JPH02205331A - Method and device for bonding semiconductor - Google Patents

Abstract

PURPOSE:To shorten the production time by continuously executing the bonding working and down-set working of a chip terminal. CONSTITUTION:A device is composed of a tape gripping mechanism 3 for fixing a tape 90 carried to the position of bonding, a bonding stage 2 for plating a chip 91 at the position of bonding and a bonding head 1 for pressure-welding an inner lead 90a formed to the tape 90 and the terminal 91a of the chip 91. The bonding head 1 is disposed to an upper section and the bonding stage 2 to a lower section while holding the tape gripping mechanism 3 as the bonding stage 2 and the bonding head 1 are elevated or lowered in the vertical direction simultaneously or singly. Accordingly, bonding working and down-set working can be conducted positively without generating strain, creases, etc., in a film tape, thus shortening the production time.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention involves bonding the inner leads of a lead frame formed in a tape carrier and the terminals of a chip using a bonding stage and a bonding head, followed by down-setting. The present invention relates to a semiconductor bonding method and apparatus for performing the same.

(Prior art) In recent years, semiconductors have been manufactured by attaching copper foil to a tape such as a synthetic resin film and etching the silver foil to form a lead frame on the tape. A bonding process is performed using a device such as that described in, for example, Japanese Unexamined Patent Publication No. 58-165335. That is, by placing the chip on a bonding stage, transporting the tape to a predetermined position, and vertically lowering the bonding head, the inner leads of the tape and the bumps, which are the terminals of the chip, are connected.

In the semiconductor obtained by the above-described operation, the inner leads of the tape and the chip are in a substantially parallel state, so that the inner leads may come into contact with the chip and cause a short circuit. Therefore, after performing the bonding process, either move the tape horizontally upward at the same position and perform a downset process so that the inner leads are inclined to the chip, or use a downset process machine to perform the bonding process. The processed tape is fixed in a predetermined position, the chip is gripped from above and below, and the chip is lowered to perform downset processing.

(Problem) In the former method of downsetting by moving the tape horizontally upwards, extra tension is applied to the inner lead or outer lead when the tape is moved, causing damage to the inner lead. In addition, extremely advanced processing and assembly techniques are required to raise and lower a very thin tape vertically in a horizontal state without causing distortion or wrinkles, etc. The problem was that it was very difficult to put this device into practical use.

In addition, when downset processing is performed using the latter downset processing device, the bonded tape must be set in a predetermined position, which may cause distortion, wrinkles, etc. during the gripping operation of the tape. There was a problem.

The first object of the present invention is to enable down-setting processing to be performed subsequent to bonding processing.

The second purpose is to prevent distortion, wrinkles, etc. from occurring in the tape.

(Means for Solving the Problems) In the semiconductor bonding method of the present invention, which constitutes the above-mentioned object, a chip is placed on a bonding stage, a tape is conveyed to a predetermined position, and a bonding head is moved vertically. Then, with the tape fixed, the bonding stage and the bonding head are held while gripping the inner leads and the chip. It is designed to be lowered to perform downset processing.

Further, in order to carry out the above-mentioned method, the semiconductor bonding apparatus of the present invention is provided with a bonding head above the tape gripping mechanism and a bonding stage below. The bonding head is configured to be raised and lowered in the vertical direction simultaneously or independently.

The above-described apparatus can be reliably implemented by configuring the bonding head and the bonding stage to be vertically raised and lowered by a cam mechanism.

(Embodiment) The structure of one embodiment of the semiconductor bonding apparatus of the present invention will be explained based on the drawings.

The semiconductor bonding apparatus includes a tape gripping machine Jff43 for fixing the tape 90 conveyed to a predetermined bonding position, a bonding stage 2 for placing the chip 91 at the bonding position, and an inner roller formed on the tape 90. Lead 90a and terminal 91a of chip 91
It is composed of a bonding head 1 for pressure welding that connects.

