JPH02208907A - Inductance element and its manufacturing method - Google Patents
Inductance element and its manufacturing methodInfo
- Publication number
- JPH02208907A JPH02208907A JP1029096A JP2909689A JPH02208907A JP H02208907 A JPH02208907 A JP H02208907A JP 1029096 A JP1029096 A JP 1029096A JP 2909689 A JP2909689 A JP 2909689A JP H02208907 A JPH02208907 A JP H02208907A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- comb terminal
- terminal
- lead wire
- comb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に利用されるインダクタンス素
子およびその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inductance element used in various electronic devices and a method for manufacturing the same.
従来の技術
従来の磁気シールド化された巻線型インダクタンス素子
の構造を第2図に示す。2. Description of the Related Art The structure of a conventional magnetically shielded wire-wound inductance element is shown in FIG.
第2図において、1はドラム型に形成されたフェライト
コアで、このフェライトコア1にはコイル2が巻回され
、このフェライトコア1の底面にはコム端子3が接着剤
4により結合され、このコム端子3にコイル2の引出線
6が接続され、上記コム端子3の先端のみを表出させる
ようにMn−Zn系フェライト粉末を含む樹脂6でモー
ルドし、この樹脂6より突出するコム端子3を樹脂6の
側面に沿うように折曲して構成されていた。In FIG. 2, 1 is a drum-shaped ferrite core, a coil 2 is wound around this ferrite core 1, a comb terminal 3 is bonded to the bottom surface of this ferrite core 1 with adhesive 4, and this The lead wire 6 of the coil 2 is connected to the comb terminal 3, and the comb terminal 3 is molded with a resin 6 containing Mn-Zn ferrite powder so that only the tip of the comb terminal 3 is exposed, and the comb terminal 3 protrudes from the resin 6. It was constructed by bending along the side surface of the resin 6.
このようにチップインダクタのシールドタイプにおいて
、現行品はNi−Zn系フェライトを含む絶縁性樹脂6
を用いて封止成形を行っている。更に高特性化を図るた
めに透磁率の高いMn−Zn系フェライト粉末を用いて
いた。In this way, in the shield type chip inductor, the current product is made of insulating resin 6 containing Ni-Zn ferrite.
Sealing molding is performed using In order to further improve the characteristics, Mn-Zn ferrite powder with high magnetic permeability was used.
しかしMn−Zn系フェライト焼結体は電気抵抗が低く
、そのために渦電流損失が発生し、高周波数帯域におい
ては渦電流損失が増大するために使用することが困難で
ある。However, the Mn--Zn ferrite sintered body has a low electrical resistance, which causes eddy current loss, and the eddy current loss increases in a high frequency band, making it difficult to use.
その対策としてMn−Zn系フェライト粉末を絶縁性樹
脂と混ぜて混練し粉末の表面を絶縁性樹脂で覆い電気抵
抗を上げることで、渦電流損失の増大するのを押さえ高
周波数帯域において使用することができるようになった
。As a countermeasure, Mn-Zn ferrite powder is mixed with insulating resin and kneaded, and the surface of the powder is covered with insulating resin to increase electrical resistance, thereby suppressing the increase in eddy current loss and allowing use in high frequency bands. Now you can.
発明が解決しようとする課題
しかしながら上述の透磁率の高いMn−Zn系フェライ
ト粉末を用いた絶縁性樹脂で封止成形を行った場合、N
i−Zn系フェライト粉末を用いた場合に比べてQ特性
が低くなるという欠点があり、このQ特性を向上させな
ければならないという問題点があった。Problems to be Solved by the Invention However, when sealing is performed with an insulating resin using the above-mentioned Mn-Zn ferrite powder with high magnetic permeability, N
There is a problem that the Q characteristic is lower than that when i-Zn ferrite powder is used, and the Q characteristic must be improved.
