due to heat or insulation deterioration due to moisture absorption. The purpose is to
（発明の概要）
すなわち本発明の印刷配線板は、図面に示すよ
うに、アルミニウム板１の上に絶縁性の酸化アル
ミニウム皮膜２を設けたものを基板とし、その上
に金属溶射法により導体回路３を形成し、さらに
その上に熱硬化性絶縁性樹脂の含浸硬化層４を設
けて構成される。(Summary of the Invention) As shown in the drawings, the printed wiring board of the present invention has an aluminum plate 1 on which an insulating aluminum oxide film 2 is provided as a substrate, and conductor circuits are formed on the substrate by a metal spraying method. 3 and further provided with an impregnated hardened layer 4 of thermosetting insulating resin thereon.
ここで含浸層を形成する絶縁性樹脂としては、
フエノール樹脂、エポキシ樹脂、ポリイミド樹脂
などの熱硬化性樹脂を使用することが好ましく、
含浸方法としては、多孔性の酸化アルミニウム皮
膜２および導体回路３中の空隙部に絶縁性樹脂を
完全に含浸させ、これらを強固に固めるという意
味から、特に真空含浸法を用いるのが好ましい。 Here, the insulating resin forming the impregnated layer is as follows:
It is preferable to use thermosetting resins such as phenolic resins, epoxy resins, and polyimide resins.
As the impregnation method, it is particularly preferable to use a vacuum impregnation method in order to completely impregnate the voids in the porous aluminum oxide film 2 and the conductor circuit 3 with the insulating resin and solidify them.
また本発明の印刷配線板においては、導体回路
の上表面が酸化皮膜で覆われたり、上記絶縁性樹
脂が付着していることが多々あるため、その表面
を研摩し導電性を向上させることが望ましい。 Furthermore, in the printed wiring board of the present invention, the upper surface of the conductor circuit is often covered with an oxide film or has the above-mentioned insulating resin attached, so it is difficult to polish the surface to improve conductivity. desirable.
一般に酸化アルミニウム皮膜や金属溶射法によ
り形成された導体回路部分は、多孔性でピンホー
ルや傷などが生じやすいため、絶縁皮膜や回路と
して充分なものではなく、さらに吸湿耐圧特性や
耐衝撃特性が悪く耐圧不良や界面クラツク等が生
じやすい等の欠点があるが、本発明の印刷配線板
においては、酸化アルミニウム皮膜と導体回路中
の微細な空隙内に絶縁性樹脂が含浸され空隙を完
全に充填している。従つてアルミニウム板とその
上の酸化アルミニウム皮膜、および酸化アルミニ
ウム皮膜と導体回路はこの含浸樹脂層により相互
に強固に接着されており、これらの密着性が極め
て良好であり耐久性にも優れた印刷配線板が得ら
れている。 In general, aluminum oxide films and conductor circuit parts formed by metal spraying are porous and prone to pinholes and scratches, so they are not sufficient as insulating films or circuits, and they also lack moisture absorption and pressure resistance and impact resistance. However, in the printed wiring board of the present invention, the insulating resin is impregnated into the minute voids in the aluminum oxide film and the conductor circuit, completely filling the voids. are doing. Therefore, the aluminum plate and the aluminum oxide film on it, and the aluminum oxide film and the conductor circuit are strongly adhered to each other by this impregnated resin layer, and the adhesion between these is extremely good and the printing has excellent durability. A wiring board has been obtained.
（発明の実施例）
下記の条件でアルミニウム板を陽極酸化処理し
表面に酸化アルミニウム皮膜を形成した。(Example of the Invention) An aluminum plate was anodized under the following conditions to form an aluminum oxide film on the surface.