The bonding head 1 is installed on an X-Y table (not shown) that is installed on a machine base and moves horizontally back and forth and left and right.
As shown in the figure, 4 is a frame mounted on an X-Y table (not shown), and a guide 4a is formed in a horizontal state to the wall surface. Reference numeral 5 denotes a support body that is attached to move horizontally along a guide 4a formed on the frame. A shaft 6 is rotatably attached to the frame 4, and is rotated by an electric motor (not shown) such as a pulse motor or a synchronous motor. A first cam body 7 and a second cam body 8 are attached to the shaft 6, and cam surfaces are formed so that they do not act on the support body 5 and the rocking body 10 at the same time even when they rotate together. be. Reference numeral 9 denotes a cam follower attached to the support body 5, and the cam surface of the first cam body 7 is supported by a spring or a cylinder (not shown), etc., which is hooked between the frame body 4 and the support body 5. When the first cam #-7 rotates, the support body 5 moves in the horizontal direction. The rocking body 10 is rotatably attached to the frame body 4 via a shaft 11, and has a guide groove 10a formed at its end. 12
is a cam follower rotatably attached to the rocking body 10, and is in contact with the cam surface of the second cam body 8. 13 is a bracket for attaching the bonding tool 16, and the bearing 14 is integrally attached. The bearing 14 is mounted so that it can be vertically moved up and down along a guide 5a formed on the support 5. A roller 15 is rotatably attached to the bracket 13 and is engaged with a guide groove 10a formed in the swinging body 10.

A heat source (not shown) such as a sheathed heater is attached to the bonding tool 16 in order to press the inner leads 90a formed on the tape 90 to the terminals 91a of the chip 91 at a predetermined temperature. In addition, a heat insulating material and a cooling shade are attached above the heating source to prevent the bracket 13 etc. from being heated.

Reference numeral 17 denotes a single-acting cylinder, and the end of the piston rod is in contact with the lower surface of the rocking body 10. Then, when the piston rod protrudes, the rocking body 10 rotates counterclockwise about the shaft 11, and the bonding tool 16 is lowered together with the bracket 13.

18a and 18b are detectors that detect the vertical position of the bonding tool 16 via the oscillator 10;
It is actuated by a protrusion 10b formed at the end of. 1
Numeral 9 is a screw body such as a micrometer attached to the bracket 13 that determines the amount of downset, and comes into contact with the upper surface 5b of the support 5 to regulate the lowering position of the bonding tool 16.

Next, details of the bonding tool 2 are shown in FIG. 3 and
As shown in Fig. 4, 20 is an X-Y table (
(not shown) mounted on! The base 21 is mounted so as to be movable in the horizontal direction. A pair of brackets 22 are mounted on the base 21, and are mounted so that the bearings 23 face each other. 24 is a support body 28
It is an elevating body rotatably mounted on a shaft 29, and a roller 25 is rotatably mounted. The roller 25 is in contact with a cam surface 27a of a cam body 27 attached to the end of a piston rod of a cylinder 26 installed on the base 21. A guide 28 is formed on the support body 28 and engages with a bearing 23 attached to the bracket 22 to move up and down in the vertical direction. Further, the elevating body 24 is rotated about the shaft 29 by the screw 30 screwed onto the support body 28, and the support body 28 is rotated.
Adjust the vertical height position of 8. 31 is the elevating body 24
A bottle 32 protruding from the support body 28 and a bottle 3 protruding from the support body 28
3 is a passed spring, which keeps the support body 28 close to the elevating body 24 side at all times.

Reference numeral 34 denotes a spring that is hooked on a bottle 35 projecting from the base 21 and a bottle 36 projecting from the support 28, and brings the roller 25 into contact with the cam surface 27a of the cam body 27 with a predetermined surface pressure. . When the piston rod of the cylinder 26 protrudes, the support body 28 rises together with the elevating body 24, and when the piston rod retracts, the support body 28 descends together with the elevating body 24.

37 is a cooling body attached to the upper surface of the support body 28;
Holes for passing a cooling fluid such as water or air are provided, and a cooling fluid supply pipe (not shown) is connected thereto. A heating element 39 is attached to the cooling element 37 via a heat insulating material 38, and a heating source (not shown) such as a sheathed heater is attached thereto. 40 is a stage attached to the upper surface of the heating body 39, on which a chip 91 is placed. 41 is a bracket attached to the base 21, and a guide 41a is formed in the vertical direction. Reference numeral 42 denotes a positioning piece to which a bearing 43 is integrally attached, and the bearing 43 engages with a guide 41a formed on the bracket 41 to move up and down in the vertical direction. 44 is a cylinder attached to the base 21, and the above-mentioned positioning piece 42 is attached to the end of the piston rod. 4
A screw 5 is screwed onto the bracket 41, and the regulating surface 42a of the positioning piece 42 comes into contact with the screw 5 to restrict upward movement of the positioning piece 42. 46 is a bracket attached to the elevating body 24, and a screw body 47 such as a micrometer is used for attachment. Then, the screw body 47 comes into contact with the regulating surface 42b of the positioning piece 42 to regulate the downward movement of the elevating body 24.