課題を解決するだめの手段
上述の課題を解決するために本発明のインダクタンス素
子は、素子内のコム端子及びコイルの引出線とコム端子
との接合部を絶縁性樹脂で絶縁被覆した構造にしたもの
である。Means for Solving the Problems In order to solve the above-mentioned problems, the inductance element of the present invention has a structure in which the comb terminal in the element and the joint between the coil lead wire and the comb terminal are coated with an insulating resin. It is something.
作用
上述のようにコム鴻子部分及びコイルの引出線とコム端
子との接合部を絶縁性樹脂で絶縁被覆した本発明の構造
にすることによりQ特性を向上させることができる。そ
の主な要因はコム端子及びコイル端子とコム端子との接
合部がMn−Zn系フェライト粉末と直接接触すること
がなくなることにあると思われる。Effects As described above, the Q characteristic can be improved by using the structure of the present invention in which the comb wire portion and the joint portion between the coil lead wire and the comb terminal are insulated and coated with an insulating resin. The main reason for this seems to be that the comb terminal and the joint between the coil terminal and the comb terminal no longer come into direct contact with the Mn--Zn ferrite powder.
実施例
以下、本発明について、具体的な実施例にて詳細に説明
する。EXAMPLES Hereinafter, the present invention will be explained in detail using specific examples.
第1図に示した巻線型のインダクタンス素子の一例の断
面図を利用して具体的に説明する。A detailed explanation will be given using a cross-sectional view of an example of a wire-wound inductance element shown in FIG.
第1図においてコム端子7上には接着剤8を介してドラ
ム型のフェライトコア9が結合され、このフェライトコ
ア9に巻回したコイル10の引出線11は上記コム端子
7に接続され、この引出線11との接続部を含むコム端
子7には絶縁性樹脂12による被覆を形成し、全体をM
n−Zn系フェライト粉末入り樹脂13で外装を形成し
、このMn−Zn系フェライト粉末入り樹脂13の外部
に突出し、絶縁性樹脂12の被覆の形成されないコム端
子7の先端を外装に沿って折曲してチップ型のインダク
タンス素子としたものである。In FIG. 1, a drum-shaped ferrite core 9 is bonded to the comb terminal 7 via an adhesive 8, and a lead wire 11 of a coil 10 wound around the ferrite core 9 is connected to the comb terminal 7. The com terminal 7 including the connection part with the lead wire 11 is coated with an insulating resin 12, and the whole is made of M
An exterior is formed of a resin 13 containing n-Zn ferrite powder, and the tip of the comb terminal 7 that protrudes outside of the resin 13 containing n-Zn ferrite powder and is not covered with the insulating resin 12 is folded along the exterior. It is bent to form a chip-type inductance element.
このインダクタンス素子の製造方法としては、コム端子
7に接着剤8を塗布し、その上にNi−Zn系のフェラ
イトコア9を置き、接着剤8を固化し、フェライトコア
9とコム端子7を固化し、次に直径30μmの絶縁被覆
銅線をフェライトコア9に42タ一ン巻線してコイル1
oとし、その両端の引出線11をコム端子7に半田付け
により接続し、絶縁性樹脂12でコム端子7及びコイル
10の引出線11とコム端子7との接合部分を絶縁被覆
した(試料点1)。そして比較するために前述において
コム端子7及びコイル1Qの引出線11との接合部分の
絶縁被覆を行っていないコイルも作成した(試料五2)
。The method for manufacturing this inductance element is to apply adhesive 8 to comb terminal 7, place Ni-Zn ferrite core 9 on top of it, solidify adhesive 8, and solidify ferrite core 9 and comb terminal 7. Then, an insulated copper wire with a diameter of 30 μm is wound with 42 turns around the ferrite core 9 to form the coil 1.
The lead wires 11 at both ends of the wire were connected to the com terminal 7 by soldering, and the joints between the com terminal 7 and the lead wire 11 of the coil 10 and the com terminal 7 were insulated with insulating resin 12 (sample point 1). For comparison, we also created a coil in which the connecting part between the COM terminal 7 and the lead wire 11 of the coil 1Q was not insulated (Sample 52).
