JPH0221235Y2 - - Google Patents

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Publication number
JPH0221235Y2
JPH0221235Y2 JP1984084189U JP8418984U JPH0221235Y2 JP H0221235 Y2 JPH0221235 Y2 JP H0221235Y2 JP 1984084189 U JP1984084189 U JP 1984084189U JP 8418984 U JP8418984 U JP 8418984U JP H0221235 Y2 JPH0221235 Y2 JP H0221235Y2
Authority
JP
Japan
Prior art keywords
glaze layer
glaze
layer
laser
cut portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984084189U
Other languages
Japanese (ja)
Other versions
JPS61946U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984084189U priority Critical patent/JPS61946U/en
Publication of JPS61946U publication Critical patent/JPS61946U/en
Application granted granted Critical
Publication of JPH0221235Y2 publication Critical patent/JPH0221235Y2/ja
Granted legal-status Critical Current

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  • Electronic Switches (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、熱印字ヘツド、詳しくは絶縁性基板
上に蓄熱層として形成されるグレーズ層の構造に
関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a thermal printing head, and more particularly to the structure of a glaze layer formed as a heat storage layer on an insulating substrate.

〈従来の技術〉 一般に、熱印字ヘツドは第6図の平面図に示す
ように、長寸の絶縁性基板原板61にその長さ方
向に沿つて蓄熱層としてのグレーズ層62を形成
し、このグレーズ層62上に発熱体63を導体層
64と接続する状態で設けた後、基板原板61と
グレーズ層62との中途部をレーザ等の切断手段
で切断線イに沿つて切断することによつて、所要
長さの基板66を有する熱印字ヘツド単体65が
製造される。もちろん発熱体63上にはガラスに
より耐摩耗層が被覆されるが、以下に述べる問題
点を明確にするため、該耐摩耗層の図示は省略し
ている。このように基板原板61ばかりでなく、
グレーズ層62も切断するのは、盛り上がりのあ
るグレーズ層端部の数を少なくするためで、基板
上にスクリーン印刷の方法でグレーズを付着させ
てグレーズ層を形成すると、その端部がが必要以
上に盛り上がり、これに対して、切断により端部
を形成すれば、その端部は盛り上がらず、それだ
け盛り上がりのある端部の数が少なくなる。
<Prior Art> Generally, as shown in the plan view of FIG. 6, a thermal printing head is formed by forming a glaze layer 62 as a heat storage layer on a long insulating substrate original plate 61 along its length. After the heating element 63 is provided on the glaze layer 62 in a state where it is connected to the conductor layer 64, the intermediate part between the substrate original plate 61 and the glaze layer 62 is cut along the cutting line A using a cutting means such as a laser. Thus, a single thermal printing head 65 having a substrate 66 of the required length is manufactured. Of course, the heating element 63 is coated with a wear-resistant layer made of glass, but illustration of the wear-resistant layer is omitted in order to clarify the problems described below. In this way, not only the original board 61 but also
The reason why the glaze layer 62 is also cut is to reduce the number of raised edges of the glaze layer.If the glaze layer is formed by attaching the glaze to the substrate by screen printing, the edges will be cut more than necessary. On the other hand, if the ends are formed by cutting, the ends will not be raised, and the number of raised ends will be reduced accordingly.

〈考案が解決しようとする問題点〉 ところで、基板原板61上のグレーズ層62
は、従来第7図Aの断面図に示すように各部一定
の高さ、一定の幅であつて、切断部62aも他の
部分と同じ断面積を有する。この切断部62aを
ダイヤモンドダイサーで切断する場合には特に問
題を生じないが、同切断部62aをレーザで切断
する場合、レーザの加熱により第7図Bに示すよ
うに該部分のグレーズが溶融して発熱体63と同
程度の高さ、もしくはそれよりも高く盛り上が
り、この隆起部62bが印字動作中にインクリボ
ンや感熱紙を傷付けたり、発熱体63と感熱紙と
の圧接を妨げて印字不良を起こすなどの悪影響を
及ぼす欠点があつた。
<Problems to be solved by the invention> By the way, the glaze layer 62 on the original substrate 61
Conventionally, as shown in the sectional view of FIG. 7A, each part has a constant height and a constant width, and the cut portion 62a also has the same cross-sectional area as the other parts. No particular problem occurs when cutting this cut section 62a with a diamond dicer, but when cutting the cut section 62a with a laser, the glaze in the section melts due to the heating of the laser, as shown in FIG. 7B. The raised portion 62b may be as high as or higher than the heating element 63, and this raised portion 62b may damage the ink ribbon or thermal paper during printing, or may prevent pressure contact between the heating element 63 and the thermal paper, resulting in poor printing. There were drawbacks that had negative effects such as causing

