JPH0219964Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor piece brazing jig for brazing semiconductor pieces to respective mounting portions of a plurality of connected metal frames in the manufacture of lead frame type elements.

A semiconductor chip 3 is attached to each mount portion 2 of a frame 1 to which a plurality of devices, for example 10 devices, are connected as shown in FIG.
When brazing with solder 4 as shown in the line cross-section, conventionally the frame 1, which remains connected, is placed in jigs 5 and 6 made of graphite and divided into upper and lower parts, as shown in FIG. , by stacking the solder 4 and the chip 3 on each mount part 2 and heating them.
Brazing for 10 machines was being done at the same time. However, the frame 1 is usually made of a copper material, such as oxygen-free copper, deoxidized copper, or silver-doped copper, whose coefficient of thermal expansion is significantly greater than that of graphite. Therefore, even when brazing is performed by heating to a low temperature of 300 to 400°C using a low melting point solder, the difference in coefficient of thermal expansion cannot be ignored, and as shown in Figure 4, the semiconductor chip 3 is assembled into a frame. 1 may be assembled out of alignment. If the frame is fixed to avoid this, heating may cause bending or other abnormalities in the shape of the frame.

The present invention is used to braze a semiconductor piece onto such a metal frame, and even if the semiconductor is made of a material whose coefficient of thermal expansion is smaller than that of metal, it will not cause misalignment or abnormal shape due to the difference in coefficient of thermal expansion. The purpose is to provide a single-sided brazing jig.

The purpose of this is that the lower part of the semiconductor chip brazing jig, which accommodates the connected frames, is formed as one piece, and the upper part, which accommodates the semiconductor chips, is divided into a plurality of parts. This is achieved by interconnecting metal bodies of similar type.

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 5, the lower jig 6 is similar to that shown in FIG. 3, and is integrally formed from graphite, and the frame 1 is accommodated in its recess. On the other hand, the upper jig is 1
It is divided into 0 individual jigs 7 and fixed to a stainless steel plate 8. The individual jigs 7 accommodate the semiconductor chip 3 and the solder piece 4, respectively, and are positioned so as to rest on the respective mounts of the frame 1. The lower jig 6 and the stainless steel plate 8 each have legs 9 for installation or movement.

When this jig is heated, the coefficient of thermal expansion of copper and stainless steel is almost the same, so the lower jig 6
Frame 1, which is housed in a frame and expands as the temperature rises.
The relative position with respect to the chip 3 positioned by the upper individual jig 7 does not change. Therefore, if the chip 3 is brazed at a predetermined position on the mount part of the frame 1, and if the recessed part of the lower jig 7 for accommodating the frame 1 is formed with a gap between it and the frame, the frame will be removed when heated. 1 stretches freely and is not subjected to stress, so no shape abnormalities occur.

Heat-resistant stainless steel is suitable as the metal plate for connecting and fixing each individual jig 7 because it can withstand repeated use, but the same effect can also be obtained by using heat-resistant copper with 0.15% silver added. Ta. The material of the jigs 6 and 7 is not limited to graphite, and other materials that can withstand the brazing temperature, such as ceramics, can also be used, and there is no need to consider the coefficient of thermal expansion thereof.

As described above, the brazing jig according to the present invention consists of a lower part that accommodates a plurality of connected metal frames and a divided upper part that accommodates individual semiconductor pieces, and the upper part is made of metal bodies. The frame is connected and fixed to each other, and even if the frame thermally expands during heating for brazing, the relative position with the semiconductor piece is maintained as it is, so the semiconductor piece can be reliably brazed to the frame at a predetermined position. It can be used extremely effectively for manufacturing lead frame type elements without causing any deformation of the frame.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a connected metal frame used for manufacturing a lead frame type element, and Fig. 2 is a diagram showing the soldered state of the semiconductor pieces taken from A-A in Fig. 1.
3 is a partial sectional view of an example of a conventional brazing jig, FIG. 4 is a sectional view showing misalignment of a semiconductor piece during brazing, and FIG. 5 is a partial sectional view of an example of a conventional brazing jig. FIG. 3 is a partial cross-sectional view of one embodiment of the tool. 1: Metal frame, 3: Semiconductor chip,
4: Solder, 6: Lower jig, 7: Upper individual jig,
8: Metal plate.

Claims (1)

[Scope of utility model registration request] Used to braze semiconductor pieces to each of a plurality of connected metal frames, and consisting of a lower part that accommodates the metal frame and an upper part that accommodates the semiconductor pieces, the lower part is formed integrally. 1. A semiconductor piece brazing jig, characterized in that the upper part is divided into a plurality of parts, and the upper part is further interconnected by a metal body having a thermal expansion coefficient similar to that of the frame.