JPH02201405A - Optical receiver - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to coupling an optical fiber and a light receiving element or an O'lXO element.

[Conventional technology]

Figure 3 shows 2 for example NE! O Technical Report, 34.51 (1118
In Fig. 0, which is a cross-sectional view of the configuration of the conventional optical receiver disclosed in 1), (11 is a light receiving element, (3) is a light receiving element (
1) is a semiconductor substrate formed on the surface, (4) is an optical fiber installed facing the light receiving part of the light receiving element (1), (5+ is the core part of the optical fiber (4), (6) is a package.

Figure 4 shows an O RI in which a light receiving element and an electronic element are integrated.
FIG. 2 is a configuration cross-sectional view showing an example of an optical receiver having a C element.

In the figure (71 is the 0KIO element, (8) is the electronic circuit section formed on the semiconductor substrate (31) adjacent to the light receiving element (1), and (3) to (6) are the same as in Figure 3. be.

Further, Q2 is an electrical wiring pattern that guides the output current of the light receiving element (11) to the electronic circuit section (8).

Next, the operation will be explained. In Fig. 3, the light emitted from the core part (5) of the optical fiber (4) is transmitted to the light receiving element (1).
incident on . The optical fiber (41) and the light-receiving element (11) are fixed in the package (6) in a positional relationship such that the surfaces of the core part (5) and the light-receiving element (11) are substantially orthogonal. The case where it is applied to the coupling between the 0KIO element and the optical fiber is shown in Figure 4.The OE C element integrates the electronic elements constituting the electronic circuit, such as the light receiving element and the preamplifier, on a single semiconductor substrate. In Fig. 4, the light emitted from the core portion 1fil of the optical fiber (4) enters the light receiving element (1) of the OFi C element (7). I/C conversion is performed, and the converted current passes through the electrical wiring pattern αz′1 formed on the substrate (3) and is led to the electronic circuit section (8).Original fiber (41 and 0)!iIC element (7) is fixed in the package (6) in a positional relationship such that the core part (5) and the surface of the omIC element are substantially perpendicular to each other.

Looking at the signal flow in the above configuration, the flow of the optical signal propagating through the core portion (5) of the optical fiber (4),
The flow of the electrical signal converted from the optical signal on the 0KIC element (7) is on substantially orthogonal planes.

Therefore, when considering connections with other optical circuit parts such as optical splitters and waveformers, and other electronic circuits, the optical circuit parts are placed on the extension of the optical fiber (4), and the electronic circuit is connected to the 0FliIC element (
It is natural to place it on the same plane as 7).

[Problem to be solved by the invention]

Since the conventional optical receiver is configured as described above, the optical fiber and the light receiving element or OGX are connected in the package.
There is a problem in that the c-elements are perpendicular to each other, which creates wasted space and increases the size of the optical receiver. In addition, when connecting to other optical and electronic components, the yarn components and electrical components are placed on perpendicular surfaces, which complicates the overall configuration and creates wasted space. There were other problems. In addition, when attempting to arrange the yarn parts and the electrical parts in a plane, the optical fiber or the electrical wiring must be bent, which poses the problem of requiring extra space.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to obtain an optical receiver that can make the propagation direction of an optical signal and the propagation direction of an electric signal the same.

[Means to solve the problem]

In the optical receiver according to the present invention, a mirror surface for bending an optical path is formed on a part of the side surface of a chip carrier that holds a semiconductor substrate on which a light receiving element is formed.

[Effect]

In the optical receiver of the present invention, the optical path of the light emitted from the optical fiber is bent by the mirror surface formed on the side surface of the chip carrier, and the optical fiber and the semiconductor substrate on which the light receiving element is formed can be arranged in a plane. can.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, (9) is a chip carrier that holds a semiconductor substrate (31'i), and is formed on a part of the side surface of the Q (lFi chip carrier (9) so as to form an acute angle with respect to the surface of the semiconductor substrate (3). A non-reflective coating ti11 is applied to the portion of the semiconductor substrate (3) that is not in contact with the chip carrier (9) within the surface facing the mirror surface <1 (I).

Figure @2 has an electronic circuit section (8). wxc element (7
). In another embodiment of this invention, ff, (9+~
aυ is the same as in FIG.

Next, the operations of these embodiments will be explained.

In FIG. 1, the light emitted from the core part 151 of the optical fiber 14) is bent by the mirror surface Q (IK) formed on the side surface of the chip carrier (9), and the optical path is bent by the semiconductor substrate (
3) and then enters the light receiving element (1). Figure @2 shows a semiconductor substrate (3) on which an OMXC element (7) is formed instead of a semiconductor substrate (3) on which a light receiving element (11) is formed.
It is the same as FIG. 1 except that it is arranged with . The light F! incident on the light receiving element (11) is converted into a current, and the converted current is guided to the electronic circuit section (8) via the electrical wiring pattern r1X5t-.

As described above, in the optical receiver according to the present invention, the optical path of the light emitted from the optical fiber (4) is bent by the mirror surface and enters the light receiving element (11).

Optical fiber (4) and semiconductor substrate (3) or 0-hill IC
The element (71) can be arranged on the same plane.

[Effects of the Invention] As described above, according to the present invention, a blunt surface is provided on a part of the side surface of a semiconductor substrate having a light-receiving element or a chip carrier holding an OMXC element, and a light beam emitted from an optical fiber is bent. With this configuration, the optical fiber and the semiconductor substrate having the light receiving element or the 1-JOBIC element can be arranged on the same plane, the package of the optical receiver can be made compact, and the optical receiver can be placed on the same plane. It can be efficiently arranged and mounted with optical circuit components and electronic circuit components.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of the structure of an optical receiver according to an embodiment of the present invention, FIG. The figure is a cross-sectional view showing a configuration example of a conventional optical receiver. [1] is the photodetector, (3I is the semiconductor substrate, (4) is the original fiber, (71ba01!! IC element, (8) is the electronic circuit section, (8) is the chip carrier, αaFi mirror surface, (Il
1 is a non-reflective coating. Note that in the two figures, the same reference numerals represent the same or equivalent parts.

Claims (1)

[Claims] In an optical receiver having an optical fiber for transmitting signal light, a light receiving element for photoelectrically converting light emitted from the optical fiber, and a chip carrier holding a semiconductor substrate on which the light receiving element is formed, the semiconductor substrate is transparent. that the semiconductor substrate and the chip carrier are bonded to the surface of the semiconductor substrate opposite to the surface on which the light-receiving element is formed; and that part of the side surface of the chip carrier that participates in the bonding with the semiconductor substrate. However, the surface of the semiconductor substrate is a mirror surface forming an acute angle, the optical fiber and the chip carrier are arranged in a plane, and the light emitted from the optical fiber is reflected by the mirror surface of the chip carrier. The positions of the optical fiber, the above-mentioned mirror surface, and the photodetector must be fixed so that the light enters the photodetector later, and there is no blank space on the surface of the semiconductor substrate facing the chip carrier that is not in contact with the chip carrier. An optical receiver characterized by being coated with a reflective coating.