またレーザで基板原板61を切断する場合だけ
でなく、グレーズ層62上に発熱体63を設ける
前にレーザで基板原板61に切断用切れ目を刻設
する場合においても、レーザがグレーズ層62に
作用すると、上記と同様の隆起部62bがグレー
ズ層に生じ、これが印字動作中に各種の悪影響を
及ぼす。
Furthermore, the laser acts on the glaze layer 62 not only when cutting the substrate original plate 61 with a laser, but also when cutting cuts in the substrate original plate 61 with a laser before providing the heating element 63 on the glaze layer 62. Then, a raised portion 62b similar to that described above is generated in the glaze layer, which causes various adverse effects during printing operation.

本考案はかかる従来の問題に鑑み、グレーズ層
において溶融グレーズによる隆起部の生成をなく
し、印字動作中の印字不良やインクリボンの損傷
等の不都合が生じないようにすることを目的とす
る。
In view of such conventional problems, it is an object of the present invention to eliminate the formation of protuberances due to melted glaze in the glaze layer, thereby preventing inconveniences such as printing defects and damage to the ink ribbon during printing operations.

〈問題点を解決するための手段〉 本考案は上記の目的を達成するために、グレー
ズ層各部のうちレーザ等の切断手段が作用する切
断部の膜厚を他の部分より小さくしたものであ
る。
<Means for Solving the Problems> In order to achieve the above-mentioned object, the present invention is such that the thickness of the cut portion of each part of the glaze layer where the cutting means such as a laser acts is made smaller than that of other parts. .

〈実施例〉 以下、本考案を図面に示す実施例に基づき詳細
に説明する。
<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.

第1図は本考案の第1の実施例を示すもので、
同図Aはその平面図、同図Bは断面図である。同
図中1は基板原板、3は発熱体、4は導体層であ
つて、これらは従来のものと同構造のものでよ
い。しかしてグレーズ層20はレーザ等の切断手
段が作用する切断部20aにおいてその膜厚をk
を他の部分の膜厚hより低くしてあり、これによ
つて切断部20aの断面積が他の部分より小さく
なつている。なお、グレーズ層20の幅wは各部
一定である。基板原板1およびグレーズ層20は
切断線イに沿つて切断され、これによつて所要長
さの基板を有する熱印字ヘツド車体5ができる。
FIG. 1 shows a first embodiment of the present invention.
Figure A is a plan view thereof, and Figure B is a sectional view thereof. In the figure, 1 is a base plate, 3 is a heating element, and 4 is a conductor layer, and these may have the same structure as the conventional one. Therefore, the thickness of the glaze layer 20 is reduced to k at the cutting portion 20a where a cutting means such as a laser acts.
The thickness h of the cut portion 20a is made lower than the film thickness h of other portions, thereby making the cross-sectional area of the cut portion 20a smaller than that of the other portions. Note that the width w of the glaze layer 20 is constant in each part. The original substrate 1 and the glaze layer 20 are cut along cutting line A, thereby producing a thermal printing head body 5 having a substrate of the required length.

このようにグレーズ層20の切断部20aの膜
厚が他の部分より小さいと、この切断部20aに
レーザが作用した場合、レーザの加熱により切断
部20aのグレーズが溶融すると、その量が少な
くかつ表面張力が作用するから、第2図の断面図
に示すように、グレーズ層20の切断部分ではほ
とんど盛り上がりを生ぜず、また生じてもごく小
さな隆起部20cができるだけである。溶融した
グレーズ層の盛り上がりを完全に抑制することは
難しいので、グレーズ層20の切断部20aにお
ける幅を他の部分よりも単に狭くするのでは依然
として隆起部20cが発熱体3よりも高くなるお
それがある。これに対して、この実施例のよう
に、グレーズ層20の切断部20aの膜厚を予め
小さくしておけば、レーズ層20に隆起部20c
が生じても、発熱体3よりも高くなることはない
ので、印字不良等の発生を確実に回避することが
できる。なお、この実施例においても発熱体3上
にはガラスの耐摩耗層が被覆されるが、本考案の
構成上の特徴を明確に示すため、該耐摩耗層の図
示は省略しており、このことは以下の実施例につ
いても同じである。
If the thickness of the cut portion 20a of the glaze layer 20 is smaller than the other portions, when the laser acts on the cut portion 20a, if the glaze on the cut portion 20a melts due to laser heating, the amount of glaze melted will be small and Because surface tension acts, as shown in the cross-sectional view of FIG. 2, there is hardly any bulge in the cut portion of the glaze layer 20, and even if it does, only a very small bulge 20c is formed. Since it is difficult to completely suppress the swelling of the molten glaze layer, simply making the width of the cut portion 20a of the glaze layer 20 narrower than other portions may still cause the raised portion 20c to be higher than the heating element 3. be. On the other hand, if the thickness of the cut portion 20a of the glaze layer 20 is made small in advance as in this embodiment, the glaze layer 20 can have a raised portion 20c.
Even if it occurs, it will not become higher than the heating element 3, so it is possible to reliably avoid the occurrence of printing defects and the like. In this embodiment as well, a glass wear-resistant layer is coated on the heating element 3, but in order to clearly show the structural features of the present invention, illustration of the wear-resistant layer is omitted. The same holds true for the following examples.