In the bonding stage 2 configured as described above, when the cylinder 26 is actuated and the piston rod protrudes, the elevating body 24 to which the roller 25 is attached and the support body 28 are raised by the cam body 27, and the stage 40 performs the bonding operation. When the piston rod is moved to the position and the piston rod is retracted, the elevating body 24 and the support body 28 are lowered until the screw body 47 comes into contact with the regulating surface 42b of the positioning piece 42, and the stage 40 is moved to the downset operation position. The downset amount is determined by adjusting the height of the positioning piece 42 using the screw 45.

The details of the tape gripping mechanism 3 are as shown in FIGS. 5 to 7, and in the figures, 48 is a frame attached to a machine stand (not shown), and guides 48a, 48b are attached in the vertical direction. is formed. Reference numeral 49 denotes a lower frame to which a bearing 50 is integrally attached, and the bearing 50 engages with a guide 48a formed on frame #-48 to move up and down in the vertical direction. 51 is the bottom frame 49
It is a presser piece fitted into a groove formed in the screw 52.
It is fixed to the lower frame 49 by. Reference numeral 53 denotes an upper frame to which a bearing 54 is integrally attached, and the bearing 54 is attached to the frame body 48.
It engages with a guide 48b formed in the vertical direction and moves up and down in the vertical direction. Reference numeral 55 denotes a presser piece fitted into a groove formed in the upper frame 53, and is fixed to the upper frame 53 with a screw 56.

57 is a cylinder, a lower frame 49 is attached to the body, and an upper frame 53 is attached to the end of the piston rod. 58 is frame 4
A bottle 59 protruding from 8 and a bottle 6 protruding from the lower frame 49
0 is the passed spring, which pulls the wound of the roller 57 downward. The downward movement of the lower frame attached to the cylinder 57 is restricted by a screw 61 screwed into the frame 48.

Further, upward movement of the upper frame 53 attached to the piston rod of the cylinder 57 is restricted by a screw 62 screwed onto the frame body 48, and downward movement is restricted by a screw 63.

64 is a guide frame attached to the frame body 48, and the tape 9
A guide groove 64a for regulating the position of the wire in the width direction and a hole 64b for bonding operation are formed.

Reference numeral 65 denotes a control device or microcomputer consisting of a memory circuit, a comparison/arithmetic circuit, an operation command circuit, and the like.

66 is a main compressed air supply pipe, which is connected to a compressed air supply source such as a compressor. 67 is a pressure reducing valve that adjusts the pressure of compressed air supplied to the cylinder 17 for bringing the cam follower 12 into contact with the second cam body 8;
6, the outlet side is connected to a solenoid valve 68 via a compressed air supply pipe 75. Further, the outlet side of the solenoid valve 68 is connected to the cylinder 17 through a compressed air supply pipe 76. Reference numeral 69 denotes a pressure reducing valve that adjusts the pressure of the compressed air flowing down the bonding tool 16 during the bonding operation, and the inlet side is connected to the compressed air supply main pipe 66 and the outlet side is connected to the electromagnetic valve 70.

Further, the outlet side of the solenoid valve 70 is connected to the solenoid valve 68 through a compressed air supply pipe 77. Reference numeral 71 denotes a pressure reducing valve that adjusts the pressure of compressed air supplied to the cylinder from which the bonding tool 16 is lowered during the down-setting operation, and the inlet side is connected to the compressed air supply main pipe 66 and the outlet side is connected to the electromagnetic valve 72. Further, the outlet side of the solenoid valve 72 is connected to a compressed air supply pipe 77. 73
is a solenoid valve that supplies and stops the supply of compressed air to the cylinder moving down the stage 40 during a downset operation, and the inlet side is connected to the main compressed air supply pipe 66, and the outlet side is connected to the cylinder 26 through compressed air supply pipes 78 and 79. be.

Reference numeral 74 designates a solenoid valve that supplies and stops the supply of compressed air to the cylinder that regulates the amount of descent of the stage 40 during a downset operation. It is connected to 44.

