JPH0220823Y2 - - Google Patents
Info
- Publication number
- JPH0220823Y2 JPH0220823Y2 JP1031486U JP1031486U JPH0220823Y2 JP H0220823 Y2 JPH0220823 Y2 JP H0220823Y2 JP 1031486 U JP1031486 U JP 1031486U JP 1031486 U JP1031486 U JP 1031486U JP H0220823 Y2 JPH0220823 Y2 JP H0220823Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- holder
- support rod
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 66
- 239000007788 liquid Substances 0.000 claims description 25
- 239000007921 spray Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 description 8
- 238000011161 development Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Weting (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は透光性ガラス板に遮光性膜を被着した
フオトマスク基板や、半導体基板に半導体酸化物
膜を被着したものにそれぞれフオトレジストを塗
布した後、そのフオトレジストを所定のパターン
で露光されたこれ等基板のパターン形成工程にお
ける現像工程,エツチング工程等に使用されるス
プレー装置に係り、特に基板サイズおよび厚みの
変更に拘わらず容易に対応でき、しかも基板表面
全体に噴出液を均一にゆきわたらせることができ
るようにしたものである。[Detailed description of the invention] [Industrial application field] The present invention applies photoresist to a photomask substrate in which a light-shielding film is coated on a transparent glass plate, and a semiconductor oxide film is coated on a semiconductor substrate. After coating the photoresist, the photoresist is exposed to light in a predetermined pattern.The spray equipment used in the pattern forming process of these substrates, such as the development process and etching process, is especially easy to use regardless of changes in substrate size and thickness. In addition, the ejected liquid can be uniformly spread over the entire surface of the substrate.
従来、この種のスプレー装置は、第7図〜第9
図に示すように基板1の各種寸法サイズ(例えば
6,5,4および3インチ)に応じて、その4隅
を支持する支持具2を備えている。すなわち、こ
の支持具2は最も大きい(6インチ角)基板1の
端面1aとの当接面3と、その底面部分が載置さ
れる載置面4とを以つて6インチ角用の支持部を
構成し、基板サイズが小さくなるに従つて当接面
5と載置面6,当接面7と載置面8および当接面
9と載置面10とからなる支持部を階段的に深く
なるように形成している。そして、支持具2は回
転軸11に連結具12を介して取付けられ、図示
しないモータの駆動によつて定速回転(現像,エ
ツチング時:100〜500r.p.m)され、この回転し
ている状態でチヤンバー13の天井に設置された
噴出孔14から現像液,エツチング液等の噴出液
15が基板1に向けて噴射される。その際、噴出
液15は基板1の静止時において、例えば第8図
破線で示すように基板1の対角線方向に向かつて
両弧によつて形成された略凸レンズ形状の被噴出
領域16(被噴出領域16の中心は回転中心軸
と一致している)内に分布し、基板1の回転によ
り噴出液15が該基板1の表面全体に均一にゆき
わたるようにしている。
Conventionally, this type of spray device is shown in Figs.
As shown in the figure, supports 2 are provided to support the four corners of the substrate 1 according to various sizes (for example, 6, 5, 4, and 3 inches). That is, this support 2 has a contact surface 3 that contacts the end surface 1a of the largest (6 inch square) substrate 1, and a mounting surface 4 on which the bottom surface portion is placed. As the board size becomes smaller, the support part consisting of the contact surface 5 and the mounting surface 6, the contact surface 7 and the mounting surface 8, and the contact surface 9 and the mounting surface 10 are arranged in a stepped manner. It is formed to be deep. The support 2 is attached to the rotating shaft 11 via the coupling 12, and is rotated at a constant speed (during development and etching: 100 to 500 rpm) by the drive of a motor (not shown), and is in this rotating state. A jetting liquid 15 such as a developing solution or an etching solution is jetted toward the substrate 1 from a jetting hole 14 installed on the ceiling of the chamber 13 . At this time, when the substrate 1 is stationary, the ejected liquid 15 is directed toward the diagonal direction of the substrate 1 as shown by the broken line in FIG. The center of the region 16 coincides with the central axis of rotation), and the rotation of the substrate 1 causes the ejected liquid 15 to spread uniformly over the entire surface of the substrate 1.
しかしながら、このような従来のスプレー装置
においては、基板1のサイズを変えて、例えば第
7図に示すように最も小さな基板1′を設置した
場合、支持具2の構造上設置位置が高さ方向で異
なるため、噴出孔14を最も大きな基板1の中心
に指向させておいても小さな基板1′に対しては
その中心に指向せず、被噴出領域16の中心が回
転中心軸よりΔだけずれてしまい、また第8
図に示すように基板1の4隅を支持するものにお
いては、各辺の中央部分を支持する場合に比べて
支持具2の長さが長くなる。また、第9図に示す
ように最も小さい基板1′を設置した場合、該基
板1′の下方からその主表面に沿つてはみ出した
支持具2の部分2aも長くなり、基板1′を回転
させるために支持具2を回転させた時に、前記部
分2aがチヤンバー13内の空気を乱して噴出液
15の流れに悪影響を与える。その結果、基板
1′を回転させても噴出液15を基板1′の表面全
体に均一にゆきわたらせることができず、これを
原因として基板1′のパターン形成工程において
均一な線幅のパターンを形成することができなか
つた。また、サイズが同じでも板厚が変ると、前
述したと同様に被噴出領域16の中心が回転中心
軸よりずれてしまい噴出液15を均一にゆきわ
たらせることができなかつた。
However, in such a conventional spray device, when the size of the substrate 1 is changed and, for example, the smallest substrate 1' is installed as shown in FIG. 7, the installation position of the support 2 in the height direction is Therefore, even if the ejection hole 14 is directed to the center of the largest substrate 1, it will not be directed to the center of the smaller substrate 1', and the center of the ejection area 16 will be shifted by Δ from the rotation center axis. 8th episode again
As shown in the figure, in the case of supporting the four corners of the substrate 1, the length of the support 2 is longer than that in the case of supporting the center portion of each side. Furthermore, when the smallest substrate 1' is installed as shown in FIG. 9, the portion 2a of the support 2 that protrudes from below the substrate 1' along its main surface also becomes longer, making it difficult to rotate the substrate 1'. Therefore, when the support 2 is rotated, the portion 2a disturbs the air within the chamber 13 and adversely affects the flow of the ejected liquid 15. As a result, even if the substrate 1' is rotated, the ejected liquid 15 cannot be uniformly spread over the entire surface of the substrate 1', and this causes a pattern with a uniform line width in the pattern forming process of the substrate 1'. could not be formed. Further, even if the size is the same, if the plate thickness changes, the center of the ejected region 16 will be shifted from the rotational center axis as described above, making it impossible to spread the ejected liquid 15 uniformly.