第3図は第2図の実施例を示すもので、同図A
はその平面図、同図Bは断面図である。この実施
例では、グレーズ層22の切断部22aの幅vを
他の部分の幅wより狭幅にするとともに該切断部
22aの膜厚kを他の部分の高さhより低くし、
これによつて切断部22aの断面積を他の部分よ
り小さくしてある。
Figure 3 shows the embodiment of Figure 2.
is a plan view thereof, and B is a sectional view thereof. In this embodiment, the width v of the cut portion 22a of the glaze layer 22 is made narrower than the width w of other portions, and the thickness k of the cut portion 22a is made lower than the height h of the other portions.
This makes the cross-sectional area of the cut portion 22a smaller than other portions.

この第2実施例では、グレーズ層22の切断部
22aで、膜厚kのみならず幅vも他の部分より
も小さくしているので、第1実施例の場合に比較
して一層確実にレーザ切断時のグレーズ層の盛り
上がりを回避することが可能となる。
In this second embodiment, not only the film thickness k but also the width v at the cut portion 22a of the glaze layer 22 are made smaller than other parts, so that the laser beam can be used more reliably than in the first embodiment. It is possible to avoid swelling of the glaze layer during cutting.

上記各実施例においては、各グレーズ層20,
22上に発熱体3を設けた後にグレーズ層20,
22にレーザが作用する場合を示したが、グレー
ズ層20,22に発熱体3を設ける前に基板原板
1の表面にレーザで切れ目を刻設する場合も、グ
レーズ層20,22にレーザが作用する。このよ
うな場合でも、グレーズ層20,22の切断端部
ではほとんど盛り上がりを生じないことは、第1
実施例の場合と同じである。
In each of the above embodiments, each glaze layer 20,
After providing the heating element 3 on 22, the glaze layer 20,
Although the case in which the laser acts on the glaze layers 20 and 22 is shown, the laser acts on the glaze layers 20 and 22 also in the case where cuts are carved with a laser on the surface of the original substrate 1 before providing the heating elements 3 on the glaze layers 20 and 22. do. Even in such a case, the first reason is that almost no swelling occurs at the cut ends of the glaze layers 20 and 22.
This is the same as in the embodiment.

従来よりグレーズ層はグレーズをスクリーン印
刷により数層に積層することによつて形成される
のであるが、上記各実施例におけるグレーズ層2
0,22は、積層する印刷パターンを数種用意し
てこれらパターンを組み合わせることによつて形
成される。即ち第4図Aに示すような各部一様な
幅のパターンP1、同図Bに示すような切断部に
おいて狭幅となつたパターンP2、同図Cに示す
ような切断部において途切れたパターンP3を用
意し、AのパターンP1の上にCのパターンP3
を積層すると、第1図に示した第1の実施例にお
けるグレーズ層20が得られる。
Conventionally, the glaze layer is formed by laminating several layers of glaze by screen printing, but the glaze layer 2 in each of the above embodiments is
0 and 22 are formed by preparing several types of laminated printing patterns and combining these patterns. That is, a pattern P1 having a uniform width at each part as shown in FIG. 4A, a pattern P2 having a narrow width at the cut portion as shown in FIG. Prepare a pattern P3 of C on top of pattern P1 of A.
When laminated, the glaze layer 20 in the first embodiment shown in FIG. 1 is obtained.

