JPH021908Y2 - - Google Patents
Info
- Publication number
- JPH021908Y2 JPH021908Y2 JP8636484U JP8636484U JPH021908Y2 JP H021908 Y2 JPH021908 Y2 JP H021908Y2 JP 8636484 U JP8636484 U JP 8636484U JP 8636484 U JP8636484 U JP 8636484U JP H021908 Y2 JPH021908 Y2 JP H021908Y2
- Authority
- JP
- Japan
- Prior art keywords
- emi
- electronic device
- cover
- conductive compound
- gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000001875 compounds Chemical class 0.000 claims description 14
- 238000012856 packing Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
この考案は、例えばカバーと筐体との接合部に
EMIパツキンを用い電波障害に対するシールド、
いわゆるEMIシールド対策と、降雨等に対する
防滴対策を施こした電子機器、特に、その電子機
器筐体に関するものである。[Detailed explanation of the invention] [Technical field of the invention] This invention has a
Shielding against radio wave interference using EMI packing,
The present invention relates to electronic devices that have so-called EMI shielding measures and drip-proof measures against rain, etc., and in particular, to electronic device casings.
第１図はEMIパツキンによりEMIシールドと
防滴対策とが施こされた電子機器筐体の外観図、
第２図は従来の電子機器筐体の要部詳細を示すも
ので、第１図の断面Ａ−Ａ図である。
Figure 1 is an external view of an electronic device housing equipped with EMI shielding and drip-proofing measures using EMI packing.
FIG. 2 shows details of the main parts of a conventional electronic device casing, and is a cross-sectional view taken along line A-A in FIG.
図において、１は前面に外部コネクタ２と、蝶
番３とパチン錠４により開閉自在に筐体５に取り
付けられたカバー６とを有し、内部には図示して
いない回路部品類が実装された電子機器である。
７は上記カバー６に設けられた断面が凹状の溝
で、その最深面にはひも状のEMIパツキン８が
導電性コンパウンド９により接着されている。 In the figure, 1 has an external connector 2 on the front, and a cover 6 attached to a housing 5 so as to be openable and closable with a hinge 3 and a snap lock 4, and circuit components (not shown) are mounted inside. It is an electronic device.
Reference numeral 7 denotes a groove with a concave cross section provided in the cover 6, and a string-like EMI packing 8 is adhered to the deepest surface of the groove with a conductive compound 9.
従来の電子機器筐体は上記のように構成され、
内部回路部品メインテナンス時には上記蝶番３を
支点として、上記カバー６を図中ア方向に開放す
ることが出来、上記カバー６が閉状態時には上記
EMIパツキン８の全面が上記筐体５の当接面１
０により所定の力で均等に押圧されることによ
り、初めて電子機器としてのEMIシールドと降
雨時における防滴対策とを兼ね備えることが出来
るようになつている。 A conventional electronic device housing is configured as described above.
When maintaining the internal circuit components, the cover 6 can be opened in the direction A in the figure using the hinge 3 as a fulcrum, and when the cover 6 is in the closed state, the cover 6 can be opened in the direction A in the figure.
The entire surface of the EMI gasket 8 is the contact surface 1 of the housing 5.
By being evenly pressed with a predetermined force by 0, it is now possible for the first time to combine EMI shielding as an electronic device and drip-proofing during rain.
以上のように構成された従来の電子機器筐体に
おいては、上記EMIパツキン８を上記カバー６
に接着している上記導電性コンパウンド９がフイ
ラ（Filler）として銀、あるいはニツケル等を含
んでおり、きわめて粘度が低く流動性が悪いた
め、コンパウンド層の厚さを均一に保ちながら、
上記導電性コンパウンド９を塗布することはきわ
めて難かしい。このため、必然的に上記EMIパ
ツキン８の上記筐体５と当接する面も不均一なコ
ンパウンド層の影響により波状となり、全面にわ
たり均等の押圧力を得ることが出来ず、EMIシ
ールドと防滴の両対策としては不確実で信頼性に
欠ける面があつた。 In the conventional electronic device housing configured as described above, the EMI gasket 8 is connected to the cover 6.
The conductive compound 9 that is adhered to the conductive compound 9 contains silver or nickel as a filler, and has extremely low viscosity and poor fluidity. Therefore, while keeping the thickness of the compound layer uniform,
Applying the conductive compound 9 described above is extremely difficult. For this reason, the surface of the EMI packing 8 that comes into contact with the casing 5 inevitably becomes wavy due to the influence of the uneven compound layer, making it impossible to obtain an even pressing force over the entire surface, which prevents EMI shielding and drip-proofing. Both measures were uncertain and lacked reliability.
また、上記導電性コンパウンド９はきわめて高
価であり、上記凹状の溝７の全周に塗布すること
は経済的な面からも改善する必要があつた。 Further, the conductive compound 9 is extremely expensive, and it is necessary to improve the application from an economical point of view to the entire circumference of the concave groove 7.
この考案はかかる欠点を改善する目的でなされ
たもので、上記凹状の溝７の鉛直面に所定の探さ
を有する複数個の切欠部を設け、上記EMIパツ
キン８を、その切欠部において点付するように構
成した電子機器筐体を提案するものである。
This invention was made for the purpose of improving this drawback, and a plurality of notches having a predetermined depth are provided in the vertical plane of the concave groove 7, and the EMI packing 8 is dotted in the notches. This paper proposes an electronic device housing configured as follows.