本考案に係るスプレー装置は上述したような問
題を解決すべくなされたもので、チヤンバー内に
配設され駆動装置によつて回転される支持具上に
基板を配置し、前記チヤンバー内に設けた噴出孔
から前記基板に向けて噴出液を噴出し、前記支持
具の回転により噴出液を前記基板の表面全体にほ
ぼ均一にゆきわたらせるスプレー装置において、
前記支持具は少なくとも1本の支持棒と、この支
持棒にそれぞれ着脱自在に取付けられ前記基板を
保持する一対のホルダとを備え、前記支持棒は長
手方向中央を回転中心とし、また前記支持棒の両
側面にはそれぞれ一対からなる複数組のホルダ係
止部が前記基板の各種サイズに応じて前記回転中
心を中心として左右対称な位置に設けられ、各ホ
ルダ係止部は高さ方向に並設され前記ホルダを選
択的に係止する複数個の係止部を有し、前記ホル
ダは前記基板の端面部分に当接する当接面と、前
記端面部分近傍の底面を支持する支持面とを有す
る本体と、この本体の下面両側部に垂設された左
右一対の脚片と、これら一対の脚片の内側面に対
向して突設され前記各ホルダ係止部の複数個の係
止部に選択的に係合する一対の係合部を備えてい
るものである。
The spray device according to the present invention was made to solve the above-mentioned problems, and includes a substrate placed on a support provided in a chamber and rotated by a drive device, and a spray device provided in the chamber. A spray device in which a jet liquid is jetted from a jet hole toward the substrate, and the jet liquid is spread almost uniformly over the entire surface of the substrate by rotation of the support,
The support includes at least one support rod, and a pair of holders that are detachably attached to the support rod and hold the substrate, and the support rod has a longitudinal center as a center of rotation, and the support rod has a longitudinal center as a rotation center. A plurality of sets of holder locking portions each consisting of a pair are provided on both sides of the substrate at symmetrical positions with respect to the rotation center according to various sizes of the substrate, and each holder locking portion is arranged in a row in the height direction. The holder has a plurality of locking portions provided to selectively lock the holder, and the holder has a contact surface that contacts an end surface portion of the substrate and a support surface that supports a bottom surface near the end surface portion. a main body having a main body, a pair of left and right legs vertically provided on both sides of the lower surface of the main body, and a plurality of locking portions of each of the holder locking portions protruding from the inner surfaces of the pair of legs. The device is equipped with a pair of engaging portions that selectively engage with each other.
本考案においては基板の厚みによつてホルダの
取付け高さを変更できるため、各種寸法サイズお
よび各種板厚の基板であつてもほぼ同一高さ位置
に設置でき、またホルダは基板の端面部分を支持
するため隅部を支持する場合に比べて支持棒の長
さを短かくすることができ、したがつてチヤンバ
ー内の空気の乱れを抑制でき、各種基板の表面全
体に噴出液を均一に塗布させることができる。
In this invention, the mounting height of the holder can be changed depending on the thickness of the board, so even boards of various sizes and thicknesses can be installed at almost the same height. The length of the support rod can be made shorter than when supporting the corners, which can suppress air turbulence within the chamber and evenly apply the ejected liquid to the entire surface of various substrates. can be done.
以下、本考案をフオトマスク基板の現像工程に
おいて使用する場合に実施例を挙げて詳細に説明
する。
Hereinafter, the present invention will be described in detail by way of examples when used in a photomask substrate development process.
第1図は本考案を特徴づける支持具の一部分解
斜視図、第2図および第3図はそれぞれ支持棒の
一部破断側面図、第4図および第5図は第2図
−線および−線断面図、第6図は支持具の
要部底面図である。なお、支持具を除くスプレー
装置の他の構造は第7図に示した従来装置と同一
であるため、その説明は省略する。 FIG. 1 is a partially exploded perspective view of the support that characterizes the present invention, FIGS. 2 and 3 are partially cutaway side views of the support rod, and FIGS. 4 and 5 are the lines and lines in FIG. The line sectional view and FIG. 6 are bottom views of essential parts of the support. Note that the other structure of the spray device except for the support is the same as the conventional device shown in FIG. 7, so a description thereof will be omitted.
また、本実施例の基板1は、石英ガラス板にク
ロム膜(膜厚:800Å)を被着し、その上にフオ
トレジスト(例:米国ヘキスト社製 AZ1350,
膜厚:4000Å)を塗布し、このレジストに対して
所定のパターンの露光が行われており、この基板
1に対して現像液(例:AZ専用デイベロツパ)
が本考案のスプレー装置によつて噴射される。な
お、現像工程に限らず噴出液を変更すればエツチ
ング工程,洗浄工程,フオトレジストの塗布工程
にも使用できることは云うまでもない。 Further, the substrate 1 of this example is a quartz glass plate coated with a chromium film (thickness: 800 Å), and a photoresist (e.g. AZ1350 manufactured by Hoechst Co., Ltd.
This resist is coated with a film thickness of 4000 Å) and exposed to light in a predetermined pattern.
is sprayed by the spray device of the present invention. It goes without saying that it can be used not only for the development process but also for the etching process, cleaning process, and photoresist coating process by changing the ejected liquid.
