JPH02213111A - Electronic part for surface mounting - Google Patents

Electronic part for surface mounting

Info

Publication number
JPH02213111A
JPH02213111A JP1034046A JP3404689A JPH02213111A JP H02213111 A JPH02213111 A JP H02213111A JP 1034046 A JP1034046 A JP 1034046A JP 3404689 A JP3404689 A JP 3404689A JP H02213111 A JPH02213111 A JP H02213111A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
electronic part
electronic component
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1034046A
Other languages
Japanese (ja)
Other versions
JPH0779187B2 (en
Inventor
Kosuke Noguchi
野口　浩資
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1034046A priority Critical patent/JPH0779187B2/en
Publication of JPH02213111A publication Critical patent/JPH02213111A/en
Publication of JPH0779187B2 publication Critical patent/JPH0779187B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Details Of Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To omit a step for hardening a bonding agent, to mount electronic parts on a printed wiring board without particular equipment used in said step and for storing bonding agent and to remove the electronic parts from the printed wiring board by sticking double-sided adhesive tape to an attaching surface for the printed wiring board. CONSTITUTION:A surface mounting electronic part 5 is mounted on a printed wiring board 1. A double-sided adhesive tape 8 is stuck to the attaching surface of said surface mounting electronic part 5 to the printed wiring board 1. For example, when the surface mounting electronic part 5 is packed, the electronic part 5 is stuck to the bottom of a recess 9 of an embossed tape 11 with the double-sided adhesive tap 8. A tape 10 is attached for sealing. When the part is mounted on the printed wiring board 1, at first, the part is put on the printed wiring board 1 and bonded between copper foils 2 with the double-sided adhesive tape 8. At this time, the electronic part 5 is positioned so that an electrode 7 rides on the solder 4. Then the solder is made to reflow with infrared rays or hot air, and the electrode 7 of the electronic part 5 and the copper foils 2 are connected and fixed with a solder 4a.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント配線基板に搭載する表面実装用電子部
品の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a surface-mounted electronic component mounted on a printed wiring board.

〔従来の技術〕[Conventional technology]

従来、この種の表面実装用電子部品は出来るだけ表面実
装密度を上げるために小型で、しかも背が低くく取り付
けられるように種々の工夫及び改善が施されれきた。In the past, various efforts and improvements have been made to this type of surface-mounted electronic components to make them smaller and lower in height in order to increase the surface-mounting density as much as possible.

例えば、従来の表面実装用電子部品は、電子回路が形成
された半導体チップや抵抗あるはコンデンサのような電
子部品をセラミックやモールド樹脂で封止してなる外郭
体を形成し、その外郭体の側面に外部リードである電極
を取り付けた構造になっている。このような表面実装用
電子部品をプリント配線基板にはんだ付は及び接着剤で
実装を行なっている。For example, conventional surface-mount electronic components are made by sealing an electronic component such as a semiconductor chip with an electronic circuit, a resistor, or a capacitor with ceramic or molded resin to form an outer shell. It has a structure with electrodes, which are external leads, attached to the side. Such surface-mount electronic components are mounted on printed wiring boards by soldering and adhesive.

第４図（ａ）〜（ｃ）は従来の表面実装用電子部品をプ
リント配線基板に取り付ける工程順に示した表面実装用
電子部品を含めたプリント配線基板の断面図である０次
に、電子部品をプリント配線基板に実装する方法を説明
すると、まず、第５図（ａ）に示すように、プリント配
線基板１の銅箔２間に接着剤３を滴下し、銅箔２にはは
んだを塗布する０次に、第５図（Ｃ）に示すように、電
子部品５をプリント配線基板１に搭載する。このとき、
電子部品５の電極７がそれぞれのはんだ４の上に、また
、電子部品５の取り付は面に接着剤３ａの上に乗せるよ
うな位置にする。FIGS. 4(a) to 4(c) are cross-sectional views of a printed wiring board including surface mount electronic components shown in the order of steps for attaching conventional surface mount electronic components to the printed wiring board. To explain the method of mounting on a printed wiring board, first, as shown in FIG. Next, as shown in FIG. 5(C), the electronic component 5 is mounted on the printed wiring board 1. At this time,
The electrodes 7 of the electronic components 5 are placed on top of the respective solders 4, and the electronic components 5 are placed in such a position that they are placed on the surface of the adhesive 3a.

