JPH02212065A - Dicing saw - Google Patents
Dicing sawInfo
- Publication number
- JPH02212065A JPH02212065A JP3047089A JP3047089A JPH02212065A JP H02212065 A JPH02212065 A JP H02212065A JP 3047089 A JP3047089 A JP 3047089A JP 3047089 A JP3047089 A JP 3047089A JP H02212065 A JPH02212065 A JP H02212065A
- Authority
- JP
- Japan
- Prior art keywords
- dicing saw
- diamond film
- tip
- dicing
- cvd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 10
- 239000010432 diamond Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ダイシング・ソーの先端刃部の構成に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the configuration of the tip of a dicing saw.
［従来の技術］
従来、ダイシング・ソーの先端刃部は、人工合成された
ダイヤモンド粉末をプラスチックあるいはニッケル金属
等の金属と共に焼結して成るのが通例であった。[Prior Art] Conventionally, the cutting edge of a dicing saw has generally been made by sintering artificially synthesized diamond powder together with plastic or metal such as nickel metal.
［課題を解決するための手段］
上記課題を解決するために、本発明は、ダイシング・ソ
ーに関し、ダイシング・ソーの先端刃部分にＣＶＤによ
るダイヤモンド膜を形成する手段を取る。[Means for Solving the Problems] In order to solve the above problems, the present invention relates to a dicing saw, and takes means for forming a diamond film by CVD on the tip end portion of the dicing saw.
［実施例コ 以下、実施例により本発明を詳述する。[Example code] Hereinafter, the present invention will be explained in detail with reference to Examples.
第１図乃至第３図は本発明の実施例を示すダイヤモンド
・ノーの先端刃部の断面図である。すなわち、第１図で
は、プラスチックあるいはニッケル、ステンレスあるい
はタングステン・カーバイド等から成る板状の基材１の
表面１／Ｃ０ＶＤ法によりｏｗｎダイヤモンド膜２を形
成したものである尚該先端刃部は側口の如く円板状に形
成する必要は必ずしもなく、基材の一主面にのみＣＶＤ
ダイヤモンド膜２を形成しても良（、又、該先端刃部は
多層に積層しても良い。FIGS. 1 to 3 are cross-sectional views of the cutting edge of a diamond nozzle showing an embodiment of the present invention. That is, in FIG. 1, an own diamond film 2 is formed on the surface of a plate-shaped base material 1 made of plastic, nickel, stainless steel, tungsten carbide, etc. by the 1/C0VD method. It is not necessarily necessary to form it into a disk shape as in the case of CVD.
A diamond film 2 may be formed (or the tip edge portion may be laminated in multiple layers).
第２図では、基材１１の一主面に予じめＯ’ＶＤダイヤ
モンド膜１２膜形２し、基材１１の先端部をエツチング
除去する事により、ＣＶＤダイヤモンド膜１２のみによ
る刃としたものである。In FIG. 2, an O'VD diamond film 12 is formed on one main surface of the base material 11 in advance, and the tip of the base material 11 is etched away to form a blade made of only the CVD diamond film 12. It is.
第５図では、予じめ基板上に、ＯｖＤダイヤモンド膜２
膜製２成し、前記基板から剥離するかあるいは前記基板
をエツチング除去する等して、ＣＶＤダイヤモンド膜２
２のみで刃を構成したものである。In FIG. 5, an OvD diamond film 2 is placed on the substrate in advance.
A CVD diamond film 2 is formed by forming a film 2 and peeling it off from the substrate or etching away the substrate.
The blade consists of only 2.
いもので切断でき、且つダイシング巾も狭いダイシング
・ソーの先端刃部を提供することができる効果がある。This has the effect of providing a tip blade of a dicing saw that can be cut with a cutting tool and has a narrow dicing width.
第１図乃至第５図は本発明の実施例を永すダイシング・
ソー刃部の断面図である。
１．１１・・・・・・・・・基 板FIGS. 1 to 5 show a dicing process according to an embodiment of the present invention.
It is a sectional view of a saw blade part. 1.11・・・・・・・・・Board
Claims (1)
モンド膜が形成されて成る事を特徴とするダイシング・
ソー。A dicing saw characterized by a diamond film formed by CVD on the tip of the dicing saw.
So.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3047089A JPH02212065A (en) | 1989-02-09 | 1989-02-09 | Dicing saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3047089A JPH02212065A (en) | 1989-02-09 | 1989-02-09 | Dicing saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02212065A true JPH02212065A (en) | 1990-08-23 |
Family
ID=12304757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3047089A Pending JPH02212065A (en) | 1989-02-09 | 1989-02-09 | Dicing saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02212065A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5212401A (en) * | 1991-07-25 | 1993-05-18 | Kobe Steel Usa, Inc. | High temperature rectifying contact |
| CN103072210A (en) * | 2011-10-26 | 2013-05-01 | 应用材料瑞士有限责任公司 | Saw and sawing element with diamond coating and method for producing the same |
-
1989
- 1989-02-09 JP JP3047089A patent/JPH02212065A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5212401A (en) * | 1991-07-25 | 1993-05-18 | Kobe Steel Usa, Inc. | High temperature rectifying contact |
| CN103072210A (en) * | 2011-10-26 | 2013-05-01 | 应用材料瑞士有限责任公司 | Saw and sawing element with diamond coating and method for producing the same |
| EP2586557A1 (en) * | 2011-10-26 | 2013-05-01 | Applied Materials Switzerland Sàrl | Saw and sawing element with diamond coating and method for producing the same |
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