JPH0220333U - - Google Patents

Info

Publication number
JPH0220333U
JPH0220333U JP1988098651U JP9865188U JPH0220333U JP H0220333 U JPH0220333 U JP H0220333U JP 1988098651 U JP1988098651 U JP 1988098651U JP 9865188 U JP9865188 U JP 9865188U JP H0220333 U JPH0220333 U JP H0220333U
Authority
JP
Japan
Prior art keywords
stem
substrate
semiconductor
semiconductor elements
magnification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988098651U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988098651U priority Critical patent/JPH0220333U/ja
Publication of JPH0220333U publication Critical patent/JPH0220333U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の概略構成図、第２
図はレンズ倍率４倍のときのモニタ上撮像画像の
一例を示す図、第３図は第２図のパターンの位置
補正をし、レンズ倍率８倍に変更し同一のパター
ンを撮像した一例を示す図である。 １……ステム、２……ワークステージ、３……
ペレツト、４……レンズ系、５……カメラ、６…
…モニタ、７……Ｘ―Ｙテーブル、８……演算回
路、９……制御回路、１０……メタライズパター
ン。 Figure 1 is a schematic diagram of an embodiment of the present invention;
The figure shows an example of an image captured on a monitor when the lens magnification is 4x, and Figure 3 shows an example of the same pattern imaged after correcting the position of the pattern in Figure 2 and changing the lens magnification to 8x. It is a diagram. 1... Stem, 2... Work stage, 3...
pellet, 4...lens system, 5...camera, 6...
...Monitor, 7...X-Y table, 8... Arithmetic circuit, 9... Control circuit, 10... Metallization pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上又はステム上に複数個の半導体素子を搭
載し、該半導体素子と前記基板又はステムとを導
電性ワイヤーで電気的に結合ささせてなる半導体
装置の組立装置において、半導体素子、基板又は
ステムの同一目合せ位置を複数回にわたつて撮像
レンズの倍率を段階的に変更しながら、目合せを
行う機構を有することを特徴とする半導体組立装
置。 In an assembly apparatus for a semiconductor device in which a plurality of semiconductor elements are mounted on a substrate or a stem, and the semiconductor elements and the substrate or stem are electrically coupled with a conductive wire, the semiconductor elements, the substrate or the stem are 1. A semiconductor assembly device comprising a mechanism for performing alignment while changing the magnification of an imaging lens stepwise at the same alignment position multiple times.
JP1988098651U 1988-07-26 1988-07-26 Pending JPH0220333U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988098651U JPH0220333U (en) 1988-07-26 1988-07-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988098651U JPH0220333U (en) 1988-07-26 1988-07-26

Publications (1)

Publication Number Publication Date
JPH0220333U true JPH0220333U (en) 1990-02-09

Family

ID=31325114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988098651U Pending JPH0220333U (en) 1988-07-26 1988-07-26

Country Status (1)

Country Link
JP (1) JPH0220333U (en)

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