.
一方、Mn−Zn系フェライト仮焼塊を粉砕し。On the other hand, a calcined Mn-Zn ferrite ingot was crushed.
105μm以下の粒径の粉末に分級し封止樹脂であるエ
ポキシ樹脂中に76重量係混合して熱ロールで混練し、
タブレットに成形した。次に前述のコム端子7に固定さ
れたコイル1oを金型内に設置し、この金型を170℃
に昇温した後、前述のMn−Zn系フェライト粉末入り
エポキシ樹脂13のタブレットを用いて、トランスファ
ー成形機を稼働させて封止成形を行った。一定時間置き
硬化させた後、金型から封止成形物を取り出し、160
℃で6時間程同化処理した後コム端子7の突出部を折り
曲げて、長さ3.2MJ幅1.6ffJ+、高さ1.1
朋のインダクタンス素子に仕上げた。The powder is classified into powders with a particle size of 105 μm or less, mixed by 76% by weight in an epoxy resin as a sealing resin, and kneaded with a hot roll.
Formed into a tablet. Next, the coil 1o fixed to the above-mentioned com terminal 7 is installed in the mold, and the mold is heated to 170°C.
After raising the temperature to , a transfer molding machine was operated to perform sealing molding using the tablets of the epoxy resin 13 containing the Mn-Zn ferrite powder described above. After curing for a certain period of time, the sealed molded product was removed from the mold and
After assimilation treatment at ℃ for about 6 hours, the protruding part of the comb terminal 7 was bent and the length was 3.2M, the width was 1.6ffJ+, and the height was 1.1
Finished with my inductance element.
これによりコム端子7及びコイル10の引出線11とコ
ム端子7との接合部分を絶縁被覆しているインダクタン
ス素子と、コム端子7及びコイル1Qの引出線11とコ
ム端子7との接合部分を絶縁被覆していないインダクタ
ンス素子を作成することができた。これら2種類のイン
ダクタンス素子についてL−C−RメーターでL及びQ
を測定した。This insulates the inductance element that insulates the joint between the COM terminal 7 and the lead wire 11 of the coil 10 and the COM terminal 7, and the joint between the COM terminal 7 and the lead wire 11 of the coil 1Q and the COM terminal 7. It was possible to create an uncoated inductance element. For these two types of inductance elements, L and Q are measured using an L-C-R meter.
was measured.
その結果を表−1に示す。The results are shown in Table-1.
(以下余 白)
以上の結果から本発明の黒1のインダクタンス素子は、
コム端子7およびコイル10の引出線11とコム端子7
との接合部分を絶縁被覆していないA2と比較してQw
ax値で106係の向上が認められた。(The following is a blank space) From the above results, the inductance element of the present invention shown in black 1 is as follows:
The com terminal 7 and the lead wire 11 of the coil 10 and the com terminal 7
Qw compared to A2 which does not have insulation coating on the joint part with
An improvement of 106 factors was observed in the ax value.
発明の効果 以上のように、インダクタンス素子において。Effect of the invention As mentioned above, in the inductance element.
Mn−Zn系フェライト粉末を含む絶縁性樹脂を用いて
封止成形を行う場合、コム端子及びコイルの引出線とコ
ム端子との接合部を絶縁性樹脂で覆うことによりQma
x値を覆わない場合と比べて106%向上させることが
でき、実用性のあるチップインダクタ素子にすることが
できる。又現在シールドタイプのチップ型のインダクタ
ンス素子に主として用いられているNi−Zn系フェラ
イト粉末に対して、本発明では更に高特性でかつ安価な
Mn−Zn系フェライト粉末を用いることができ得るこ
とは工業的に意義が太きい。When performing sealing molding using an insulating resin containing Mn-Zn ferrite powder, Qma
The x value can be improved by 106% compared to the case where it is not covered, and a practical chip inductor element can be obtained. Furthermore, in contrast to the Ni-Zn ferrite powder that is currently mainly used in shield-type chip-type inductance elements, the present invention can use Mn-Zn ferrite powder that has even higher characteristics and is cheaper. It has great industrial significance.