さて、第1図に示したように回転軸11に連結
具12を介して配設される支持具20は、耐薬品
性,耐食性に優れた材料、例えば四弗化エチレン
によつて同一長さおよび幅の角棒状に形成され、
その長手方向中央において互いに直交する如く、
かつ表面が同一平面を形成する如く一体的に結合
された2本の支持棒21,22と、同一形状に形
成され各支持棒21,22にそれぞれ一対ずつ向
い合わせに取付けられる合計4個のホルダ23
(23A〜23D)とを備えている。 Now, as shown in FIG. 1, the support 20 disposed on the rotating shaft 11 via the connector 12 is made of a material with excellent chemical resistance and corrosion resistance, such as tetrafluoroethylene, and has the same length. It is formed into a rectangular bar shape with a width of
so that they are perpendicular to each other in the center of their longitudinal direction,
Two support rods 21 and 22 are integrally connected so that their surfaces form the same plane, and a total of four holders are formed in the same shape and are attached to each of the support rods 21 and 22 in pairs facing each other. 23
(23A to 23D).
一方の支持棒21の底面中央部には第2図に示
すように前記連結具12の台座12Aの直径とほ
ぼ同一長さを有する凹部24が形成され、さらに
この凹部24の中央にはもう一方の支持棒22の
幅とほぼ同一の長さを有する凹部25が形成され
ている。これに対して、前記もう一方の支持棒2
2の表面中央には第3図に示すように前記支持棒
21の幅とほぼ同一の長さを有する凹部26が形
成され、さらに下面中央には前記台座12Aの直
径とほぼ同一の長さを有する凹部27が形成され
ている。支持棒21,22の中央部を互いに直交
した状態で重ね合わせて凹部25に支持棒22を
嵌合し、凹部26に支持棒21を嵌合させると、
両支持棒21,22は組手結合によつて一体的に
結合され、これによつて両支持棒の表面が同一平
面を形成する。また、この結合状態で各支持棒2
1,22の凹部24,27に前記台座12Aを嵌
合させると、支持棒21,22の回転中心が回転
軸11の中心と一致する。そして、各支持棒2
1,22は第6図に示すようにそれぞれ一対の止
めねじ28(ステンレス製)によつて前記台座1
2A上に固定される。止めねじ28の頭部は噴出
液による腐食を防止するため、四弗化エチレンに
よつてコーテイングされる。なお、第2図および
第3図において29は前記止めねじ28の取付用
孔である。 As shown in FIG. 2, a recess 24 having approximately the same length as the diameter of the pedestal 12A of the connector 12 is formed in the center of the bottom surface of one of the support rods 21, and furthermore, in the center of this recess 24, the other A recess 25 is formed having a length that is approximately the same as the width of the support rod 22 . On the other hand, the other support rod 2
As shown in FIG. 3, a recess 26 having a length approximately the same as the width of the support rod 21 is formed in the center of the surface of the support rod 21, and a recess 26 having a length approximately the same as the diameter of the pedestal 12A is formed in the center of the lower surface. A recess 27 is formed therein. When the center parts of the support rods 21 and 22 are overlapped with each other at right angles and the support rod 22 is fitted into the recess 25 and the support rod 21 is fitted into the recess 26,
Both support rods 21 and 22 are integrally connected by a clasp connection, so that the surfaces of both support rods form the same plane. Also, in this connected state, each support rod 2
When the pedestal 12A is fitted into the recesses 24 and 27 of the support rods 21 and 22, the rotation centers of the support rods 21 and 22 coincide with the center of the rotation shaft 11. And each support rod 2
1 and 22 are respectively attached to the pedestal 1 by a pair of set screws 28 (made of stainless steel), as shown in FIG.
Fixed on 2A. The head of the set screw 28 is coated with tetrafluoroethylene to prevent corrosion from the ejected liquid. In addition, in FIGS. 2 and 3, 29 is a mounting hole for the set screw 28.
前記支持棒21にはそれぞれ左右一対からなる
4組のホルダ係止部31Aと31B,32Aと3
2B,33Aと33Bおよび34Aと34Bが該
支持棒21の回転中心を中心として対称な位置に
それぞれ形成されている。これらのホルダ係止部
31Aと31B……34Aと34Bはそれぞれ基
板1の寸法サイズに対応して支持棒21の両側面
に形成されるもので、それぞれ縦溝と横溝とから
なり、最も回転中心に近いホルダ係止部31Aと
31Bが4インチ基板用で、回転中心から順次遠
くになるにしたがつて5インチ,6インチおよび
7インチ基板用のホルダ係止部を構成している。
ホルダ係止部31Aの構造を更に詳述すると、縦
溝36aと、一端が縦溝36aにそれぞれ連通す
る上下2つの横溝36b,36cとからなり、横
溝36b,36cが前記ホルダ23を選択的に係
止する係止部を構成している。この場合、上側の
横溝36bは基板厚さ0.09インチ用の係止部を構
成し、下側の横溝36cは基板厚さ0.25インチ用
の係止部を構成している。そして、厚さ0.09イン
チの基板表面と0.25インチの基板表面とが同一高
さとなるように横溝36bと横溝36cとが並設
されている。同様に、他のホルダ係止部31B,
32A,32B,33A,33B,34A,34
Bも第2図に示すようにそれぞれ縦溝と横溝37
a〜37c,38a〜38c,39a〜39c,
40a〜40c,41a〜41c,42a〜42
c,43a〜43cとで構成されている。但し、
横溝36b,36c,38b,38c,40b,
40c,42b,42cと37b,37c,39
b,39c,41b,41c,43b,43cと
は左右対称的に形成されることにより、向きが逆
で、支持棒21の中心側とは反対方向を向いてい
る。 The support rod 21 has four sets of holder locking portions 31A and 31B, 32A and 3, each consisting of a left and right pair.
