JPH0220175U

JPH0220175U -

Info

Publication number: JPH0220175U
Application number: JP9855288U
Authority: JP
Priority date: 1988-07-26
Filing date: 1988-07-26
Publication date: 1990-02-09

Description

[Brief explanation of drawings]

第１図は本考案の好適な一実施例を示す端面図
、第２図は従来例を示す端面図である。１……基台、２……吸引パイプ、３……コイル
バネ、４……基板支持板、５……ガイド部材、６
……空気連通孔、７……ピン挿入孔、９ａ，９ｂ
……電子部品、１０……プリント配線基板、１１
……下面ピン、１３……中吊り板、１４ａ，１４
ｂ……コイルバネ、１６……上面ピン、１８ａ，
１８ｂ……シール部材。 FIG. 1 is an end view showing a preferred embodiment of the present invention, and FIG. 2 is an end view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Base, 2... Suction pipe, 3... Coil spring, 4... Board support plate, 5... Guide member, 6
...Air communication hole, 7...Pin insertion hole, 9a, 9b
...Electronic components, 10...Printed wiring board, 11
... Bottom pin, 13 ... Middle hanging plate, 14a, 14
b...Coil spring, 16...Top pin, 18a,
18b... Seal member.

Claims

[Scope of claims for utility model registration] (1) Placed in a closed space separated from the outside,
a board support plate on which a printed wiring board with electronic components to be tested is placed; and a board support plate located in the closed space above the board support plate and movable vertically along a plurality of guide members. an elevating body that is supported as such and descends when the closed space is brought into a negative pressure state by a vacuum mechanism; 1. A pin contact device for an electronic component testing apparatus for a printed wiring board, characterized in that the pin contact device comprises an upper surface pin vertically disposed downward so as to be able to contact a terminal located on the upper surface of the substrate of the electronic component. (2) It is supported so that it can vertically move up and down along a plurality of guide members, has air circulation holes through it in the thickness direction, and has a printed wiring board with electronic components to be tested on its bottom surface. a substrate support plate on which the exposed terminal of the electronic component is placed so as to correspond to the upper end of a pin insertion hole provided through the thickness direction;
The board support plate is disposed below the board support plate, and when the board support plate moves downward, the pins are inserted into the pin insertion holes so as to be able to contact the terminals exposed on the bottom surface of the printed wiring board of the electronic component. an elevating body supported above the substrate support plate so as to be vertically movable along the plurality of guide members; The board includes an upper surface pin that is vertically disposed downward so as to be able to contact a terminal located on the upper surface of the substrate of the electronic component placed on the substrate support plate when the substrate is moved, and the upper surface pin and the lower surface pin. A pin contact device for an electronic component testing device for a printed wiring board, comprising a sealing member that closes a space communicated by an air circulation hole of a support plate to create a negative pressure state by a vacuum mechanism. .