第３図はこの考案の実施例を示す要部詳細を示
すもので、第１図の断面Ａ−Ａ図、第４図は第３
図の矢視Ｂ図であり１〜９は上記従来電子機器筐
体と全く同一のものである。１１は上記凹状の溝
７の鉛直面に対し、所定の間隔で複数個設けられ
た上記導電性コンパウンド９が充填されるための
所定の深さを有する切欠部である。
Fig. 3 shows the details of the main part showing an embodiment of this invention, and Fig. 4 is a cross-sectional view taken along the line A-A in Fig.
This is a view taken from arrow B in the figure, and 1 to 9 are completely the same as the conventional electronic device casing described above. Reference numeral 11 designates a plurality of notches provided at a predetermined interval in the vertical plane of the recessed groove 7 and having a predetermined depth for being filled with the conductive compound 9 .
上記のように構成された電子機器筐体において
は、上記切欠部１１のみに上記導電性コンパウン
ド９を充填することにより、上記カバー６と上記
EMIパツキン８とを接着することが出来るので、
従来のように上記凹状の溝７の最深面に上記導電
性コンパウンド９を塗布する必要はない。
In the electronic device housing configured as described above, by filling only the cutout portion 11 with the conductive compound 9, the cover 6 and the
Since it can be glued with EMI packing 8,
It is not necessary to apply the conductive compound 9 to the deepest surface of the concave groove 7 as in the conventional case.
従つて、上記EMIパツキン８の上記筐体５と
の当接する面が波状になることはないので、上記
EMIパツキン８の全面にわたり均等な押圧力を
得ることが出来、EMIシールド、あるいは防滴
対策としても万全である。 Therefore, the surface of the EMI gasket 8 that comes into contact with the casing 5 does not become wavy, so the above-mentioned
It is possible to obtain an even pressing force over the entire surface of the EMI gasket 8, making it perfect for EMI shielding or drip-proofing.
また、高価な導電性コンパウンドの使用量が、
従来よりはるかに少なく経済的であり、さらに
は、導電性コンパウンドの塗布面積が小さいので
大巾に作業時間の短縮を図ることが出来る。 In addition, the amount of expensive conductive compound used is
It is much smaller and more economical than conventional methods, and furthermore, since the area to be coated with the conductive compound is small, the working time can be greatly reduced.
第１図はEMIシールドと防滴対策とが施こさ
れた電子機器筐体外観図、第２図は従来の電子機
器筐体の要部詳細を示すもので、第１図の断面Ａ
−Ａ図、第３図はこの考案による電子機器筐体の
要部詳細を示すもので、第１図の断面Ａ−Ａ図、
第４図は第３図の矢視Ｂ図である。
図において、１は電子機器、２は外部コネク
タ、３は蝶番、４はパチン錠、５は筐体、６はカ
バー、７は凹状の溝、８はEMIパツキン、９は
導電性コンパウンド、１０は当接面、１１は切欠
部である。尚、図中同一、あるいは相当部分には
同一符号を付して示してある。
Figure 1 is an external view of an electronic device housing equipped with EMI shielding and drip-proof measures, and Figure 2 shows details of the main parts of a conventional electronic device housing, with cross section A in Figure 1.
Figures -A and 3 show details of the main parts of the electronic device casing according to this invention.
FIG. 4 is a view taken along arrow B in FIG. In the figure, 1 is an electronic device, 2 is an external connector, 3 is a hinge, 4 is a snap lock, 5 is a housing, 6 is a cover, 7 is a concave groove, 8 is an EMI gasket, 9 is a conductive compound, and 10 is a The contact surface 11 is a notch. In the figures, the same or corresponding parts are designated by the same reference numerals.
Claims (1)
（ELECTROMAGNETICINTERFERENCE）
パツキンが埋設される断面が凹状の連続した溝を
有するカバーと、上記カバーを装着した状態で上
記EMIパツキンとの当接面を有する筐体とから
なる電子機器筐体において、上記凹状の溝の鉛直
面に所定の深さを有する複数個の切欠部を設け、
上記切欠部に導電性コンパウンドを充填すること
により、上記EMIパツキンを上記カバーに取り
付けるようにしたことを特徴とする電子機器筐
体。 String EMI
(ELECTROMAGNETIC INTERFERENCE)
In an electronic device casing comprising a cover having a continuous groove with a concave cross section in which a gasket is embedded, and a casing having a contact surface with the EMI gasket when the cover is attached, the concave groove is A plurality of notches having a predetermined depth are provided in the vertical plane,
An electronic device casing, characterized in that the EMI gasket is attached to the cover by filling the notch with a conductive compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8636484U JPS611895U (en) | 1984-06-11 | 1984-06-11 | electronic equipment housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8636484U JPS611895U (en) | 1984-06-11 | 1984-06-11 | electronic equipment housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS611895U JPS611895U (en) | 1986-01-08 |
| JPH021908Y2 true JPH021908Y2 (en) | 1990-01-17 |
Family
ID=30637605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8636484U Granted JPS611895U (en) | 1984-06-11 | 1984-06-11 | electronic equipment housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611895U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0316316Y2 (en) * | 1986-12-23 | 1991-04-08 |
-
1984
- 1984-06-11 JP JP8636484U patent/JPS611895U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS611895U (en) | 1986-01-08 |
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