2B, 33A and 33B, and 34A and 34B are formed at symmetrical positions with respect to the rotation center of the support rod 21, respectively. These holder locking portions 31A and 31B...34A and 34B are formed on both sides of the support rod 21 in accordance with the dimensions of the substrate 1, and each consist of a vertical groove and a horizontal groove, and are located at the center of rotation. The holder locking portions 31A and 31B closest to the center are for 4-inch substrates, and the farther away from the center of rotation they are, the holder locking portions for 5-inch, 6-inch, and 7-inch substrates are configured.
The structure of the holder locking part 31A will be described in more detail. It consists of a vertical groove 36a and two upper and lower horizontal grooves 36b and 36c, each of which has one end communicating with the vertical groove 36a. The horizontal grooves 36b and 36c selectively hold the holder 23 It constitutes a locking part. In this case, the upper lateral groove 36b constitutes a locking portion for a substrate thickness of 0.09 inch, and the lower lateral groove 36c constitutes a locking portion for a substrate thickness of 0.25 inch. The lateral grooves 36b and 36c are arranged in parallel so that the 0.09-inch-thick substrate surface and the 0.25-inch-thick substrate surface are at the same height. Similarly, other holder locking parts 31B,
32A, 32B, 33A, 33B, 34A, 34
B also has vertical grooves and horizontal grooves 37, respectively, as shown in Figure 2.
a~37c, 38a~38c, 39a~39c,
40a-40c, 41a-41c, 42a-42
c, 43a to 43c. however,
Horizontal grooves 36b, 36c, 38b, 38c, 40b,
40c, 42b, 42c and 37b, 37c, 39
b, 39c, 41b, 41c, 43b, and 43c are formed symmetrically so that they are opposite in direction and face the opposite direction to the center side of the support rod 21.
また、支持棒21の両側面には該支持棒の各端
より中心に向つて長く延在する左右一対の通路4
5A,45Bが形成されており、これらの通路4
5A,45Bには前記各ホルダ係止部31Aと3
1B……34Aと34Bの縦溝36a,38a,
40a,42aおよび37a,39a,41a,
43aの上端がそれぞれ連通している。それらの
通路45A,45Bの幅W4および深さDは、前
記縦溝36a〜43aの深さD3および横溝36
b〜43b,36c〜43cの幅W6および深さ
D3と同一に設定されている。 Further, on both sides of the support rod 21, there are a pair of left and right passages 4 extending long from each end of the support rod toward the center.
5A, 45B are formed, and these passages 4
5A and 45B have the respective holder locking parts 31A and 3.
1B...Vertical grooves 36a, 38a of 34A and 34B,
40a, 42a and 37a, 39a, 41a,
The upper ends of 43a are in communication with each other. The width W 4 and depth D of those passages 45A and 45B are the same as the depth D 3 of the vertical grooves 36a to 43a and the horizontal groove 36.
Width W 6 and depth of b ~ 43b, 36c ~ 43c
It is set the same as D 3 .
前記支持棒22にも前記支持棒21と同様第3
図に示すように4組のホルダ係止部50Aと50
B,51Aと51B,52Aと52Bおよび53
Aと53Bが該支持棒22の両側面に回転中心を
中心として左右対称な位置に形成されている。ホ
ルダ係止部50Aと50Bは4インチ基板用で、
それぞれ縦溝と2つの横溝55a〜55c,56
a〜56cからなり、ホルダ係止部51Aと51
Bは5インチ基板用で、それぞれ縦溝と2つの横
溝57a〜57c,58a〜58cからなり、ホ
ルダ係止部52Aと52Bは6インチ基板用で、
それぞれ縦溝と2つの横溝59a〜59c,60
a〜60cからなる。そしてホルダ係止部53A
と53Bは7インチ基板用で、それぞれ縦溝と2
つの横溝61a〜61c,62a〜62cによつ
て構成されている。横溝55b,55c……62
b,62cは前記ホルダ23を選択的に係止する
係止部を構成している。また、横溝55b,55
c,57b,57c,59b,59c,61b,
61cと56b,56c,58b,58c,60
b,60c,62b,62cとは左右対称的に形
成されることにより、向きが逆で、支持棒22の
中心側とは反対方向を向いている。 The support rod 22 also has a third support rod similar to the support rod 21.
As shown in the figure, four sets of holder locking parts 50A and 50
B, 51A and 51B, 52A and 52B and 53
A and 53B are formed on both sides of the support rod 22 at symmetrical positions with respect to the center of rotation. Holder locking parts 50A and 50B are for 4 inch boards,
A vertical groove and two horizontal grooves 55a to 55c, 56, respectively.
Consisting of a to 56c, holder locking parts 51A and 51
B is for a 5-inch board, each consisting of a vertical groove and two horizontal grooves 57a to 57c, 58a to 58c, and the holder locking parts 52A and 52B are for a 6-inch board;
A vertical groove and two horizontal grooves 59a to 59c, 60, respectively.
It consists of a to 60c. And holder locking part 53A
and 53B are for 7-inch boards, with vertical grooves and 2
It is constituted by two horizontal grooves 61a to 61c and 62a to 62c. Horizontal grooves 55b, 55c...62
b and 62c constitute a locking portion that selectively locks the holder 23. In addition, the horizontal grooves 55b, 55
c, 57b, 57c, 59b, 59c, 61b,
61c and 56b, 56c, 58b, 58c, 60
b, 60c, 62b, and 62c are formed symmetrically so that they are opposite in direction and face the opposite direction to the center side of the support rod 22.