When performing bonding processing and durance setting processing using the above-mentioned equipment, operate the pressure reducing valve to remove cylinder 1.
The pressure of the compressed air supplied to 7 is set to a preset value. Further, the screw body 19 is operated to adjust the bonding tool 16 to descend to a predetermined position during the down-set operation, and the screw 45 is operated to adjust the positioning piece 4.
The lowering position of the stage 40 during the down-setting operation is adjusted by operating the screw body 47. Control device 6
5 has bonding head 1 and bonding stage 2
, the operation order and operation time of the tape gripping mechanism 3, etc., the amount of tape conveyance, the bonding tool 16, and the stage 4.
Set and input the heating temperature etc. of 0.

Next, a tape supply reel (not shown) is attached to a predetermined tape supply section, and the tape 9 is supplied from the reel (not shown).
The chip 91 is pulled out and passed between the guide groove 64a of the guide frame 64 and the presser piece 51.55 and wound around a reel (not shown) attached to the winding section, and the chip 91 is passed through the guide groove 64a of the guide frame 64 and the presser piece 51. Prepare on trays, conveyors, etc.

When these preparations are completed and the control device 65 is started, the tape 90 is fed out and the first inner lead 90a formed on the tape 90 is conveyed to the bonding operation position, and the cylinder 57 is moved accordingly. The piston rod retracts and the upper frame 53 descends until it comes into contact with the screw 63. However, the piston rod continues to try to withdraw, and the lower frame 49 rises together with the main body of the cylinder 57, and the tape 90 is held by the presser piece 51 attached to the lower frame 49 and the presser piece 55 attached to the upper frame 53. Grip from above and below. During the above operation, a feeding mechanism (not shown) is actuated to place the chip 91 on the stage 40, and then
When a table (not shown) or the like operates to transport the chip 91 to the bonding operation position, the solenoid valve 73 operates to supply compressed air to the cylinder 26, retract the piston rod, and move the cam body 27 in the (toward) direction. move the elevating body 24,
The stage 40 is moved upward together with the support body 28. When the chip 91 on the stage 40 moves to the bonding position, an electric motor (not shown) is activated to rotate the first cam #7 together with the shaft 6, and move the bonding head 16 together with the support 5 in the direction (A). stand out. When the bonding head 16 moves to the bonding position, the solenoid valve 68
is activated, the pipe line is switched, and compressed air from the pressure reducing valve 67 is supplied to the cylinder 17, causing the piston rod to protrude.
The rocking body 10 is rotated in the (d) direction about the shaft 11, and the cam follower 12 is brought into contact with the second cam body 8 with a predetermined pressing force.

Then, an electric motor (not shown) operates and moves the shaft 6 along with the first
The cam body 7 rotates to change the cam surface so as to move closer to the axis. At this time, since compressed air is still being supplied to the cylinder 17, the oscillator 10 is rotated in the (d) direction about the shaft 11 as a fulcrum as the cam surface changes. Then, together with the bracket 14, the bonding head 1
6 is lowered in the vertical direction, and the inner leads 90a formed on the tape 90 and the terminals 91a of the chip 91 are connected to the terminals 91a of the chip 91 by the bonding head 16 heated to a predetermined temperature.
It is pressed with a force of 5 kg, and the rocking body 10
The actuating part 10a formed at the end of the detector 18a
When the solenoid valve 68 and the solenoid valve 70 operate simultaneously, the pipe line is switched and compressed air from the pressure reducing valve 70 is supplied to the cylinder 17 to supply the bonding head 16 with 20-3.
01qr force is applied to heat and press the inner leads 90a formed on the tape 90 and the terminals 91a of the chip 91 to perform the bonding process.During the bonding process, the solenoid valve 74 is operated to supply compressed air to the cylinder. 44
the positioning piece 42 to protrude the piston rod.
move it into place.

When the preset bonding processing time has elapsed, the solenoid valves 68, 70, 72, and 73 are operated simultaneously to switch the pipelines, supplying compressed air from the pressure reducing valve 71 to the cylinder 17, and supplying the cylinder 26 with compressed air from the pressure reducing valve 71. Change the compressed air supply position to protrude the piston rod and release the spring 34.
As a result, the stage 40 together with the elevating body 24 and the support body 28 is lowered until the screw body 47 integrally attached to the support body 28 comes into contact with the positioning piece 42 . At this time, the bowing head 16 also has the inner lead 90a of the tape 90.
A force of 2 to 5 ksr is applied to the top surface of stage 40.
While holding the inner lead 90a and chip 91 between them, the screw body 19, which is integrally attached to the bonding tool 16, is lowered until it comes into contact with the upper surface 5a of the support body 5.

