JPH02213193A - Manufacture of electronic component unit - Google Patents
Manufacture of electronic component unitInfo
- Publication number
- JPH02213193A JPH02213193A JP3410089A JP3410089A JPH02213193A JP H02213193 A JPH02213193 A JP H02213193A JP 3410089 A JP3410089 A JP 3410089A JP 3410089 A JP3410089 A JP 3410089A JP H02213193 A JPH02213193 A JP H02213193A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- unit circuit
- unit
- electronic component
- base circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（発明の目的）
（産業上の利用分野）
本発明は電子部品ユニットの製造方法に係り、−枚の金
属板からなるベース回路基板から複数の電子部品ユニッ
トを製造する方法に圓する。[Detailed Description of the Invention] (Objective of the Invention) (Industrial Application Field) The present invention relates to a method of manufacturing an electronic component unit, and includes manufacturing a plurality of electronic component units from a base circuit board made of two metal plates. Focus on the method.
（従来の技術）
従来のこの棚の一枚のベース回路基板から複数の電子部
品ユニットを製造する方法は、第５図に示すように、ベ
ース回路基板１０から複数のユニット回路基板１１を打
抜き、複数のユニット回路基板１１に分割し、この分割
されたユニット回路基板１１にスフ−リン印刷でクリー
ム半田をバット上に塗布し、次いで、電子部品を装着し
てリフローで半田接続して実装し、電子部品ユニットを
製造し、次いで、この検査をする方法が採られていた。(Prior Art) A conventional method of manufacturing a plurality of electronic component units from one base circuit board of this shelf is as shown in FIG. 5, by punching out a plurality of unit circuit boards 11 from a base circuit board 10, It is divided into a plurality of unit circuit boards 11, cream solder is applied to the divided unit circuit boards 11 by Sufurin printing on the bat, and then electronic components are mounted and soldered and connected by reflow to mount them. A method has been adopted in which electronic component units are manufactured and then inspected.
（発明が解決しようとする課題）
上記従来の方法では、ベース回路基板１０からユニット
回路基板１１を打抜き分割した復に、この分割されたユ
ニット回路基板１１にそれぞれスクリーン印刷による半
田クリームを塗布し、電子部品を実装するため、各ユニ
ット回路基板１１毎に塗布工程、実装工程などを行わな
くてはならず、製造コストが＾くなり、また第５図に示
すようにベース回路基板のスクラップ部分１２が多くな
る問題を有していた。(Problem to be Solved by the Invention) In the above conventional method, after punching and dividing the unit circuit board 11 from the base circuit board 10, each of the divided unit circuit boards 11 is coated with solder cream by screen printing, In order to mount electronic components, it is necessary to perform a coating process, a mounting process, etc. for each unit circuit board 11, which increases the manufacturing cost and also reduces the scrap portion 12 of the base circuit board as shown in FIG. The problem was that there were many.
本発明は上記問題点を解決するためになされたもので、
金属板からなるベース回路基板の各ユニット回路基板部
に縁片部を切り起す工程と、各ユニット回路基板部に電
子部品を表面実装する工程との後に、ユニット回路基板
部を打抜く工程を行ない、複数個のユニット回路基板を
同時に製造でき、製造時間を短縮できるとともに製造コ
ストの低減を図ることができ、ユニット回路基板の歪み
を防止ぐき、スクラップも少なくできる電子部品ユニッ
トの製造方法を提供するものである。The present invention has been made to solve the above problems,
After the process of cutting and raising edge pieces on each unit circuit board part of the base circuit board made of a metal plate and the process of surface mounting electronic components on each unit circuit board part, a process of punching out the unit circuit board part is performed. To provide a method for manufacturing an electronic component unit that can simultaneously manufacture a plurality of unit circuit boards, shorten manufacturing time and reduce manufacturing costs, prevent distortion of the unit circuit boards, and reduce scrap. It is something.
（発明の構成）
（課題を解決するための手段）
本発明の電子部品ユニットの製造方法は、金属板からな
るベース回路基板に複数個のユニット回路基板に分割可
能なスリットを形成する工程と、このスリットを形成す
る工程の後に前記ベース回路基板に分離される各ユニッ
ト回路基板部の両側縁部にそれぞれ縁片部を切り起す工
程と、この縁片部を切り起す工程の後に前記ベース回路
基板に分離される各ユニット回路基板部に電子部品を表
面実装する工程と、この表面実装する工程の後に前記ベ
ース回路基板からユニット回路基板部を分離する工程と
を含むことを特徴とするものである。(Structure of the Invention) (Means for Solving the Problems) A method for manufacturing an electronic component unit of the present invention includes the steps of forming a slit in a base circuit board made of a metal plate that can be divided into a plurality of unit circuit boards; After the step of forming the slits, a step of cutting and raising edge pieces on both side edges of each unit circuit board section separated into the base circuit board, and after the step of cutting and raising the edge pieces, the base circuit board The method is characterized by comprising the steps of surface mounting electronic components on each unit circuit board portion separated into two parts, and a step of separating the unit circuit board part from the base circuit board after the surface mounting step. .
（作用）
本発明の電子部品ユニットの製造方法は、金属板からな
るベース回路基板に複数個のユニット回路基板に分割可
能なスリットを形成し、このスリットを形成する工程の
後に前記ベース回路基板に分離される各ユニット回路基
板部の長子方向に沿った両側縁部にそれぞれ縁片部を同
時に切り起して各ユニット回路基板の耐歪み性を高め、
この縁片部を切り起す工程の模に前記ベース回路基板に
分離される各ユニット回路基板部に同時に電子部品を表
面実装し、この表面実装する工程の後に前記ベース回路
基板からユニット回路基板部を分離し、同一工程で、同
時に複数の電子部品ユニットを製造するものである。(Function) In the method for manufacturing an electronic component unit of the present invention, a slit that can be divided into a plurality of unit circuit boards is formed in a base circuit board made of a metal plate, and after the step of forming the slit, the base circuit board is Edge pieces are simultaneously cut and raised on both edges along the longitudinal direction of each unit circuit board to be separated to increase the distortion resistance of each unit circuit board.