また、支持棒22の両側面には該支持棒22の
端部よりそれぞれ中心に向つて長く延在する左右
一対の通路65A,65Bが形成されており、こ
れらの通路65A,65Bには前記各ホルダ係止
部50Aと50B……53Aと53Bの縦溝55
a,57a,59a,61aおよび56a,58
a,60a,62aの上端がそれぞれ連通してい
る。これらの通路65A,65Bの幅W4および
深さDは前記縦溝55a〜62aの深さD3およ
び横溝55b〜62b,55c〜62cの幅W6
および深さD3と同一で、かつ前記支持棒21の
通路45A,45Bとを同一である。 Furthermore, a pair of left and right passages 65A, 65B are formed on both sides of the support rod 22, each extending from the end of the support rod 22 toward the center. Holder locking parts 50A and 50B...vertical grooves 55 of 53A and 53B
a, 57a, 59a, 61a and 56a, 58
The upper ends of a, 60a, and 62a are in communication with each other. The width W 4 and depth D of these passages 65A and 65B are the depth D 3 of the vertical grooves 55a to 62a and the width W 6 of the horizontal grooves 55b to 62b and 55c to 62c.
and the same depth D3 , and the same as the passages 45A and 45B of the support rod 21.
前記ホルダ23,23A〜23Dは支持棒2
1,22と同様四弗化エチレン等によつて一体に
製作されるもので、第1図に示すように略凹形を
なす本体70と、この本体70の下面両側部に一
体に垂設されて互いに対向する一対の脚片71,
72を有し、各脚片71,72の内側面下部には
前記各ホルダ係止部31Aと31B,……34A
と34Bの2つの係合部、すなわち横溝36bと
36c……43bと43cのうちのいずれか一方
に選択的に係合する直方体状の係合部73,74
がそれぞれ突設されて互いにその先端面を対向さ
せている。前記本体70は、平板状の基部76
と、基部76の表面両側部に突設された左右一対
の側壁78,79と、基部76の一方の端面に突
設された略四角柱状の載置台80とを一体に有
し、この載置台80の上面が前記基板1の側端部
近傍の底面部分を支持する水平な載置面82を構
成し、前記各側壁78,79の載置台側端面が基
板1の端面に当接する当接面84をそれぞれ構成
し、前記載置面82と直交している。当接面84
の高さは基板1の最大板厚とほぼ等しいかもしく
はそれより小さく設定されている。前記基部76
の表面は載置台側端が反対側端より高くなるよう
傾斜している。また、前記側壁78,79の上面
も前記基部76の表面とほぼ平行になるように傾
斜している。 The holders 23, 23A to 23D are the support rods 2
Like Nos. 1 and 22, it is manufactured integrally from tetrafluoroethylene or the like, and as shown in FIG. a pair of leg pieces 71 facing each other,
72, and the respective holder locking portions 31A, 31B, .
and 34B, that is, lateral grooves 36b and 36c... rectangular parallelepiped-shaped engaging portions 73, 74 that selectively engage with either one of 43b and 43c.
are protruding from each other, with their tip surfaces facing each other. The main body 70 has a flat base 76
It integrally includes a pair of left and right side walls 78, 79 protruding from both sides of the surface of the base 76, and a substantially square columnar mounting table 80 protruding from one end surface of the base 76. The upper surface of 80 constitutes a horizontal mounting surface 82 that supports the bottom surface near the side end of the substrate 1, and the end surface of each of the side walls 78 and 79 on the mounting table side is a contact surface that abuts the end surface of the substrate 1. 84, which are perpendicular to the mounting surface 82. Contact surface 84
The height of is set to be approximately equal to or smaller than the maximum thickness of the substrate 1. The base 76
The surface of is sloped so that the end on the side of the mounting table is higher than the end on the opposite side. Further, the upper surfaces of the side walls 78 and 79 are also inclined so as to be substantially parallel to the surface of the base 76.
前記一対の脚片71,72の間隔Wは支持棒2
1,22の幅とほぼ等しいかもしくは若干大きく
設定されている。前記各係合部73,74の突出
寸法dは前記支持棒21,22の各ホルダ係止部
31Aと31B……34Aと34Bおよび通路4
5A,45Bの深さとほぼ等しいかもしくは若干
小さく設定されている。また各係合部73,74
の幅W1は、前記支持棒21,22の各ホルダ係
止部31Aと31B……34Aと34Bの縦溝3
6a〜43aの幅および横溝36b,36c……
43b,43cの長さ(左右方向)とほぼ等しい
かもしくは若干小さく設定されている。そして、
各係合部73,74の板厚tは前記横溝36b,
36c……43b,43cの幅(上下方向)およ
び通路45A,45Bの幅とほぼ等しいかもしく
は若干小さく設定されている。したがつて、各係
合部73,74は支持棒21,22の通路45A
または45Bより各ホルダ係止部31Aと31B
……34Aと34Bの縦溝36a〜43aを通つ
て横溝36b,36c……43b,43cのいず
れにも自由に差し込まれる。 The distance W between the pair of leg pieces 71 and 72 is the same as that of the support rod 2.
The width is set to be approximately equal to or slightly larger than the width of 1 and 22. The protrusion dimension d of each of the engaging portions 73 and 74 is determined by the holder locking portions 31A and 31B of the support rods 21 and 22...34A and 34B and the passage 4.
The depth is set to be approximately equal to or slightly smaller than the depth of 5A and 45B. In addition, each engaging portion 73, 74
The width W 1 is the vertical groove 3 of each holder locking portion 31A and 31B of the support rods 21 and 22...34A and 34B.
Widths of 6a to 43a and horizontal grooves 36b, 36c...
The lengths (in the left-right direction) of 43b and 43c are set to be approximately equal to or slightly smaller. and,
The plate thickness t of each engaging portion 73, 74 is the horizontal groove 36b,
36c...The width (in the vertical direction) of 43b, 43c and the width of the passages 45A, 45B are set to be approximately equal to or slightly smaller. Therefore, each engaging portion 73, 74 is connected to the passage 45A of the support rods 21, 22.
Or each holder locking part 31A and 31B from 45B
. . . can be freely inserted into any of the horizontal grooves 36b, 36c, . . . 43b, 43c through the longitudinal grooves 36a to 43a of 34A and 34B.