次に、紫外線ランプ６により接着剤３ａを硬化させる０
次に、第５図（ｃ）に示すように、赤外線ランプあるい
は温風を吹き付けることによりはんだ４をリフローさせ
、電子部品５の電極７をプリント配線基板１の銅箔２に
はんだ４ａで接続固定する。Next, the adhesive 3a is cured using an ultraviolet lamp 6.
Next, as shown in FIG. 5(c), the solder 4 is reflowed by an infrared lamp or by blowing hot air, and the electrode 7 of the electronic component 5 is connected and fixed to the copper foil 2 of the printed wiring board 1 with the solder 4a. do.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した表面実装用電子部品では、プリント配線基板に
実装するときに、接着剤を塗布し、紫外線による接着剤
を硬化させる工程が必要であることや、この工程に必要
な設備を整えなければならないという欠点がある。また
、接着剤という公害材料を使用しているため、その直接
材料としての費用がかかるばかりか、公害材料としての
保管及び管理する費用がかかる欠点もある。更に、−度
実装すると、この電子部品を交換する場合に、はんだを
溶かしてもこの接着剤の接着力が強く、プリント配線基
板から取り外しにくいという欠点もある。When mounting the above-mentioned surface-mount electronic components on a printed wiring board, it is necessary to apply an adhesive and cure the adhesive using ultraviolet rays, and the necessary equipment for this process must be prepared. There is a drawback. Furthermore, since a polluting material called adhesive is used, there is a drawback that not only is the cost of the direct material high, but also the cost of storing and managing the polluting material. Furthermore, if the electronic component is mounted twice, the adhesive has a strong adhesive force even if the solder is melted, making it difficult to remove it from the printed wiring board when replacing the electronic component.

本発明は接着剤を硬化させる工程が不要であり、また、
この工程に使用したり、接着剤を保管したりする特別な
設備を必要とすることなくプリント配線基板に実装すこ
とが出来るとともにプリント配線基板より容易に取り外
し出来る表面実装用電子部品を提供することにある。The present invention does not require a step of curing the adhesive, and
To provide a surface mounting electronic component that can be mounted on a printed wiring board without requiring special equipment for use in this process or for storing adhesive, and can be easily removed from the printed wiring board. It is in.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の表面実装用電子部品は、プリント配線基板上に
実装する表面実装用電子部品において、前記表面実装用
電子部品の前記プリント配線基板への取付は面に両面接
着テープが貼付けられたことを備え構成される。The surface mount electronic component of the present invention is a surface mount electronic component mounted on a printed wiring board, in which the surface mount electronic component is attached to the printed wiring board by pasting a double-sided adhesive tape on the surface. Prepared and configured.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明による一実施例を示す表面実装用電子部
品の断面図、第２図は第１図に示す表面実装用電子部品
の梱包状態を示す断面図、第３図（ａ＞及び（ｂ）はプ
リント配線基板に実装する工程順に示す表面実装用電子
部品を含めたプリント配線基板の断面図である。FIG. 1 is a cross-sectional view of a surface-mount electronic component showing an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the packaging state of the surface-mount electronic component shown in FIG. 1, and FIG. (b) is a sectional view of a printed wiring board including surface mounting electronic components shown in the order of steps for mounting on the printed wiring board.

この表面実装用電子部品は、第１図に示すように、電子
部品５のプリント配線基板に対向する面すなわち取り付
は面に両面接着テープ８が貼り付けられていることであ
る。それ以外は従来例と同じである。As shown in FIG. 1, this surface-mounted electronic component has a double-sided adhesive tape 8 affixed to the surface of the electronic component 5 facing the printed wiring board, that is, the mounting surface. Other than that, it is the same as the conventional example.

また、この表面実装用電子部品を梱包する場合には、第
２図に示すように、エンボス付きテープ１１の窪み９の
底にこの電子部品５の両面接着テープ８で貼り付け、テ
ープ１０でシールすれば良い。When packaging this electronic component for surface mounting, as shown in FIG. Just do it.

次に、この表面実装用電子部品をプリント配線基板に実
装する場合には、まず、第３図（ａ）に示すように、プ
リント配線基板１の上に乗せ、銅箔２の間に両面接着テ
ープ８で接着する。このとき、電極７がはんだ４の上に
乗るように電子部品５を位置決めする。Next, when mounting this surface-mount electronic component on a printed wiring board, first, as shown in FIG. Adhere with tape 8. At this time, the electronic component 5 is positioned so that the electrode 7 is placed on the solder 4.

