JPH02207497A - High frequency heating device - Google Patents

Abstract

PURPOSE:To make a whole device compact by constructing a wave guide bundle unit consisting of several wave guides connected to each other and arranging several said bundle units in parallel and providing flow path constructing means between the wave guide bundle units respectively. CONSTITUTION:A high frequency connecting system 5 is constructed with several wave guide bundle units 12 and several flow constructing means such as ducts 10 and connecting member 11. The unit 12 consists of several wave guiders 7 arranged in a line and connected to each other in direct contact. Several units 12 are installed in a same direction parallel to each other, and between respective units 12 and on the upper surface of the upper unit 12 and under the lower surface of the lower unit 12 ducts 10 are provided so as to be able to flow a liquid for cooling and heating of the respective wave guides. With this structure high power output transmission is made possible because of high efficiency of cooling and heating of respective wave guides. In addition, as no outer pressure is applied to the wave guides, the wall thickness of which can be made thin no construct the device compact.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a high frequency heating device for, for example, a low hybrid wave band, which is used for plasma heating in a nuclear fusion (experimental) device or the like.

(Prior art) Conventionally, in plasma heating in nuclear fusion (experimental) equipment, in addition to Joule heating, which heats the plasma by passing an electric current through it, a neutral particle heating method and a high-frequency heating device have been used as a second-stage heating method. . This high-frequency heating method is a method of increasing the temperature of the plasma by absorbing the energy of high-frequency electromagnetic waves into the plasma, and there are various methods depending on the frequency used, one of which is low-frequency hybrid wave band high-frequency heating.

FIG. 2 is a configuration explanatory diagram showing an example of this, which is
A high-frequency oscillator 1 that oscillates and amplifies high-frequency electromagnetic waves, a high-frequency transmission system 3 that transmits the electromagnetic waves generated by this high-frequency oscillator 1 to a nuclear fusion (experimental) device 2, and a high-frequency transmission system 3 that is connected to this high-frequency transmission system 3 and irradiates electromagnetic waves to plasma 4. It consists of a high frequency coupling system 5. Note that the high frequency transmission system 3 is provided with a vacuum sealing plate 6.

Figure 3 shows an example of a conventional high-frequency coupling system 5 (Japanese Patent Publication No. 59-4
3002).

As is clear from this figure, a plurality of waveguides 7 having a rectangular cross section are arranged in a grid pattern, thereby forming a waveguide bundle 8. In this case, the high-frequency electromagnetic waves from the high-frequency oscillator 1 shown in FIG. Ru.

Each waveguide 7 is entirely covered by a waveguide bundle container 9, and a predetermined space is formed between each waveguide 7 and on the outer circumferential side of each waveguide 7. )
Further, a duct is provided on the upper surface of the waveguide bundle container 9, thereby forming a fluid (return path) passage 9b. Fluid for cooling and heating each waveguide 7 can be supplied to each fluid passage 9a, 9b. That is, before operation, high-temperature fluid is flowed to heat the waveguide 7 in order to reduce the gas emitted from the waveguide 7, and during operation, a cooling fluid is flown to remove Joule heat generation and irradiation heat from the plasma 4. It can be cooled down.

By flowing the cooling and heating fluids in this way, it becomes possible to withstand high-output, long-pulse operation.

If there is no cooling/heating means using cooling and heating fluid as described above, the inside of the waveguide 7 is under vacuum,
This is because heat transfer is limited to thermal conduction, which results in insufficient cooling and heating, and cannot withstand high frequency (high output) long pulse operation.

(Problem to be Solved by the Invention) In the configuration shown in FIG. 3, a fluid passage 9a is formed on the outer peripheral surface of each waveguide 7 so that fluid flows, and the inside of each waveguide 7 is in a vacuum state. Since an external pressure of at least 1 kg/cd acts on each waveguide 7, the wall thickness of each waveguide 7 cannot be made very thin. In addition, each waveguide 7
Since the fluid passage 9a is formed on the entire outer circumferential surface of the waveguide, it is impossible to narrow the mutual pitch of the waveguides, and there is a limit to increasing the aperture ratio of the electromagnetic wave irradiation part at the tip on the plasma 4 side. be. For these reasons, the high-frequency heating apparatus using the high-frequency coupling system shown in FIG. 3 cannot be made compact as a whole, and cannot heat plasma with high output and high efficiency.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a high-frequency heating device that can be made compact as a whole and can perform plasma heating with high output and high efficiency.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention has a high frequency coupling system configured as follows. That is, a plurality of waveguides are arranged in a row, and the waveguides are connected in direct contact with each other to form a waveguide bundle unit, and a plurality of waveguide bundle units are arranged in parallel in the same direction. In addition, a flow path forming means is provided at least between the waveguide bundle units for forming a fluid flow path for at least one of cooling and heating each waveguide.

(Function) Since the present invention is configured as described above, it is possible to cool or heat at least one of the waveguides by the cooling fluid and the heating fluid flowing in the flow path forming means, and each waveguide can be cooled or heated. Since external pressure is not applied to the tube unlike in conventional devices, the wall thickness of each waveguide can be reduced.

In addition, since the waveguide bundle unit has a structure in which multiple waveguides are connected by directly contacting each other, it is possible to narrow the waveguide pitch compared to conventional equipment, and the electromagnetic wave irradiation part Pore ratio can be increased.