このような構成からなる支持具20において、
各支持棒21,22のホルダ係止部31Aと31
B……34Aと34Bおよび50Aと50B……
53Aと53Bは、基板1の寸法サイズに応じて
選定され、その選定されたホルダ係止部に4つの
ホルダ23が以下に記すように着脱自在に取り付
けられる。この場合、本実施例は基板サイズが7
インチ角の基板1を設置する例を示しており、そ
のため7インチ角基板用のホルダ係止部34A,
34B,53A,53Bが選定され、これらのホ
ルダ係止部に前記各ホルダ23A〜23Dが各支
持棒21,22の端面側より、当接面84が互い
に対向するよう内側に向けて取付けられる。この
取付けは一対の係合部73,74を各支持棒2
1,22の通路45A,45B,65A,65B
に挿入し、さらに各ホルダ係止部34A,34
B,53A,53Bの縦溝42a,43a,61
a,62aより基板1の板厚に応じて、例えば板
厚が0.09インチの場合、上方の横溝42b,43
b,61b,62bにそれぞれ係入し、0.25イン
チの場合には下方の横溝42c,43c,61
c,62cにそれぞれ係入すれば、0.09インチの
基板と0.25インチの基板とは同一高さとなる。そ
して、基板1の各端面の中央部分を各ホルダ23
A〜23Dの当接面84にそれぞれ当接させつ
つ、端面部分近傍の底面を載置面82上に載せる
と、基板1は4つのホルダ23A〜23Dによつ
て保持される。この場合、各ホルダ23A〜23
Dは、その係合部73,74が前記横溝42b,
43b,61b,62b又は42c,43c,6
1c,62cに挿入されていることで、上下方向
の移動を防止され、また、これらの横溝が縦溝4
2a,43a,61a,62aより外側に形成さ
れていることで、支持具20の回転時の遠心力に
よる外側方向への移動も防止される。一方、横溝
42b,43b,61b,62b(42c,43
c,61c,62cも同様)の長さ5(第1図)
と、係合部73,74の幅W1との関係をW1<
5<W1+2(mm)と設定することにより左右方向
に対しては若干の移動を許容している。これは基
板1を支持具20上に設置する際、基板1の端面
部分を当接面84に当接した状態で載置面82ま
で下げていくことが困難になることを防止するた
め、設置時における基板1のなじみをよくし、滑
らかに設置するために有効とされる。 In the support 20 having such a configuration,
Holder locking portions 31A and 31 of each support rod 21, 22
B...34A and 34B and 50A and 50B...
53A and 53B are selected according to the size of the substrate 1, and the four holders 23 are detachably attached to the selected holder locking portions as described below. In this case, in this embodiment, the substrate size is 7
An example is shown in which an inch square board 1 is installed, so the holder locking part 34A for a 7 inch square board,
34B, 53A, and 53B are selected, and each of the holders 23A to 23D is attached to these holder locking portions from the end surface side of each support rod 21, 22, facing inward so that the contact surfaces 84 face each other. This installation involves attaching the pair of engaging portions 73 and 74 to each support rod 2.
1, 22 passages 45A, 45B, 65A, 65B
and further each holder locking part 34A, 34
Vertical grooves 42a, 43a, 61 of B, 53A, 53B
Depending on the thickness of the board 1 from a, 62a, for example, if the board thickness is 0.09 inch, the upper lateral grooves 42b, 43
b, 61b, 62b, respectively, and in the case of 0.25 inch, the lower horizontal grooves 42c, 43c, 61
c and 62c, the 0.09-inch board and the 0.25-inch board will be at the same height. Then, place the center portion of each end surface of the substrate 1 into each holder 23.
The substrate 1 is held by the four holders 23A to 23D when the bottom surface near the end surface portion is placed on the mounting surface 82 while making contact with the contact surfaces 84 of A to 23D, respectively. In this case, each holder 23A to 23
D, the engaging portions 73 and 74 are connected to the lateral grooves 42b,
43b, 61b, 62b or 42c, 43c, 6
1c and 62c prevents movement in the vertical direction, and these horizontal grooves are inserted into the vertical grooves 4.
By being formed outside of 2a, 43a, 61a, and 62a, movement toward the outside due to centrifugal force during rotation of the support 20 is also prevented. On the other hand, the horizontal grooves 42b, 43b, 61b, 62b (42c, 43
c, 61c, 62c) length 5 (Figure 1)
and the width W 1 of the engaging portions 73 and 74 as W 1 <
By setting 5 < W 1 +2 (mm), a slight movement in the left and right direction is allowed. This is to prevent it from becoming difficult to lower the board 1 to the mounting surface 82 with the end surface of the board 1 in contact with the contact surface 84 when installing the board 1 on the support 20. It is said to be effective for improving the conformability of the board 1 during installation and for smooth installation.
かくしてこのような支持具20によれば、各種
寸法サイスおよび各種板厚の基板1を設置した
際、その中心が回転軸11の中心と一致して回転
する。すなわち、基板サイズの異なるものであつ
ても板厚が同じである限り同一平面上に設置する
ことができ、さらには板厚が異なるものであつて
も各ホルダ係止部31Aと31B……34Aと3
4B,50Aと50B……53Aと53Bの2つ
の横溝36b,36c……43b,43c,55
b,55c……62b,62cのいずれか一方を
板厚に応じて選択することで、ほぼ同一平面上に
設置することができるため、噴出孔が各種サイズ
の基板の中心を常に指向し、したがつて噴出液を
基板の表面全体に均一にゆきわたらせることがで
きる。 Thus, according to such a support 20, when substrates 1 of various sizes and thicknesses are installed, their centers rotate to coincide with the center of the rotating shaft 11. That is, even if the boards have different sizes, they can be installed on the same plane as long as the board thickness is the same, and even if the board thicknesses are different, each holder locking part 31A and 31B...34A and 3
4B, 50A and 50B... 2 horizontal grooves 36b, 36c, 53A and 53B... 43b, 43c, 55
b, 55c... By selecting either one of 62b and 62c according to the board thickness, they can be installed on almost the same plane, so the jet hole always points to the center of the board of various sizes, and As a result, the ejected liquid can be uniformly spread over the entire surface of the substrate.