第1図は1本発明のインダクタンス素子の一実施例□を
示す断面図、第2図は従来の磁気シールド化された巻線
型インダクタンス素子の構造を示す断面図である。
7・・・・・・コム端子、8・・・・・・接着剤、9・
・・・・・フェンイトコア、10・・・・・・コイル
11・・・・・・引出線。
12・・・・・・絶縁性樹脂、13・・・・・・Ni−
Zn系フエ。
イト粉末入り樹脂。
代理人の氏名 弁理士 粟 野 重 孝 ほか1名第
図
第
図FIG. 1 is a sectional view showing an embodiment of an inductance element according to the present invention, and FIG. 2 is a sectional view showing the structure of a conventional magnetically shielded wire-wound inductance element. 7...Com terminal, 8...Adhesive, 9.
...Fenite Core, 10...Coil
11...Leader line. 12...Insulating resin, 13...Ni-
Zn-based fue. Resin containing light powder. Name of agent: Patent attorney Shigetaka Awano and one other person
Claims (2)
コイルの引出線とコム端子との接合部分が絶縁性樹脂で
覆われ、コム端子の先端を除いた全体をMn−Zn系フ
ェライト粉末入り樹脂で外装成形したインダクタンス素
子。(1) The comb terminal that connects the core around which the coil is wound and the joint between the coil lead wire and the comb terminal are covered with insulating resin, and the entire comb terminal except the tip is filled with Mn-Zn ferrite powder. Inductance element externally molded with resin.
イトコアに巻線を施してコイルとし、前記コイルの引出
線をコム端子に接続した後、コム端子及びコイルの引出
線とコム端子との接合部分を絶縁性樹脂で覆い、その後
Mn−Zn系フェライト粉末を含む絶縁性樹脂で封止成
形することを特徴とするインダクタンス素子の製造方法
。(2) After gluing a ferrite core to a comb terminal, winding the ferrite core to form a coil, and connecting the lead wire of the coil to the comb terminal, join the comb terminal and the lead wire of the coil to the comb terminal. 1. A method for manufacturing an inductance element, comprising covering a portion with an insulating resin, and then sealing and molding with an insulating resin containing Mn-Zn ferrite powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1029096A JPH02208907A (en) | 1989-02-08 | 1989-02-08 | Inductance element and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1029096A JPH02208907A (en) | 1989-02-08 | 1989-02-08 | Inductance element and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02208907A true JPH02208907A (en) | 1990-08-20 |
Family
ID=12266826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1029096A Pending JPH02208907A (en) | 1989-02-08 | 1989-02-08 | Inductance element and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02208907A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010597A (en) * | 2008-06-30 | 2010-01-14 | Tdk Corp | Coil part |
| JP2011054713A (en) * | 2009-09-01 | 2011-03-17 | Panasonic Corp | Coil component and method of manufacturing the same |
| JP2012109317A (en) * | 2010-11-15 | 2012-06-07 | Tokyo Coil Engineering Kk | Transformer |
| JP2021057482A (en) * | 2019-09-30 | 2021-04-08 | 株式会社村田製作所 | Coil component |
-
1989
- 1989-02-08 JP JP1029096A patent/JPH02208907A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010597A (en) * | 2008-06-30 | 2010-01-14 | Tdk Corp | Coil part |
| JP2011054713A (en) * | 2009-09-01 | 2011-03-17 | Panasonic Corp | Coil component and method of manufacturing the same |
| JP2012109317A (en) * | 2010-11-15 | 2012-06-07 | Tokyo Coil Engineering Kk | Transformer |
| JP2021057482A (en) * | 2019-09-30 | 2021-04-08 | 株式会社村田製作所 | Coil component |
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