JPH0221244A - Detection of solder bridge - Google Patents

Detection of solder bridge

Info

Publication number
JPH0221244A
JPH0221244A JP63171208A JP17120888A JPH0221244A JP H0221244 A JPH0221244 A JP H0221244A JP 63171208 A JP63171208 A JP 63171208A JP 17120888 A JP17120888 A JP 17120888A JP H0221244 A JPH0221244 A JP H0221244A
Authority
JP
Japan
Prior art keywords
electronic component
solder
lead
leads
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63171208A
Other languages
Japanese (ja)
Other versions
JP2684689B2 (en
Inventor
Hirofumi Matsuzaki
浩文 松崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63171208A priority Critical patent/JP2684689B2/en
Publication of JPH0221244A publication Critical patent/JPH0221244A/en
Application granted granted Critical
Publication of JP2684689B2 publication Critical patent/JP2684689B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To detect a solder bridge accurately by performing an optical scanning between leads of an electronic component with a camera arranged above the electronic component mounted on a substrate to detect a part having a brightness above a set value. CONSTITUTION:An electronic component 2 is mounted on a substrate 1, which is positioned with a positioning section 3 comprising XY tables 4 and 5. A camera 6 is arranged above leads 8 of the electronic part 2 while light sources 7a and 7b are arranged right above the lead and askew above it. A solder 10 is applied at the tip of the lead 8 and has a brightness higher than a pattern 14 printed on the substrate 1. The camera 6 performs an optical scanning between the leads 8 and 8 along the length thereof to detect a part having a brightness above the set value thereby enabling accurate detection of the solder bridge.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は半田ブリッジの検出方法に係り、リードとリー
ドの間を光学走査することにより、半田ブリッジを検出
するようにしたものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for detecting solder bridges, in which solder bridges are detected by optically scanning between leads.

（従来の技術） 電子部品を基板に実装するにあたり、電子部品のリード
部分に半田部を形成した場合、半田過多等のために隣り
同士の半田部が所謂半田ブリッジにより短絡する場合が
ある。従来、かかる半田ブリッジの有無の検査は、検査
員が目視により行っている実情にあった。(Prior Art) When mounting an electronic component on a board, when a solder portion is formed on the lead portion of the electronic component, adjacent solder portions may be short-circuited due to a so-called solder bridge due to excessive solder. Conventionally, the presence or absence of such solder bridges has been visually inspected by an inspector.

（発明が解決しようとする課題） しかしながら検査員の目視検査では作業能率があがらず
、また微細な半田ブリッジは見逃しやすい問題があった
。(Problems to be Solved by the Invention) However, visual inspection by inspectors does not improve work efficiency, and there is a problem in that minute solder bridges are easily overlooked.

したがって本発明は、リードとリードの間に生じた半田
ブリッジを簡単にかつ精度よく検出できる手段を提供す
ることを目的とする。Therefore, it is an object of the present invention to provide a means for easily and accurately detecting solder bridges occurring between leads.

（課題を解決するための手段） このために本発明は、基板に実装された電子部品に光を
照射し、この電子部品の上方に設けられたカメラにより
、この電子部品のリードとリードの間をこのリードの長
さ方向に沿って光学走査し、設定値以上の輝度を有する
部分を検出することにより、半田ブリッジを検出するよ
うにしたものである。(Means for Solving the Problems) For this purpose, the present invention irradiates light onto an electronic component mounted on a board, and uses a camera provided above the electronic component to detect the distance between the leads of the electronic component. The solder bridge is detected by optically scanning along the length of the lead and detecting a portion having a brightness higher than a set value.

（作用） 上記構成において、リードとリードの間を光学走査し、
設定値以上の輝度を有する部分を検出することにより、
半田ブリッジを検出する。(Function) In the above configuration, optical scanning is performed between the leads,
By detecting parts with brightness higher than the set value,
Detect solder bridges.

（実施例） 次に図面を参照しながら本発明の詳細な説明を行う。(Example) Next, the present invention will be described in detail with reference to the drawings.

第１図は外観検査装置の斜視図であって、１は基板であ
り、その上面に電子部品２が実装されている。３はＸＹ
子テーブル、５から成る基板１の位置決め部、６はカメ
ラ、７ａ、７ｂは基板１を照射する光源である。第２図
に示すように、カメラ６は電子部品２のリード８の上方
に、また光源７ａ、７ｂは真上と斜め上方に配設されて
いる。１０はリード８の先端部に塗布された半田部であ
り、基板１に印刷されたパターン１４よりも高い輝度を
有している。なおリードの面に向って真上からだけ垂直
に光を照射すると、光は強く反射しすぎてカメラにより
観察しにくいが、第２図に示すように真上及び斜め上方
から光を照射すれば、リードの上面全体が適度の明るさ
で一様に輝いてカメラにより観察しやすい。FIG. 1 is a perspective view of the visual inspection apparatus, in which numeral 1 denotes a substrate, and electronic components 2 are mounted on the upper surface of the substrate. 3 is XY
A positioning unit for the substrate 1 is made up of a child table 5, 6 is a camera, and 7a and 7b are light sources for illuminating the substrate 1. As shown in FIG. 2, the camera 6 is arranged above the lead 8 of the electronic component 2, and the light sources 7a and 7b are arranged directly above and diagonally above. A solder portion 10 is applied to the tip of the lead 8 and has higher brightness than the pattern 14 printed on the substrate 1. Note that if you shine light vertically onto the surface of the lead from just above, the light will reflect too strongly and be difficult to observe with a camera, but if you shine light from directly above and diagonally above, as shown in Figure 2. , the entire upper surface of the reed shines uniformly with moderate brightness, making it easy to observe with a camera.

