JPH021863Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a component lead deformation mechanism for deforming the lead electrodes of electronic components with lead electrodes such as transistors held on pallets so that they can be fixed to the substrate surface with an adhesive.

Recently, a chip electronic component mounting machine has been developed that transfers chip electronic components using a pallet, transfers the chip electronic components from the pallet to a mounting head, and then mounts the chip electronic components onto a printed circuit board using the mounting head. has been proposed by the applicant.

1 to 4 show an example of a pallet for holding and transporting chip-shaped electronic components in this case. In these figures, a pallet base 2 of a pallet 1 is attached to an endless belt mechanism such as a chain or belt, and a carbide base plate 13 is provided at the center of the base 2, and a A pair of holding round bars 5A and 5B made of hardwood are movably provided. Here, each holding round bar 5A, 5B has a tapered surface at both ends. Both ends of the pallet base 2 are stepped convex portions 7, and curved compression leaf springs 8 are provided between the inner surfaces of the convex portions 7 and the holding round bars 5A, 5B, respectively. Therefore, both holding round bars 5A and 5B are urged in a direction in which they come into close contact with each other. Further, the pallet base 2 is formed with a suction hole 9 for use during transfer, which opens from the center of the front surface to the center of the top surface. On such a base 2 is a holding round bar 5.
The upper lid 10 is placed over the state in which A, 5B and the compression leaf spring 8 are disposed. This upper cover 10 is attached by screwing screws 11 into screw holes 12 on the base 2 side.

The above pallet 1 can receive chip-shaped electronic component positions 20 from both sides, and if the chip-shaped electronic component 20 is inserted from the direction of arrow A as shown in FIG. The tip is open to accept the chip-shaped electronic component 20, and as shown in FIG. 4, the carbide base plate 13 of the base 2 and both holding round bars 5A, 5B
The chip-shaped electronic component 20 is held between. The chip-shaped electronic component 20 is usually held by a holding round bar 5A,
5B to the opening part 9A of the suction hole 9 in the middle.

On the other hand, as shown by arrow B in Fig. 3B, the holding round bar 5
When the chip-shaped electronic component 20 is inserted from the rear end of the holding rods 5A and 5B, the rear ends of the holding round bars 5A and 5B open to receive the chip-shaped electronic component 20 as shown in FIG.

By the way, the above-mentioned pallet 1 can hold not only an ordinary chip-shaped electronic component 20 without lead electrodes, but also an electronic component 30 with lead electrodes such as a transistor as a chip-shaped electronic component as shown in FIG. can. However, the tip of the lead electrode 31 in the electronic component 30 with lead electrodes is located at a position lower than the bottom surface 32 of the electronic component 30 with lead electrodes, and therefore, as shown in FIG. Even if an attempt was made to attach it to the adhesive-coated surface 41 of the substrate 40, a gap would be created between the bottom surface 32 and the substrate surface, resulting in an inconvenience that the bonding would not be successful.

In view of the above points, the present invention deforms the lead electrodes so that the tips of the lead electrodes of the electronic components with lead electrodes on the pallet are positioned on a surface that almost coincides with the bottom surface of the electronic component with lead electrodes. The present invention provides a component lead deformation mechanism that allows lead electrodes to have a shape suitable for mounting an electronic component on a board.

Embodiments of the component lead deformation mechanism according to the present invention will be described below with reference to the drawings.

In FIGS. 7 and 8, a support member 50 is fixed to the front surface of the main body frame 46 so as to protrude above the horizontal traveling path 45 of the pallet, and a slide block is slidable vertically relative to the support member 50. 51 are provided. The slide block 5
A push rod 53 is supported by a mounting member 52 to be slidable up and down, and the push rod 53 is urged downward by a compression spring 54. The slide block 51 is connected to one end of a lever 55 as a cam follower which is supported by a shaft 63 on a bracket 62 on the main body frame 46 side.
The roller 56 at the other end is in contact with the inner cam surface 57A of the cam disk 57. On the other hand, a cylinder 58 is disposed on the main body frame 46, and a piston rod 58A of the cylinder 58 is pivotally connected to one end of a lever 59 that is pivotally supported on the main body frame side. The other end of the lever 59 is connected halfway to the lever 55 via a link 60. Note that an extension spring 61 is provided between the lever 55 and the main body frame side for biasing the slide block 51 in the downward direction.

In the above configuration, the pallet 1 that holds and transfers the chip-shaped electronic components has its horizontal traveling path 45.
The vehicle is running in a straight line intermittently. And push rod 5
When the component on the pallet 1 stopped directly below the cylinder 3 does not require deformation of the lead electrode, such as an ordinary chip-shaped electronic component, the cylinder 58 maintains an extended state. That is, with the lever 55 rotated clockwise via the lever 59 and the link 60, the roller 56 at the tip is moved to the cam surface 57A.
Then, the slide block 51 is pulled up. Therefore, lead deformation processing is not performed.

On the other hand, when the pallet 1 holding the electronic component 30 with lead electrodes such as a transistor comes directly under the push rod 53, the cylinder 58 becomes retractable, and the roller 56 of the lever 55 is brought into contact with the cam surface 57A. do. As a result, the lever 55 rotates counterclockwise as the cam disk 57 rotates, and the slide block 51, that is, the push rod 53 is held on the pallet 1 by the holding round bars 5A and 5B as shown in FIG. 9A. Press down on the electronic component 30 with lead electrodes in the direction of arrow C, deform the lead electrode 31 of the electronic component 30 with lead electrodes as shown in FIG. 9B, and align the tip of the lead electrode almost flush with the bottom of the electronic component with lead electrodes. position.

As explained above, according to the component lead deformation mechanism of the present invention, the lead electrodes of the electronic components with lead electrodes on the pallet are deformed, and the leads are shaped to a height that almost matches the bottom surface of the electronic component with lead electrodes. Since the tip of the electrode is positioned, it is possible to make the lead electrode shape suitable for mounting electronic components with lead electrodes such as transistors on the board, which in turn expands the applications of the chip-shaped electronic component mounting machine. be able to.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view showing an example of a pallet that holds and transfers chip-shaped electronic components, Fig. 2 is a plan view of the same, Fig. 3 is an explanatory diagram of the operation, and Fig. 4 shows the state in which chip-shaped electronic components are held. Fig. 5 is a partial sectional view showing a state in which an electronic component with lead electrodes is held as a chip-shaped electronic component, and Fig. 6 is a partial sectional view showing the position of the electronic component with lead electrodes and the board without lead deformation processing. An explanatory diagram showing the relationship, FIG. 7 is a side view showing an embodiment of the component lead deformation mechanism according to the present invention, and FIG.
The figure is a plan view of the same, and FIG. 9 is an explanatory diagram of the operation. 1...Pallet, 5A, 5B...Holding round bar, 2
0... Chip-shaped electronic component, 30... Electronic component with lead electrode, 31... Lead electrode, 32... Bottom surface,
40... Printed circuit board, 50... Support member, 51
...Slide block, 52...Mounting member, 53
...Push rod, 54...Compression spring, 55, 59...
lever, 57... cam disk, 58... cylinder,
60...link.

Claims (1)

[Scope of utility model registration request] Slide block 5 relative to main body frame 46
A push rod 53 is slidably provided on the slide block 51, and the push rod 53 is urged downward by a spring, and the slide block 51 is moved by a driving lever 55. A component lead deforming mechanism, characterized in that the component lead deformation mechanism is driven downward and pushes down the upper surface of a leaded electronic component on a pallet by the downward movement of the push rod.