JPH0221111B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field to Which the Invention Pertains] The present invention relates to a method for manufacturing a lead terminal, and in particular, a method for manufacturing a lead terminal to enable good soldering to the sheared surface of a lead terminal punched by a press. The present invention relates to a method of manufacturing a lead terminal.

[Prior art and its problems]

Generally, ICs, transistors, resistors, capacitors, and various electronic components are mounted on a printed circuit board, and the lead terminals of these electronic components are soldered to the copper foil part of the pattern area using an automatic soldering machine or manually. be done. Lead terminals of this type of electronic component are often punched out using a press, and the sheared surfaces formed by the punch and die become rough, which poses an obstacle to good soldering.

Conventionally, after pressing and bending, a surface treatment such as plating is applied to improve solderability, but this type of lead terminal is small, requires bending and other processing, and has a complex shape. As a result, parts got entangled with each other and parts were deformed during work such as plating, which interfered with the processing and assembly work in the next process, and required extra man-hours for correction work. . There is also a method in which the plate material is plated in the form of a hoop material and then pressed, but there is a problem in that the sheared surface is exposed by the pressing and reduces solderability.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a lead terminal that eliminates the drawbacks of conventional manufacturing methods, improves the properties of the sheared surface punched by pressing, and improves solderability.

[Key points of the invention]

In order to achieve the above object, the present invention provides a method for manufacturing lead terminals by punching out a plate material whose surface has been surface-treated by plating. The lead terminal is pressed into the plate material to reduce its thickness along the contour line of the lead terminal, and then the contour line part formed thinner than the thickness of the plate material by the thickness reduction process is punched out along the contour line of the lead terminal. The feature is that the outer shape is cut out using the same method.

[Embodiments of the invention]

Hereinafter, a method for manufacturing a lead terminal according to the present invention will be explained with reference to the drawings.

FIG. 1 shows a relay 2 as an example of an electronic component to be mounted on a printed circuit board 1.
is equipped with a plurality of lead terminals 3, 3, 3.
The lead terminals 3 of this relay 2 are soldered to a copper foil forming a pattern, and are usually manufactured by punching out a plate material.

Next, a method for manufacturing this lead terminal 3 according to the present invention will be explained.

First, a strip-shaped plate material 5 whose surface has been treated by plating with tin or the like is placed on a lower mold 4 having a flat surface. This plate material 5 is a flat plate having a uniform thickness t, and a punch 6 is pushed into the upper surface of this plate material 5 by a certain depth h. This punch 6 is equipped with teeth 9 for forming a reduced thickness part 8 inside the outline 7 of the lead terminal 3, and when pushed in by a depth h, a groove 10 is formed on the surface of the plate material 5. Ru. At this time, the plating layer on the surface of the plate material 5 spreads, so that it is in close contact with the plate material without peeling off. Then, the peak portion 11 whose thickness is not reduced forms the main body portion of the lead terminal 3.

It is preferable that the pushing operation of the punch 6 is performed continuously to form the plate material 5 at a pitch P.

Next, the lead terminal 3 is punched out along the contour line 7 using a punch and a die. The shear thickness at this time is approximately 0.25t at the part where the thickness has been reduced, so it can be easily cut.

Lead terminal 3 sheared in this way
is a reduced thickness part 8 having a uniform width b at the edge of the contour line 7.
is formed, and the thickness of the sheared surface of this reduced thickness portion 8 is smaller than the original thickness of the plate material 5. Therefore, it is possible to improve solderability when soldering the lead terminals 3 to the copper foil of a printed board.

In the embodiment shown in FIGS. 2A and B above,
Although the punch 6 was pushed into only one side of the plate 5, the punches 6, 6 may be pushed into both sides of the plate 5, as shown in FIGS. 3A and 3B.
That is, as shown in FIG. 3B, when punches 6, 6 of the same shape and size are pushed into the plate material 5 from both sides, a reduced thickness portion 8 is formed between the peaks 11, 11.

〔Effect of the invention〕

As described above, according to the present invention, in the process before punching the lead terminal, a punch having teeth corresponding to the outline of the lead terminal is pushed into the plate material, thereby reducing the number of parts along the outline of the lead terminal. By forming a thick part and punching out this reduced thickness part along the contour line, it becomes thinner than the thickness of the cut surface by punching, which simplifies the soldering work and makes it easier to cut by punching. Since the exposure of the plate material that appears on the surface can be reduced, solderability is not impaired, and there is no need to apply plating to the lead terminal parts to improve soldering after punching out the outline, making it inexpensive and high quality. We can provide good lead terminals.

[Brief explanation of drawings]

Figure 1 is a side view showing a relay body equipped with lead terminals, Figures 2A and B are explanatory diagrams showing the process of reducing the thickness of lead terminals using a punch, and Figures 3A and B are diagrams showing other methods of the present invention. It is an explanatory view showing a thickness reduction process by an example. 1...Printed circuit board, 3...Lead terminal, 5...
...Plate, 6...Punch, 7...Contour line.

Claims (1)

[Claims] 1. In a method of manufacturing lead terminals by punching out a plate material that has been surface-treated with plating, the outline of the lead terminal is punched by pushing a punch having teeth corresponding to the outline part of the lead terminal into the plate material. A lead terminal characterized in that a thickness reduction process is performed along the line part, and then the outline part, which is formed thinner than the thickness of the plate material by the thickness reduction process, is punched out along the outline of the lead terminal to obtain an outer shape. manufacturing method.