また、ホルダ23,23A〜23Dは各支持棒
21,22に着脱自在に取付けられるだけで、止
ねじ等によつて固定されないため、基板1のサイ
ズおよび厚みの変更に伴うホルダの取付位置の変
更が簡単かつ容易で短時間に行え、取扱い性さら
には装置の稼動率を向上させる。 In addition, since the holders 23, 23A to 23D are only detachably attached to the support rods 21, 22 and are not fixed with set screws, etc., the mounting position of the holders can be changed due to changes in the size and thickness of the board 1. This can be done simply and easily in a short time, improving ease of handling and improving the operating rate of the device.
また、基板1の4隅を支持せず、各辺の中央部
分を支持しているので、支持棒21,22の長さ
を短かくすることができる。したがつて、最も小
さい4インチ角の基板を設置した場合、その基板
の下方から主表面と平行にはみ出す支持棒21,
22の突出寸法を短かくできる。それ故、支持具
20を回転させてもチヤンバー内の空気の乱れが
少なく、またこの空気の乱れが少なければ噴出液
の流れを乱すことも少ないため、噴出液を基板の
表面全体に均一にゆきわたらせることができる。 Further, since the four corners of the substrate 1 are not supported, but the center portion of each side is supported, the lengths of the support rods 21 and 22 can be shortened. Therefore, when the smallest 4-inch square board is installed, the support rod 21 protrudes from below the board parallel to the main surface,
The protruding dimension of 22 can be shortened. Therefore, even when the support 20 is rotated, there is little turbulence in the air within the chamber, and if there is little turbulence in the air, there is little disturbance in the flow of the ejected liquid, so the ejected liquid can be spread uniformly over the entire surface of the substrate. It can be passed on.
また、当接面84の高さhを基板1の板厚Tよ
り小さく設定すると、基板1の各端面部分表面上
の噴出液を当接面84によつて阻止することがな
く、遠心力によつて良好に飛ばすことができる。
すなわち、仮りにh>Tとすると、当接面84が
基板1の表面より上方に突出するため、この突出
部に噴出液が当つて滞留し、遠心力によつては飛
ばされないことから、噴出液の膜厚が不均一にな
る虞れがあるが、本実施例においてはh<Tに設
定しているので、このような不具合を防止でき
る。但し、h=Tでも同様の効果が得られる。 Furthermore, if the height h of the abutting surface 84 is set smaller than the thickness T of the substrate 1, the ejected liquid on the surface of each end surface of the substrate 1 will not be blocked by the abutting surface 84, and will be affected by centrifugal force. Therefore, it can be thrown well.
That is, if h>T, the contact surface 84 protrudes above the surface of the substrate 1, and the ejected liquid hits this protrusion and stays there, and is not blown away by the centrifugal force, so that the ejected liquid Although there is a possibility that the film thickness of the liquid may become non-uniform, in this embodiment, since h<T is set, such a problem can be prevented. However, the same effect can be obtained even when h=T.
また、基部76および側壁78,79の上面を
斜面としているので、これら上面に落下した噴出
液が流れ易く、早く吹き飛ばすことができる。 Furthermore, since the upper surfaces of the base 76 and side walls 78, 79 are sloped, the ejected liquid that falls onto these upper surfaces can easily flow and be blown off quickly.
なお、上記実施例は十字状に交差する2本の支
持棒21,22と4個のホルダ23とで支持具2
0を構成したが、本考案はこれに何ら限定される
ものではなく、基板サイズ,ホルダ23の幅寸
法,支持具20自体の回転数等によつては1本の
支持棒と2個のホルダで支持具を構成することを
可能である。 In addition, in the above embodiment, the support tool 2 is made up of two support rods 21 and 22 that intersect in a cross shape and four holders 23.
0, but the present invention is not limited to this, and depending on the substrate size, the width dimension of the holder 23, the rotation speed of the support 20 itself, etc., one support rod and two holders may be used. It is possible to configure the support with.
また、上記実施例は各支持棒21,22の端面
側よりホルダ23を通路45A,45B,65
A,65Bに沿つて取付けるようにしたが、各ホ
ルダ係止部31A,31B……34A,34B,
50A,50B……53A,53Bの縦溝36a
〜43a,55a〜62aを支持棒21,22の
上面にまで延在させれば、前記通路が不要で上方
からの取付けが可能である。 Further, in the above embodiment, the holder 23 is connected to the passages 45A, 45B, 65 from the end surface side of each support rod 21, 22.
A, 65B, but each holder locking part 31A, 31B...34A, 34B,
50A, 50B... 53A, 53B vertical groove 36a
By extending 43a, 55a to 62a to the upper surfaces of the support rods 21 and 22, the passages described above are unnecessary and installation from above is possible.
また、上記実施例は基板1の当接面84を2つ
設けたが、側壁78,79の数を増減することに
より1個あるいは3個以上であつてもよい。 Further, in the above embodiment, two contact surfaces 84 are provided for the substrate 1, but the number may be one or three or more by increasing or decreasing the number of side walls 78 and 79.
