JPH0219977B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an IC substrate used for identification cards and the like.

[Conventional technology]

In the conventional IC board for identification cards, as shown in Fig. 1, the back electrode 2 provided on the back side of the board 1 is
The IC 3 is connected and protected by a plastic protective layer 4, and the back electrode 2 is electrically connected to the front electrode 5, which serves as an external terminal, through a through hole 6. , is used by being attached to a recess 8 previously provided in the card 7 with a filling layer 9 made of plastic adhesive.

[Problem to be solved by the invention]

However, this through hole 6 has the drawback that it looks bad in terms of card design, and the current capacity margin of the through hole 6 with respect to the IC power supply (+5V, +25V, GND, etc.) is too small. Furthermore, if the identification card is washed with clothes by mistake, detergent or the like may seep into the interior through the gap in the through-hole 6 and damage the IC. However, this method has the disadvantage that it provides information such as informing the person who uses the electrode of the position of the electrode.

The present invention eliminates these drawbacks, has a good appearance,
The purpose of the present invention is to provide a method for manufacturing an IC substrate in which the current capacity of the electrodes is large, there are no gaps where chemicals can infiltrate, and the front and back electrodes are connected so as not to serve as a mark of the electrode position. It is something.

[Means to solve the problem]

The present invention provides an annular formation of holes with the same number of electrodes around a portion of a substrate material that is to become an IC substrate, and then covers the front and back surfaces of the substrate material with a conductive film to cover the holes. Next, in the hole, cut out the conductive film on the front side and the back side so as to protrude from the periphery of the substrate, and press the protruding parts of the electrodes on the front side and the back side that protrude from the periphery of the substrate to each other. In any process from a process immediately after making an electrical connection and coating the conductive film on the substrate material to a process after making the electrical contact, This method of manufacturing an IC substrate is characterized in that the electrodes are separated into a plurality of electrodes, and the plurality of electrodes are formed across the outer peripheral surface of the periphery of the substrate and straddle the front and back sides.

〔Example〕

In FIGS. 2 to 4, a circular peripheral edge 12 of a carrier film 11, which is a substrate material, is used as an IC substrate.
The inside of is the area of the final substrate 13. That is,
Holes 14 are provided in a ring shape around the substrate 13 at intervals equal to the number of electrodes, and the substrate 13 is supported from the outer carrier film 11 by a holding portion 15 formed between the holes 14 . There is. A plurality of front surface electrodes 16 and back surface electrodes 17 are provided on the front and back surfaces of this substrate 13, and these front surface electrodes 16 and back surface electrodes 17 are formed by attaching, transferring, or transferring a metal film such as copper, that is, a conductive film. After continuous metal deposition, plating, etc., groove-like gaps are formed by etching, mechanical removal, etc., and a plurality of electrodes are formed. In this case, the front electrode 16, the back electrode 1
The outside of both 7 reaches the periphery of the substrate 13, and one front electrode 16 and one back electrode 17 face each hole 14, and the electrode section 18 at the center of the back surface is connected to the IC.
This is the part where 3 is placed.

Next, as shown in FIG. 5, the peripheral edge 12 (second and third
(Fig. 4) and is then electrically connected across the outer circumferential surface 19 (Fig. 4), and then thickly plated by electrolytic plating and further protected by gold plating.

Next, the substrate 13 is separated from the holding part 15, and the IC 3 is attached to the electrode part 18 as shown in FIG.
After wire bonding with a gold wire 21, a protective layer 4 of plastic is formed, and this is usually filled into the recess 8 of the card 7 with an adhesive filler, as shown in FIG.

In the manufacturing process of the embodiment of the present invention, first, as shown in FIG. 7, adhesive layers 22 for copper foil are provided on the front and back surfaces of the substrate material 10, and as shown in FIG. 8, an IC substrate 13 is formed. Holes 14 of the same number as the number of electrodes are provided in an annular shape around the area where the electrodes are to be formed (same as the holes 14 in FIGS. 2 and 3), and then copper foil 23, which is a conductive film as an electrode material, is formed as shown in FIG. , 24 on the front and back sides, covering the hole 14 and covering it. In this state, the outer peripheral surface 19 of the peripheral edge 12 of the substrate 13 is in an insulated state.

Next, as shown in FIG.
The cutter 28 equipped with a blade 27 that cuts near the outside of the hole 14 is lowered to cut the copper foil 23,
The cutter 28 is lowered and the protruding copper foils 23 and 24 are pressed against the stand 29 by the step 26, and ultrasonic vibration is applied to cut the copper foil 23
and 24 are electrically connected by ultrasonic welding, or brought very close to each other.