浴組成 H2SO4 ５〜25重量％、
Al2（SO4）3 １〜50ｇ／
浴温度 15〜25℃
浴電圧 DC15〜20V
電流密度 0.5〜3A／ｄm2
次にこの酸化アルミニウム皮膜の上に所定のパ
ターンのレジスト皮膜を印刷し、その上に銅を溶
射した後レジスト皮膜をはがして導体回路を形成
した。次いで全体にTVB2707〔東芝ケミカル(株)製
ポリイミド系熱硬化型樹脂〕を真空含浸した後樹
脂含浸層を加熱硬化させ、さらに導体回路の表面
を研摩して印刷配線板を得た。こうして得られた
印刷配線板は基板絶縁層の密着性や絶縁特性が良
好であり、その上に形成された回路の密着性や導
電性も優れたものであつた。Bath composition H 2 SO 4 5 to 25% by weight, Al 2 (SO 4 ) 3 1 to 50 g/Bath temperature 15 to 25°C Bath voltage DC 15 to 20 V Current density 0.5 to 3 A/dm 2nd Next, on this aluminum oxide film A resist film with a predetermined pattern was printed on the substrate, copper was thermally sprayed thereon, and then the resist film was peeled off to form a conductive circuit. Next, the entire board was vacuum impregnated with TVB2707 (polyimide thermosetting resin manufactured by Toshiba Chemical Corporation), the resin-impregnated layer was cured by heating, and the surface of the conductive circuit was further polished to obtain a printed wiring board. In the printed wiring board thus obtained, the substrate insulating layer had good adhesion and insulation properties, and the circuit formed thereon had excellent adhesion and conductivity.
（発明の効果）
以上の記載から明らかなように、本発明の印刷
配線板は、従来の合成樹脂積層板を基板として用
いたものに比べて基板の熱放散性に優れており、
反りやねじれ等の変形が生じないので、各種パワ
ートランジスタの実装に好適している。(Effects of the Invention) As is clear from the above description, the printed wiring board of the present invention has superior heat dissipation properties as compared to those using conventional synthetic resin laminates as substrates.
Since deformation such as warping or twisting does not occur, it is suitable for mounting various power transistors.
また、絶縁性樹脂によつて酸化皮膜が完全に封
孔されているので、絶縁特性が高く、また吸湿に
よる配線回路間の絶縁劣化がないので、信頼性の
極めて高いものといえる。 Furthermore, since the oxide film is completely sealed by the insulating resin, the insulation properties are high, and there is no deterioration of the insulation between the wiring circuits due to moisture absorption, so it can be said to be extremely reliable.
図面は本発明の拡大断面説明図である。
１……アルミニウム板、２……酸化アルミニウ
ム皮膜、３……金属溶射法による導体回路、４…
…絶縁性樹脂の含浸硬化層。
The drawing is an enlarged cross-sectional explanatory view of the present invention. 1... Aluminum plate, 2... Aluminum oxide film, 3... Conductor circuit by metal spraying method, 4...
...An impregnated hardened layer of insulating resin.
Claims (1)
を設けてなる基板の上に、金属溶射法により導体
回路を形成し、さらにその上に熱硬化型絶縁性樹
脂の含浸層を設けて成ることを特徴とする印刷配
線板。 ２ 導体回路の表面が研摩されていることを特徴
とする特許請求の範囲第１項記載の印刷配線板。[Claims] 1. A conductor circuit is formed by metal spraying on a substrate formed by providing an aluminum oxide film on an aluminum plate, and an impregnated layer of thermosetting insulating resin is further provided on the substrate. A printed wiring board characterized by: 2. The printed wiring board according to claim 1, wherein the surface of the conductor circuit is polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP310282A JPS58121695A (en) | 1982-01-12 | 1982-01-12 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP310282A JPS58121695A (en) | 1982-01-12 | 1982-01-12 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58121695A JPS58121695A (en) | 1983-07-20 |
| JPH0218590B2 true JPH0218590B2 (en) | 1990-04-26 |
Family
ID=11547979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP310282A Granted JPS58121695A (en) | 1982-01-12 | 1982-01-12 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58121695A (en) |
-
1982
- 1982-01-12 JP JP310282A patent/JPS58121695A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58121695A (en) | 1983-07-20 |
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