以上設明したように本考案に係るスプレー装置
は、支持棒に対してホルダを着脱自在に取付けて
いるので、基板サイズおよび基板の板厚の変更に
対して迅速かつ容易に対応でき、取扱い性および
稼動率を向上させることができる。また、ホルダ
の取付高さを基板の板厚に応じて変更し得るた
め、何れの基板も同一平面上に設置することがで
きる。したがつて、被噴出領域の中心軸が回転中
心軸からずれることがなく、噴出液を基板の表面
全体に均一にゆきわたらせることができる。ま
た、基板の端面部分を保持するため、隅部を保持
する場合、に比べて支持棒の長さを短かくするこ
とができる。この結果、チヤンバー内の空気の乱
れが減少し、噴出液をより一層均一に塗布するこ
とができる。そのため、特にレジスト露光後の現
像,エツチング,洗浄の一連の各工程において使
用した場合、均一な線幅のパターンを形成するこ
とができ、その実用的効果は非常に大である。
As established above, the spray device according to the present invention has a holder detachably attached to the support rod, so it can quickly and easily respond to changes in board size and board thickness, and is easy to handle. and the operating rate can be improved. Further, since the mounting height of the holder can be changed according to the thickness of the board, both boards can be installed on the same plane. Therefore, the central axis of the ejected region does not deviate from the rotation center axis, and the ejected liquid can be uniformly spread over the entire surface of the substrate. Furthermore, since the end surface portion of the substrate is held, the length of the support rod can be made shorter than when holding the corner portion. As a result, air turbulence within the chamber is reduced and the ejected liquid can be applied more uniformly. Therefore, especially when used in a series of steps such as development, etching, and cleaning after resist exposure, a pattern with uniform line width can be formed, and its practical effects are very large.
第1図は本考案に係るスプレー装置の支持具を
示す一部分解斜視図、第2図および第3図はそれ
ぞれ支持棒の一部破断側面図、第4図および第5
図は第2図−線および−線断面図、第6
図は支持具の要部底面図、第7図〜第9図は従来
のスプレー装置を示し、第7図は全体構成図、第
8図は支持具上に基板を設置した状態の平面図、
第9図は支持具の平面図である。
1……基板、13……チヤンバー、14……噴
出孔、15……噴出液、20……支持具、21,
22……支持棒、23,23A〜23D……ホル
ダ、31A,31B〜34A,34B……ホルダ
係止部、36a〜43a……縦溝、36b,36
c〜43b,43c……横構(係止部)、45A,
45B……通路、50A,50B〜53A,53
B……ホルダ係止部、55a〜62a……縦溝、
55b,55c〜62b,62c……横溝(係止
部)、65A,65B……通路、70……ホルダ
ー本体、71,72……脚片、73,74……係
合部、82……載置面、84……当接面。
FIG. 1 is a partially exploded perspective view showing the support of the spray device according to the present invention, FIGS. 2 and 3 are partially cutaway side views of the support rod, and FIGS. 4 and 5, respectively.
The figures are Figure 2 - line and - line sectional view, Figure 6
The figure is a bottom view of the main parts of the support, FIGS. 7 to 9 show a conventional spray device, FIG. 7 is an overall configuration diagram, and FIG. 8 is a plan view of the substrate installed on the support.
FIG. 9 is a plan view of the support. 1...Substrate, 13...Chamber, 14...Ejection hole, 15...Ejected liquid, 20...Support, 21,
22...Support rod, 23, 23A-23D...Holder, 31A, 31B-34A, 34B...Holder locking portion, 36a-43a...Vertical groove, 36b, 36
c~43b, 43c...Horizontal structure (locking part), 45A,
45B...Aisle, 50A, 50B to 53A, 53
B...Holder locking portion, 55a to 62a...Vertical groove,
55b, 55c to 62b, 62c... Horizontal groove (locking part), 65A, 65B... Passage, 70... Holder body, 71, 72... Leg piece, 73, 74... Engagement part, 82... Mounting Placement surface, 84...Abutment surface.
Claims (1)
される支持具上に基板を配置し、前記チヤンバー
内に設けた噴出孔から前記基板に向けて噴出液を
噴出し、前記支持具の回転により噴出液を前記基
板の表面全体にほぼ均一にゆきわたらせるスプレ
ー装置において、前記支持具は少なくとも1本の
支持棒と、この支持棒にそれぞれ着脱自在に取付
けられ前記基板を保持する一対のホルダとを備
え、前記支持棒は長手方向中央を回転中心とし、
また前記支持棒の両側面にはそれぞれ一対からな
る複数組のホルダ係止部が前記基板の各種サイズ
に応じて、前記回転中心を中心として左右対称な
位置に設けられ、各ホルダ係止部は高さ方向に並
設され前記ホルダを選択的に係止する複数個の係
止部を有し、前記ホルダは前記基板の端面部分に
当接する当接面と、前記端面部分近傍の底面を支
持する載置面とを有する本体と、この本体の下面
両側部に垂設された左右一対の脚片と、これら一
対の脚片の内側面に対向して突設され前記各ホル
ダ係止部の複数個の係止部に選択的に係合する一
対の係合部とを備えていることを特徴とするスプ
レー装置。 A substrate is placed on a support provided in a chamber and rotated by a drive device, and a jet liquid is jetted toward the substrate from a jet hole provided in the chamber, and is jetted by rotation of the support. In the spray device that spreads the liquid almost uniformly over the entire surface of the substrate, the support includes at least one support rod and a pair of holders that are respectively detachably attached to the support rod and hold the substrate. The support rod has a longitudinal center as a center of rotation,
Further, on both sides of the support rod, a plurality of pairs of holder locking portions are provided at symmetrical positions with respect to the rotation center according to various sizes of the substrate, and each holder locking portion is The holder has a plurality of locking parts that are arranged in parallel in the height direction and selectively lock the holder, and the holder supports a contact surface that contacts the end surface portion of the substrate and a bottom surface near the end surface portion. a main body having a mounting surface, a pair of left and right legs vertically provided on both sides of the lower surface of the main body, and a pair of legs protruding from the inner surfaces of each of the holder locking parts. A spray device comprising: a pair of engaging portions that selectively engage with a plurality of locking portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1031486U JPH0220823Y2 (en) | 1986-01-29 | 1986-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1031486U JPH0220823Y2 (en) | 1986-01-29 | 1986-01-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124844U JPS62124844U (en) | 1987-08-08 |
| JPH0220823Y2 true JPH0220823Y2 (en) | 1990-06-06 |
Family
ID=30796490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1031486U Expired JPH0220823Y2 (en) | 1986-01-29 | 1986-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0220823Y2 (en) |
-
1986
- 1986-01-29 JP JP1031486U patent/JPH0220823Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62124844U (en) | 1987-08-08 |
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