JPS6339943U - - Google Patents
Info
- Publication number
- JPS6339943U JPS6339943U JP1986132142U JP13214286U JPS6339943U JP S6339943 U JPS6339943 U JP S6339943U JP 1986132142 U JP1986132142 U JP 1986132142U JP 13214286 U JP13214286 U JP 13214286U JP S6339943 U JPS6339943 U JP S6339943U
- Authority
- JP
- Japan
- Prior art keywords
- bonding terminal
- circuit board
- section
- package structure
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案に係る電子回路のパツケージ構
造の一実施例を分解した状態で示す斜視図、第２
図は同じ実施例の要部を拡大して示す断面図、第
３図は従来例を示す斜視図である。
１……回路基板、１ａ……見当穴、２ａ，２ｂ
……接合用端子部、２１……ボス、２２……爪、
３……ブレード、４……回路部品、５……樹脂ケ
ース、５ａ……舌片。
FIG. 1 is an exploded perspective view of an embodiment of the electronic circuit package structure according to the present invention;
The figure is a sectional view showing an enlarged main part of the same embodiment, and FIG. 3 is a perspective view showing a conventional example. 1... Circuit board, 1a... Register hole, 2a, 2b
...Connecting terminal part, 21...Boss, 22...Claw,
3... Blade, 4... Circuit component, 5... Resin case, 5a... Tongue piece.
Claims (1)
とを備えて成るパツケージ構造において、前記接
合用端子部は一対に分割され、この分割された夫
々は導電部であるブレードと樹脂などの絶縁部材
とで一体に形成され、該接合用端子部の夫々が前
記回路基板の対辺に配設されると共に、夫々の前
記接合用端子部間には前記回路基板を覆う樹脂ケ
ースが夫々の前記接合用端子部と弾性により係着
されていることを特徴とする電子回路のパツケー
ジ構造。 In a package structure comprising an electronic component and a bonding terminal section on one side of a circuit board, the bonding terminal section is divided into a pair, and each of the divided sections has a blade as a conductive section and an insulating section made of resin or the like. Each of the bonding terminal portions is disposed on the opposite side of the circuit board, and a resin case covering the circuit board is provided between each of the bonding terminal portions. A package structure for an electronic circuit characterized by being elastically attached to a terminal part for the electronic circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986132142U JPS6339943U (en) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986132142U JPS6339943U (en) | 1986-08-29 | 1986-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6339943U true JPS6339943U (en) | 1988-03-15 |
Family
ID=31031254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986132142U Pending JPS6339943U (en) | 1986-08-29 | 1986-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6339943U (en) |
-
1986
- 1986-08-29 JP JP1986132142U patent/JPS6339943U/ja active Pending