また、BのパターンP2の上にCのパターンP
3を積層すると、第3図に示した第2実施例にお
けるグレーズ層22が得られる。
Also, pattern P of C is placed on pattern P2 of B.
3, a glaze layer 22 in the second embodiment shown in FIG. 3 is obtained.

〈考案の効果〉 以上のように本考案は、グレーズ層の切断部の
膜厚を他の部分より小さくしたものであつて、該
切断部にレーザが作用しても、溶融したグレーズ
が大きく盛り上がるようなことがなく、従来溶融
グレーズによる隆起部が発熱体を越えるほどの高
さとなるために印字動作中に生じていた種々の不
都合、即ち感熱紙やインクリボンの損傷および印
字不良等の不都合が起きない。
<Effects of the invention> As described above, in the present invention, the thickness of the cut portion of the glaze layer is made smaller than the other portions, and even if the laser acts on the cut portion, the molten glaze will not swell significantly. This eliminates various inconveniences that conventionally occur during printing operations due to the ridges caused by the melted glaze reaching a height that exceeds the heating element, such as damage to thermal paper and ink ribbons and poor printing. It doesn't happen.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1実施例を示し、同図Aは
平面図、同図Bは断面図、第2図は切断後の状態
を示す要部断面図、第3図は第2実施例を示し、
同図Aは平面図、同図Bは断面図、第4図A〜C
はグレーズ層を形成するための印刷パターンの平
面図、第5図は従来の熱印字ヘツドの平面図、第
6図はその要部拡大断面図で、同図Aは切断前の
状態を、同図Bは切断後の状態をそれぞれ示す。 1……基板原板、20,22……グレーズ層、
20a,22a……切断部、3……発熱体、4…
…導体層。
Fig. 1 shows a first embodiment of the present invention, Fig. A is a plan view, Fig. B is a sectional view, Fig. 2 is a sectional view of main parts showing the state after cutting, and Fig. 3 is a second embodiment. Give an example,
Figure A is a plan view, Figure B is a sectional view, Figures 4 A to C
5 is a plan view of a printing pattern for forming a glaze layer, FIG. 5 is a plan view of a conventional thermal printing head, and FIG. 6 is an enlarged sectional view of its main parts. Figure B shows the state after cutting. 1... Substrate original plate, 20, 22... Glaze layer,
20a, 22a... cutting section, 3... heating element, 4...
...conductor layer.

Claims (1)

【実用新案登録請求の範囲】 絶縁性の基板原板にその長さ方向に沿つてグレ
ーズ層を形成し、グレーズ層上に導体層と接続さ
れた発熱体を設け、前記基板原板とグレーズ層と
をレーザによつて切断することによつて所要長さ
の基板を有する熱印字ヘツド単体が製造される熱
印字ヘツドにおいて、 前記グレーズ層各部のうちレーザが作用する切
断部の膜厚を他の部分より小さく設定したことを
特徴とする熱印字ヘツド。
[Claims for Utility Model Registration] A glaze layer is formed along the length of an insulating original substrate, a heating element connected to a conductive layer is provided on the glaze layer, and the original substrate and glaze layer are connected to each other. In a thermal printing head in which a single thermal printing head having a substrate of a required length is manufactured by cutting with a laser, the film thickness of the cut portion where the laser acts among each portion of the glaze layer is set higher than that of other portions. A thermal printing head characterized by a small setting.
JP1984084189U 1984-06-06 1984-06-06 thermal printing head Granted JPS61946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984084189U JPS61946U (en) 1984-06-06 1984-06-06 thermal printing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984084189U JPS61946U (en) 1984-06-06 1984-06-06 thermal printing head

Publications (2)

Publication Number Publication Date
JPS61946U JPS61946U (en) 1986-01-07
JPH0221235Y2 true JPH0221235Y2 (en) 1990-06-08

Family

ID=30633479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984084189U Granted JPS61946U (en) 1984-06-06 1984-06-06 thermal printing head

Country Status (1)

Country Link
JP (1) JPS61946U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007313774A (en) * 2006-05-26 2007-12-06 Tdk Corp Partitioned-groove forming method of substrate for thermal head, manufacturing method of thermal head, thermal head and printing device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5746893A (en) * 1980-08-18 1982-03-17 Rohm Co Ltd Manufacture of thermal printing head
JPS5749579A (en) * 1980-09-08 1982-03-23 Rohm Co Ltd Thermal printer head
JPS57178879A (en) * 1981-04-30 1982-11-04 Alps Electric Co Ltd Manufacture of thermal head

Also Published As

Publication number Publication date
JPS61946U (en) 1986-01-07

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