第３図はリード８とリード８の間の半田ブリッジ１１．
１２を検出している様子を示すものであって、リード８
とリード８の間をピッチをおいて光学走査し、所定値以
上の輝度を有する部分を検出することにより、ブリッジ
１１，１２を検出する。ａ、ａ・・・は画素である。こ
の場合、検査レベルを高くして、１画素でも所定値以上
の輝度を有する部分を検出すれば、半田部と判断するこ
とが望ましい。FIG. 3 shows the solder bridge 11 between the leads 8 and 8.
This shows how lead 12 is being detected, and lead 8
The bridges 11 and 12 are detected by optically scanning the space between the lead 8 and the lead 8 at a pitch, and detecting a portion having a luminance equal to or higher than a predetermined value. a, a... are pixels. In this case, it is desirable to increase the inspection level and determine that it is a solder portion if even one pixel has a brightness higher than a predetermined value.

第４図はり−ド８とリード８の間に生じたボール状半田
部１３を検出している様子を示している。この場合、リ
ード８の長さ方向の走査により所定値以上の輝度を有す
る部分を検出したならば、ヨコ方向へ向って走査し、輝
度の低い部分を検出したならば、そこで再びリード８の
長さ方向に光学走査し、所定ラインＬまで走査すること
により、これはリード８とリード８を短絡するブリッジ
ではなく、独立して点在するボール状半田部であること
を検知する。FIG. 4 shows how a ball-shaped solder portion 13 formed between the beam 8 and the lead 8 is detected. In this case, if a portion having a brightness higher than a predetermined value is detected by scanning in the length direction of the lead 8, scanning is performed in the horizontal direction, and if a portion with low brightness is detected, the length of the lead 8 is again scanned. By optically scanning in the horizontal direction and scanning to a predetermined line L, it is detected that this is not a bridge that shorts the leads 8 to each other, but is a ball-shaped solder portion that is scattered independently.

（発明の効果） 以上説明したように本発明は、基板に実装された電子部
品に光を照射し、この電子部品の上方に設けられたカメ
ラにより、この電子部品のリードとリードの間をこのリ
ードの長さ方向に沿って光学走査し、設定値以上の輝度
を有する部分を検出することにより、半田ブリッジを検
出するようにしているので、リードとリードの間に生じ
た半田ブリッジを簡単にかつ精度よく検出することがで
きる。(Effects of the Invention) As explained above, the present invention irradiates light onto an electronic component mounted on a board, and uses a camera installed above the electronic component to scan between the leads of the electronic component. Solder bridges are detected by optically scanning along the length of the lead and detecting parts with brightness higher than a set value, making it easy to remove solder bridges that occur between leads. And it can be detected with high accuracy.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の実施例を示すものであって、第１図は外観
装置の斜視図、第２図及び第３図は検査中の側面図及び
平面図、第４図はボールの検査中の平面図である。 １・・・基板 ２・・・電子部品 ６・・・カメラ ８・・・リード １０・・・半田部 １１．１２・・・半田ブリッジ 代理人の氏名弁理士　粟　野　重　孝（１カ・１名第 図 第 事 図 第 図The drawings show an embodiment of the present invention, in which Fig. 1 is a perspective view of the external appearance device, Figs. 2 and 3 are side views and plan views during ball inspection, and Fig. 4 is a view during ball inspection. FIG. 1... Board 2... Electronic component 6... Camera 8... Lead 10... Solder part 11.12... Name of solder bridge agent Patent attorney Shigetaka Awano (1 cap.1 Name chart number item number chart

Claims (1)

【特許請求の範囲】[Claims] 基板に実装された電子部品に光を照射し、この電子部品
の上方に設けられたカメラにより、この電子部品のリー
ドとリードの間をこのリードの長さ方向に沿って光学走
査し、設定値以上の輝度を有する部分を検出することに
より、半田ブリッジを検出するようにしたことを特徴と
する半田ブリッジの検出方法。Light is irradiated onto the electronic component mounted on the board, and a camera installed above the electronic component optically scans between the leads of the electronic component along the length direction of the lead to determine the set value. A method for detecting a solder bridge, characterized in that the solder bridge is detected by detecting a portion having a luminance above or above.
JP63171208A 1988-07-08 1988-07-08 Solder ball detection method Expired - Fee Related JP2684689B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63171208A JP2684689B2 (en) 1988-07-08 1988-07-08 Solder ball detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63171208A JP2684689B2 (en) 1988-07-08 1988-07-08 Solder ball detection method

Publications (2)

Publication Number Publication Date
JPH0221244A true JPH0221244A (en) 1990-01-24
JP2684689B2 JP2684689B2 (en) 1997-12-03

Family

ID=15919036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63171208A Expired - Fee Related JP2684689B2 (en) 1988-07-08 1988-07-08 Solder ball detection method

Country Status (1)

Country Link
JP (1) JP2684689B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1116950A1 (en) * 2000-01-17 2001-07-18 Agilent Technologies, Inc. Method and apparatus for inspecting a printed circuit board assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290311A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Apparatus and method for inspecting soldered zone
JPS62163953A (en) * 1985-12-27 1987-07-20 エイ・ティ・アンド・ティ・コーポレーション Method and device for inspecting product

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290311A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Apparatus and method for inspecting soldered zone
JPS62163953A (en) * 1985-12-27 1987-07-20 エイ・ティ・アンド・ティ・コーポレーション Method and device for inspecting product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1116950A1 (en) * 2000-01-17 2001-07-18 Agilent Technologies, Inc. Method and apparatus for inspecting a printed circuit board assembly

Also Published As

Publication number Publication date
JP2684689B2 (en) 1997-12-03

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