JPH021859Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field This invention relates to a method for manufacturing a shroud used in an apparatus for manufacturing a film-like semiconductor containing Ga.

In this specification, the term "aluminum" includes not only pure aluminum but also aluminum alloys.

Conventional technology and its problems For example, MBE of semiconductor films containing Ga such as GaAs
When manufacturing with semiconductor manufacturing equipment such as equipment, film formation in an ultra-high vacuum is an essential condition in order to obtain higher performance. Therefore,
A shroud is used in the deposition chamber of the MBE equipment. A conventional shroud has a cylindrical shape made of a stainless steel plate, and a stainless steel tube is spirally wound around the outer peripheral surface of the shroud, and a cooling fluid such as liquid nitrogen flows through the tube. When forming the semiconductor film, first, the shroud is heated to 200 to 250°C to perform a baking treatment to remove moisture adsorbed on the surface of the shroud, and then a cooling fluid is poured into the stainless steel tube. The shroud is cooled by this cooling fluid, and the remaining gas in the evacuated film forming chamber is adsorbed on its surface to obtain an ultra-high vacuum.
However, in conventional shrouds, the cylinder body and tube are made of stainless steel, so they are heavy and
Moreover, there was a problem that the thermal conductivity was not sufficient. If the thermal conductivity is insufficient, it will take time for the entire shroud to be evenly heated during the above-mentioned baking process, and it will also take time for the surface of the shroud to cool down to a predetermined temperature when cooling fluid is flowed. There was a problem.

Therefore, it has been considered to make a shroud using aluminum, which is lighter in weight than stainless steel, has excellent thermal conductivity, and has a small surface gas release coefficient. The reality is that shrouds made of aluminum have not yet been realized because if they adhere, they will corrode and create through holes.

The purpose of this invention is to provide a shroud for semiconductor manufacturing equipment that solves the above problems.

Means for Solving the Problems The shroud for semiconductor manufacturing equipment according to this invention has a stainless steel plate clad on the inner surface of an aluminum body to which an aluminum cooling fluid flow pipe is bonded to the outer surface.

Embodiments Hereinafter, embodiments of this invention will be described with reference to the drawings.

A shroud 1 for semiconductor manufacturing equipment includes an aluminum cylindrical body 2 and an aluminum cooling fluid flow pipe 3 spirally wound around the outer peripheral surface of the body 2 and joined to the body 2. A stainless steel plate 4 is clad to the top.

Both ends of the cooling fluid distribution pipe 3 extend vertically downward, and a cooling fluid supply pipe 5 is connected to the end of the portion of the cooling fluid distribution pipe 3 that extends downward from the bottom end of the main body 2. A cooling fluid discharge pipe 6 is connected to the end of the portion extending downward from the portion. The cooling fluid such as liquid nitrogen sent into one end of the cooling fluid distribution pipe 3 by the supply pipe 5 flows upward along the main body 2 to reach the upper end, and then vertically flows downward to the pipe 3. Discharge pipe 6 from the other end
It's starting to flow inward.

Such a shroud 1 is manufactured as follows. That is, first, a stainless steel plate 4 is clad on one side of an aluminum plate to produce a clad plate. Next, this clad plate is formed into a cylindrical shape, and the joints are welded. Thereafter, a spiral aluminum tube is placed over the outer peripheral surface of this cylindrical body and joined to the cylindrical body. In this way, shroud 1
is manufactured. The thickness of the above clad plate is 2~3
mm, the cladding ratio of the stainless steel plate 4 in the clad plate is preferably 2 to 20%. If the cladding ratio is less than 2%, the anti-corrosion effect against Ga will not be sufficient, and if it exceeds 20%, the weight will increase.

Effects of the invention The shroud for semiconductor manufacturing equipment according to this invention has a stainless steel plate clad on the inner surface of an aluminum main body to which an aluminum cooling fluid flow pipe is bonded to the outer surface. It is lighter in weight and has better thermal conductivity compared to other manufactured materials. In particular, since it has excellent thermal conductivity, it is possible to shorten the baking treatment time during semiconductor film formation compared to conventional products, and it is also possible to reduce the time required for baking when forming a semiconductor film. Cooling efficiency is improved, and residual gas adsorption rate during semiconductor film formation is improved. Moreover, since a stainless steel plate is clad on the inner surface that comes into contact with Ga evaporated during the formation of the semiconductor film, the corrosion resistance against Ga is equivalent to that of stainless steel.

Furthermore, since the main body is made from aluminum, it is easier to process than when the whole body is made from stainless steel.

[Brief explanation of the drawing]

FIG. 1 is a front view of a shroud for semiconductor manufacturing equipment according to this invention, and FIG. 2 is an enlarged sectional view taken along the - line in FIG. 1. DESCRIPTION OF SYMBOLS 1... Shroud for semiconductor manufacturing equipment, 2... Aluminum main body, 3... Aluminum cooling fluid distribution pipe, 4... Stainless steel plate.

Claims (1)

[Scope of utility model registration request] A shroud for semiconductor manufacturing equipment that has a stainless steel plate clad on the inner surface of an aluminum body with aluminum cooling fluid flow pipes bonded to the outer surface.