Therefore, the entire structure can be made compact, and high output and high efficiency plasma heating is possible.

(Example) An example of the present invention will be described below with reference to FIG. FIG. 1 is a cross-sectional view showing only the high-frequency coupling system (5 in FIG. 2), and the rest of the structure is the same as the conventional device, so a description thereof will be omitted here. That is, this high frequency coupling system 5 includes a plurality of waveguide bundle units 12, a plurality of flow path forming means, such as a duct 10, and a connecting member 11.
It consists of The waveguide bundle unit 12 is made up of a plurality of waveguides 7 (eight in the figure) each having a rectangular cross section arranged in a row and connected by bringing the waveguides into direct contact with each other. A plurality of meters of waveguide bundle units 12 (four sets in the figure) are arranged in parallel in the same direction, and between the waveguide bundle units 12 and on the upper surface of the upper waveguide bundle unit 12 and the lower waveguide bundle unit 12. A duct 10 is provided on the bottom surface of the waveguide so that a fluid for cooling and heating each waveguide can flow therethrough.

This duct 10 is divided into two parts 10a and 10b, and one of them is configured such that, for example, 10a is used as an outgoing fluid path, and the other 10b is used as an incoming fluid path to flow fluid.

That is, each duct 10 is connected to a supply pipe and a discharge pipe (not shown) installed on the anti-plasma side, and is connected to an external cooling and heating fluid supply system. Also,
The tip of the duct 10 (plasma 4 side) is sealed,
The forward and backward paths are communicated so that the fluid can be reversed.

Each waveguide bundle unit 12 and duct 10 are integrated with a connecting member 11 to constitute a high frequency coupling system 5.

Next, the operation of the high frequency heating device having the high frequency coupling system 5 configured as described above will be explained.

Since a high frequency current flows through the waveguide 7, heat generation occurs due to Joule loss. In addition, the tip of the plasma side has plasma 4
The radiant heat from the These heats are removed by the fluid flowing through the duct 10. That is, the cooling fluid supplied from an external cooling fluid supply system (not shown) through the supply pipe flows through the flow path 10a formed in the duct 10 to cool the waveguide 7, and is heated through the discharge pipe (not shown). Return to cooling system.

In addition, during operation, the cooling fluid is allowed to flow through the waveguide 7 as described above, but the high temperature fluid from the heating fluid supply system is allowed to flow through the waveguide 7.
It can also be heated. By performing this heating before operation, it is possible to reduce the amount of gas released from the waveguide 7 and the duct 10, thereby reducing the inflow of impurities into the plasma 4. Therefore, since discharge within the waveguide 7 can also be prevented, high-output power can be stably transmitted.

Furthermore, since no external pressure acts on the waveguide 7, each waveguide 7
The thickness of the wall can be reduced. In addition to being able to reduce the thickness of the waveguide 7, there is no gap between the waveguides 7 of the waveguide bundle unit 12, which makes it more compact than the conventional high-frequency coupling system 5, and It is possible to increase the aperture ratio of the side irradiation area.

Therefore, high output and high efficiency plasma heating is possible.

In the above-described embodiments of the present invention, cooling and heating fluids flow through the duct 10, but depending on the application, at least one of the cooling and heating fluids may flow through the duct 10. Further, although the duct 10 is arranged on the upper and lower surfaces of the waveguide bundle unit 12, it may be arranged on the lateral side. etc., or the configuration of the duct 10 can be appropriately selected depending on the device for which it is used.

[Effects of the Invention] As described above, according to the present invention, the following effects can be obtained. That is, since each waveguide can be efficiently cooled and heated, the heat removal capacity can be increased and the amount of released gas can be reduced. Therefore, high output power transmission is possible. In addition, since no external pressure acts on the waveguide, the wall thickness can be reduced, resulting in a compact structure, and the aperture ratio of the radiation section on the plasma side is increased, improving the efficiency of irradiating the plasma. Therefore, it is possible to provide a compact high-frequency heating device capable of high-output, high-efficiency plasma heating.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of only the main part (high-frequency coupling system) of an embodiment of the high-frequency heating device according to the present invention, Fig. 2 is an explanatory diagram of the configuration of an example of a general high-frequency heating device, and Fig. 3 is a conventional FIG. 2 is a cross-sectional view showing an example of a high frequency coupling system. 1... High frequency oscillator, 2... Nuclear fusion (experimental) device,
3... High frequency transmission system, 4... Plasma, 5... High frequency coupling system, 6... Vacuum sealed upper plate, 7... Waveguide, 8... Waveguide bundle, 9...・・Waveguide bundle container, 10・・
- Duct, 11... Connecting member, 12... Waveguide bundle unit. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

[Claims] A high-frequency heating device that heats plasma in a vacuum vessel by irradiating high-frequency electromagnetic waves into a vacuum vessel through a high-frequency coupling system, wherein the high-frequency coupling system includes a plurality of waveguides. Arrange in one row,
The waveguides are connected in direct contact with each other to form a waveguide bundle unit, and a plurality of waveguide bundle units are arranged in parallel in the same direction, and at least between the waveguide bundle units,
1. A high-frequency heating device comprising flow path forming means for forming a fluid flow path for at least one of cooling and heating each waveguide.