次に、第３図（ｂ）に示すように、赤外線あるいは温風
によりはんだをリフローして、電子部品５の電極７と銅
箔２とをはんだ４ａで接続固定する。Next, as shown in FIG. 3(b), the solder is reflowed using infrared rays or hot air to connect and fix the electrode 7 of the electronic component 5 and the copper foil 2 with the solder 4a.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、表面実装用電子部品のプ
リント配線基板に取り付ける面に両面接着テープを貼り
付けることにより、プリント配線基板に固着する接着剤
を塗布し硬化する工程が不要になるばかりか、この工程
に必要な設備及び接着剤を保管する設備等も不要になり
、更に、実装した後でも、容易に取り外しが出来る表面
実装用電子部品が得られるという効果がある９As explained above, the present invention affixes a double-sided adhesive tape to the surface of a surface-mounted electronic component to be attached to a printed wiring board, thereby eliminating the need for the process of applying and curing an adhesive that adheres to the printed wiring board. In addition, the equipment necessary for this process and the equipment for storing adhesives are no longer required, and furthermore, it has the effect of providing surface-mounted electronic components that can be easily removed even after mounting9.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明による一実施例を示す表面実装用電子部
品の断面図、第２図は第１図に示す表面実装用電子部品
の梱包状態を示す断面図、第３図（ａ）及び（ｂ）はプ
リント配線基板に実装する工程順に示す表面実装用電子
部品を含めたプリント配線基板の断面図、第４図（ａ）
〜（ｃ）は従来の表面実装用電子部品をプリント配線基
板に取り付ける工程順に示した表面実装用電子部品を含
めたプリント配線基板の断面図である。 １・・・ブリ〉′ト配線基板、２・・・銅箔、３．３ｂ
、３Ｃ・・・接着剤、４．４ａ・・・はんだ、５・・・
電子部品、６・・・紫外線ランプ、７・・・電極、８・
・・両面接着テープ、９・・・窪み、１０・・・テープ
、１１・・・エンボス付きテープ。FIG. 1 is a cross-sectional view of a surface-mount electronic component showing an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the packaged state of the surface-mount electronic component shown in FIG. 1, and FIGS. (b) is a cross-sectional view of a printed wiring board including surface-mounted electronic components shown in the order of steps for mounting on the printed wiring board, and FIG. 4(a)
-(c) are cross-sectional views of a printed wiring board including a surface mount electronic component, showing the steps of attaching the conventional surface mount electronic component to the printed wiring board. 1...British wiring board, 2...Copper foil, 3.3b
, 3C...adhesive, 4.4a...solder, 5...
Electronic parts, 6... Ultraviolet lamp, 7... Electrode, 8.
...Double-sided adhesive tape, 9...Indentation, 10...Tape, 11...Embossed tape.

Claims (1)

【特許請求の範囲】[Claims] 　プリント配線基板上に実装する表面実装用電子部品に
おいて、前記表面実装用電子部品の前記プリント配線基
板への取付け面に両面接着テープが貼付けられたことを
特徴とする表面実装用電子部品。1. A surface mount electronic component mounted on a printed wiring board, characterized in that a double-sided adhesive tape is attached to a surface of the surface mount electronic component to be attached to the printed wiring board.
JP1034046A 1989-02-13 1989-02-13 Mounting method for surface mount electronic components Expired - Lifetime JPH0779187B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1034046A JPH0779187B2 (en) 1989-02-13 1989-02-13 Mounting method for surface mount electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1034046A JPH0779187B2 (en) 1989-02-13 1989-02-13 Mounting method for surface mount electronic components

Publications (2)

Publication Number Publication Date
JPH02213111A true JPH02213111A (en) 1990-08-24
JPH0779187B2 JPH0779187B2 (en) 1995-08-23

Family

ID=12403371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1034046A Expired - Lifetime JPH0779187B2 (en) 1989-02-13 1989-02-13 Mounting method for surface mount electronic components

Country Status (1)

Country Link
JP (1) JPH0779187B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020170810A (en) * 2019-04-04 2020-10-15 Ｎｅｃプラットフォームズ株式会社 Manufacturing method for circuit board and electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437069U (en) * 1977-08-19 1979-03-10
JPS5739466U (en) * 1980-08-19 1982-03-03

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437069U (en) * 1977-08-19 1979-03-10
JPS5739466U (en) * 1980-08-19 1982-03-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020170810A (en) * 2019-04-04 2020-10-15 Ｎｅｃプラットフォームズ株式会社 Manufacturing method for circuit board and electronic component

Also Published As

Publication number Publication date
JPH0779187B2 (en) 1995-08-23

Similar Documents

Publication Publication Date Title
EP0396484A3 (en) Solder column connection
DE60033552D1 (en) SOLDERANT, SOLDER PASTE AND SOLDERING PROCESS
WO2004071140A3 (en) Underfill film for printed wiring assemblies
JPH02213111A (en) Electronic part for surface mounting
JPH0320080B2 (en)
JPH0357295A (en) Method of mounting electronic components on double-sided mounting board
JP2012084795A (en) Supply method of adhesive for temporarily fixing mounting component, manufacturing method of semiconductor device, substrate for mounting component and semiconductor device
JP2501668Y2 (en) Surface mount electrical components
JPH01220801A (en) Chip-type electric element
JP2008085742A (en) Crystal oscillator and manufacturing method thereof
JP3226147B2 (en) Bonding structure of surface mount components
JPS6288398A (en) Soldering of flat package part
JPH02148885A (en) Bonding of mold packaging component
JPS59188996A (en) Method of mounting electronic part
JPH0314292A (en) Manufacture of high-density mounting module
JPH0468596A (en) Method of mounting electronic parts
JPS5810887A (en) Method of mounting and connecting leadless electronic part
JPH0336788A (en) Surface mounting type electronic component and mounting method thereof
JPH0287695A (en) Printed wiring board with surface packaging electronic part
JPH04151894A (en) Mounting method on printed wiring boards
JPS6113370B2 (en)
JPS61287197A (en) Manufacture of electronic component
JPH01187901A (en) Chip type electronic component
JPH0215697A (en) Surface mounting method
JPS60143618A (en) Electronic part