JPH0220372U - - Google Patents
Info
- Publication number
- JPH0220372U JPH0220372U JP9942988U JP9942988U JPH0220372U JP H0220372 U JPH0220372 U JP H0220372U JP 9942988 U JP9942988 U JP 9942988U JP 9942988 U JP9942988 U JP 9942988U JP H0220372 U JPH0220372 U JP H0220372U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- lead terminal
- exterior material
- stopper member
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図〜第３図は本考案の第１実施例の正断面
図、同一部切欠き斜視図、同ステイツク内に収容
した電子部品群の正面図、第４図Ａは本考案の第
２実施例の斜視図、第４図Ｂは同要部側断面図、
第５図Ａは本考案の第３実施例の斜視図、第５図
Ｂは同要部正断面図、第６図は従来例のステイツ
ク内に収容した電子部品群の正面図である。
１０，２０，２４……混成集積回路（電子部品
）、１１……絶縁基板、１２……チツプ部品、１
３，１９……リード端子、１４……外装材、１５
，１８，２２……チツプ部品（ストツパ部材）、
１６，２１，２３……当接部、１７……ステイツ
ク。
1 to 3 are a front sectional view of the first embodiment of the present invention, a partially cutaway perspective view of the same, and a front view of a group of electronic components housed in the same stay, and FIG. 4A is a front view of the first embodiment of the present invention. A perspective view of the embodiment, FIG. 4B is a side sectional view of the same essential part,
FIG. 5A is a perspective view of a third embodiment of the present invention, FIG. 5B is a front sectional view of the same essential part, and FIG. 6 is a front view of a group of electronic components housed in a conventional stay. 10, 20, 24...Mixed integrated circuit (electronic component), 11...Insulating substrate, 12...Chip component, 1
3, 19...Lead terminal, 14...Exterior material, 15
, 18, 22... Chip parts (stopper members),
16, 21, 23...Abutment portion, 17...Status.
Claims (1)
部品及びリード端子を配設し、前記絶縁基板及び
前記チツプ部品の外面を外装材でモールドし、か
つ前記リード端子を露出する電子部品において、
前記絶縁基板の両側縁部にストツパ部材を配設し
、このストツパ部材の外面を前記外装材でモール
ドすることにより凸状の当接部を形成したことを
特徴とする電子部品。 An electronic component in which a chip component and a lead terminal are arranged on an insulating substrate with a predetermined wiring pattern, the outer surfaces of the insulating substrate and the chip component are molded with an exterior material, and the lead terminal is exposed,
An electronic component characterized in that a stopper member is disposed on both side edges of the insulating substrate, and a convex abutting portion is formed by molding the outer surface of the stopper member with the exterior material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9942988U JPH0220372U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9942988U JPH0220372U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0220372U true JPH0220372U (en) | 1990-02-09 |
Family
ID=31326581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9942988U Pending JPH0220372U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220372U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59188151A (en) * | 1983-04-08 | 1984-10-25 | Fujitsu Ltd | Hermetically sealing method of hybrid ic |
-
1988
- 1988-07-27 JP JP9942988U patent/JPH0220372U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59188151A (en) * | 1983-04-08 | 1984-10-25 | Fujitsu Ltd | Hermetically sealing method of hybrid ic |