Next, as shown in FIG. 11, the connection parts or adjacent parts of the copper foils 23 and 24 are connected by electroless plating to make an electrical connection, and then a thick layer is applied by electrolytic plating, and then gold plating is applied. The connecting portion 20 formed in the above-mentioned manner allows the copper foil 2 on the front side to straddle the front and back sides of the outer peripheral surface 19 of the peripheral edge 12 of the substrate 13.
3 and the copper foil 24 on the back are electrically connected.

Next, as shown in FIG. 12, a resist material 30 is placed according to the shape of the electrode, and etching is performed to separate the copper foil, forming a front electrode 16 and a back electrode 17 with a copper foil pattern as shown in FIG. .

The front electrode 16 and the back electrode 17 formed in this way are formed on the outer peripheral surface 19 of the peripheral edge 12 of the substrate 13.
The terminals are electrically connected by a connecting portion 20 across the terminals.

As shown in FIG. 6, the IC board in this embodiment has an IC 3 attached to the electrode part 18 of the back electrode 17,
After wire bonding with the gold wire 21, the protective layer 4 is covered with resin to hermetically seal the IC, and this is then placed in the recess of the card with a filler, such as an adhesive, as in the example in FIG. It is attached and used as an identification card.

In this case, the surface electrode 16 serving as an external terminal has
There is no hole such as a through hole, it is flat and has a good appearance, and the cross-sectional area of the connecting part 20 can ensure sufficient current capacity by selecting the width and thickness, and there are no holes that may cause drug infiltration. In addition, since there is no mark, it is not easy to distinguish whether it is an external terminal or not, so it is possible to prevent the card from being tampered with.

Instead of etching, a portion of the copper foil may be mechanically removed to separate the electrodes. This electrode separation process starts from the process immediately after coating with copper foils 23 and 24 (Part 9).
It may be performed at any stage of the process up to the process after forming 0 (FIG. 11).

〔Effect of the invention〕

The present invention provides an annular formation of holes with the same number of electrodes around a portion of a substrate material that is to become an IC substrate, and then covers the front and back surfaces of the substrate material with a conductive film to cover the holes. Next, in the hole, the conductor films on the front and back sides are cut out so as to protrude from the periphery of the substrate, and the protruding portions of the electrodes on the front and back sides that protrude from the periphery of the substrate are crimped together for electrical connection. By separating the conductor film into a plurality of electrodes and forming the plurality of electrodes extending over the front and back surfaces of the substrate, a sufficient margin for the required current capacity can be obtained. There is no risk of spillage or infiltration of chemicals, and
It is possible to easily manufacture an IC board in which the position of the external electrode is unknown and tampering can be prevented, and the productivity is also significantly improved.For identification cards, etc., there are no obstacles to the design and printing of the card, and the appearance can be improved. In addition, it is an extremely suitable product when characters or figures indicating the issuer or user company of the card are displayed using the surface electrode, that is, when the shape of the surface electrode itself is the shape of the letters or figures. This can significantly increase the product value.

[Brief explanation of drawings]

Figure 1 is a sectional view of the conventional example, Figure 2 is a plan view, Figure 3 is a back view, Figure 4 is a sectional view taken along the - line in Figure 2, and Figures 5 and 6 are cross sections showing the manufacturing process. 7 to 13 are cross-sectional views showing the manufacturing process in an embodiment of the present invention. 1, 13... Substrate, 2, 17... Back electrode, 3
...IC, 4...protective layer, 5,16...surface electrode,
6...Through hole, 7...Card, 8...Recess, 9...Filled layer, 11...Carrier film,
12... Periphery, 14... Hole, 15... Holding part, 1
8... Electrode part, 19... Outer peripheral surface, 20... Connection part, 21... Gold wire, 22... Adhesive layer, 23,2
4...Copper foil, 25, 27...Blade, 26...Step part,
28... cutter, 29... stand, 30... resist material.

Claims (1)

[Claims] 1. Holes of the same number as the number of electrodes are provided in a ring around the part of the substrate material that is to become the IC board, then the front and back sides of the substrate material are covered with a conductive film by covering the holes, and then In the holes, the conductive films on the front and back sides are cut so as to protrude from the periphery of the substrate, and the protruding portions of the electrodes on the front and back sides that protrude from the periphery of the substrate are crimped together to establish an electrical connection. From the process immediately after coating the substrate material with the conductor film to the process after making the electrical contact,
A method for manufacturing an IC substrate, characterized in that, in any one of the processes, the conductive film is separated into a plurality of electrodes, and the plurality of electrodes are formed across the outer circumferential surface of the periphery of the substrate and straddle the front and back sides. .