In the above-described operation, the tape 90 is fixed by the holding pieces 51 and 55, and only the tip 91 operates when the lower motor (not shown) rotates the second cam body 8 together with the shaft 6 to rotate the oscillator 10 as the shaft. It rotates in the direction (C) using 11 as a fulcrum. Then, the bonding tool 16 is raised together with the bracket 13, and the detector 18 is
When b is activated, an electric motor (not shown) is activated and the shaft 6 is activated.
At the same time, the first cam body 7 rotates and retracts the support body in the (b) direction to place the bonding tool 16 in the standby position. When a preset down-set operation time has elapsed, the solenoid valve 6
8.74 is activated to switch the pipe line and stop the supply of compressed air to the cylinder 17, switch the position of supplying compressed air to the cylinder 44, retract the piston rod, and return the positioning piece 42 to the standby position. Then, the spring 34 The stage 40 is lowered together with the elevating body 24 and the support body 28 to a position i where the roller 25 comes into contact with the cam body 27. On the other hand, when the electromagnetic valve 68 is activated and the supply of compressed air to the cylinder 17 is stopped, the electric current is activated to switch the position of supplying compressed air to the cylinder 57 and protrude the piston rod, and the upper frame 35 is connected to the screw 62. come into contact with At this time, the piston rod tries to protrude further, so it moves together with the main body of the cylinder 57 until the lower frame 49 comes into contact with the screw 61. By the movement of the upper frame 53 and the lower frame 49, the holding of the tape 90 by the presser pieces 51 and 55 is released. Then, the tape supply section and the winding section (not shown) operate to move the tape 90, and the second inner lead 90a is transported to the bonding operation position. The bonding process and downsetting process for the terminal 91a of the chip 91 are completed.

By repeating the above operations, the terminals 9 of the chip 91 are connected to the inner leads 91a formed on the tape 90.
The bonding process 1a and the downsetting process can be performed continuously.

(Effects of the Invention) In the semiconductor bonding method of the present invention, a chip is placed on a bonding stage, the tape is conveyed to a predetermined position, and the bonding head is vertically lowered to connect the inner leads formed on the tape. The terminals of the chip are heated and crimped to perform the bonding process, and then, with the tape fixed, the bonding stage and bonding head are lowered while holding the inner lead part and the chip to perform the downset process. Downset processing can be performed following processing,
Manufacturing time can be shortened.

Further, the semiconductor bonding apparatus of the present invention has a bonding head disposed above and a bonding stage below the tape gripping mechanism, and the bonding stage and the bonding head are operated simultaneously or independently. Since it is configured to move up and down in the vertical direction, bonding and downsetting can be reliably performed without causing distortion, wrinkles, etc. in the film tape.

The above-mentioned apparatus is configured so that the bonding head and the bonding stage are vertically moved up and down by a cam mechanism, and therefore has a simple configuration and can be implemented reliably.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view showing one embodiment of the semiconductor bonding apparatus of the present invention, and FIG. 2 is a z-
It is a Z arrow view. FIG. 3 is a schematic diagram of the bonding stage, and FIG. 4 is a view taken along the line X--X in FIG. 3. Fig. 5 is a schematic diagram of the tape gripping mechanism, and Fig. 6 is a schematic diagram of the tape gripping mechanism.
7 is a plan view of FIG. 5; FIG. FIG. 8 is a schematic diagram showing a cross section of a down-set semiconductor device. 1: Bonding head, 2: Bonding tool, 3: Chi 1 gripping mechanism, 4.48: Frame, 5, 28: Support, 6.11, 2
9: Shaft, 7: First cam body, 37: Cooling body, 39: Heating body, 42: Positioning piece, 51.55: Holding piece, 64: Guide frame, 38: Heat insulator, 40: Stage, 49: Bottom frame, 53: upper frame, 65: control device,

Claims (1)

[Claims] 1) Place the chip on the bonding stage, and
The tape is conveyed to a predetermined position, the bonding head is lowered vertically, and the inner leads formed on the tape and the terminals of the chip are heated and crimped to perform the bonding process.Then, with the tape fixed, it is moved to the bonding stage. A semiconductor bonding method characterized by performing down-set processing by lowering a bonding head while gripping an inner lead portion and a chip. 2) A bonding head is disposed above and a bonding stage is disposed below the tape gripping mechanism, and the bonding stage and bonding head are configured to move up and down in the vertical direction simultaneously or independently. A semiconductor bonding device characterized by: 3) A semiconductor bonding apparatus according to claim 2, wherein the bonding head and the bonding stage are vertically moved up and down by a cam mechanism.