Simulating this step of cutting and raising the edge pieces, electronic components are simultaneously surface mounted on each unit circuit board section separated into the base circuit board, and after this surface mounting step, the unit circuit board section is removed from the base circuit board. A plurality of electronic component units are manufactured at the same time in the same process.
（実施例）
本発明の電子部品ユニットの製造方法の一実施例を図面
第１図乃至第４図について説明する。(Embodiment) An embodiment of the method for manufacturing an electronic component unit of the present invention will be described with reference to FIGS. 1 to 4.
第１図に示す１は、金属板の表面に電気絶縁膜を形成し
たベース回路基板で、このベース回路基板の幅方向の長
さはユニット回路基板２の長さ寸法に形成され、このベ
ース回路基板１上にこのベース回路基板１から分離され
る複数の各ユニット回路基板２にそれぞれ対応して銅箔
をエツチングによりパターン化するとともにレジスト塗
布する。1 shown in FIG. 1 is a base circuit board having an electrically insulating film formed on the surface of a metal plate.The length of this base circuit board in the width direction is formed to the length dimension of the unit circuit board 2. Copper foil is patterned by etching and resist is applied onto the substrate 1 in correspondence with each of the plurality of unit circuit boards 2 to be separated from the base circuit board 1.
次いで、第２図に示すように、前記ベース回ｆｆｉ基板
１に複数のユニット回路基板２の長手方向の両端部にそ
れぞれ同時にゲージ孔を兼ねる取付は孔３を形成すると
ともに、複数個の各ユニット回路基板２の輪郭部に各ユ
ニット回路基板２に分ｇｌＩ可能なスリット４を打抜き
形成する。このスリット４を打抜き形成する工程の後に
、ベース回路基板１の各ユニット回路基板２にスクリー
ン印刷よりバット部にクリーム半田を塗布した後、第３
図に示すようにベース回路基板１に分離される各ユニッ
ト回路基板２の長子方向に沿った両側縁部にそれぞれ各
ユニット回路基板２の耐歪み性を高める縁片部５を同時
に切り起し形成する。Next, as shown in FIG. 2, mounting holes 3 which also serve as gauge holes are formed at both ends of the plurality of unit circuit boards 2 in the longitudinal direction of the base circuit FFI board 1, and holes 3 are formed for each of the plurality of units. A slit 4 that can be divided into each unit circuit board 2 is formed by punching on the outline of the circuit board 2. After the step of forming the slit 4 by punching, cream solder is applied to the butt part of each unit circuit board 2 of the base circuit board 1 by screen printing, and then the third
As shown in the figure, edge pieces 5 that increase the distortion resistance of each unit circuit board 2 are simultaneously cut and raised on both side edges along the longitudinal direction of each unit circuit board 2 that is separated into the base circuit board 1. do.
この縁片部５を切り起す工程の後に、前記ベース回路基
板１に分離される各ユニット回路基板２に必要に応じて
接着材を塗布し、第４図に示すように各ユニット回路基
板２に電子部品６を装着して、この電子部品６のリード
線部７を各ユニット回路基板２にリフ〇−で半田８付け
し、表面実装する。After the step of cutting and raising the edge piece 5, an adhesive is applied as necessary to each unit circuit board 2 separated into the base circuit board 1, and as shown in FIG. The electronic component 6 is mounted, and the lead wire portion 7 of the electronic component 6 is soldered 8 to each unit circuit board 2 using a rift 0- for surface mounting.
次いで、この表面実装した工程に引続き、各ユニット回
Ｍ！１板２の検査などを行った後、前記ベース回路基板
１からユニット回路基板２を打抜きなどにより分離させ
、スクラップ部９を取除き、同一行程で、同時に複数の
電子部品ユニットを製造する。Next, following this surface mounting process, each unit is subjected to M! After inspecting each board 2, the unit circuit board 2 is separated from the base circuit board 1 by punching or the like, the scrap portion 9 is removed, and a plurality of electronic component units are simultaneously manufactured in the same process.
なお、このユニット回路基板２の分離は、スリット４に
沿って打広き、また第４図に示すように、各ユニット回
路基板２の角隅部を傾斜状に切取り、各ユニット回路基
板２の両端部を梯形状に形成し、パリの発生を少なくす
る。The unit circuit boards 2 are separated by widening along the slits 4, and as shown in FIG. The part is formed into a ladder shape to reduce the occurrence of cracks.
また、必要に応じて、前記各ユニット回路基板に分離す
る工程の前に、ベース回路基板１を洗浄してフラックス
を洗浄する。Furthermore, if necessary, the base circuit board 1 is cleaned to remove flux before the step of separating into each unit circuit board.
そしてこのような工程にて製造された各ユニット回路基
板２は、予め、両側縁に縁片部５が形成されているため
、歪み変形が防止される。Since each unit circuit board 2 manufactured through such a process has edge pieces 5 formed on both side edges in advance, distortion and deformation are prevented.
そしてこの実施例の方法のように、ベース回路基板１の
幅方向の寸法をユニット回路基板２の長さに予め設定す
ることにより、ベース回路！１板１のスクラップの発生
を少なくすることができる。Then, as in the method of this embodiment, by setting the widthwise dimension of the base circuit board 1 to the length of the unit circuit board 2 in advance, the base circuit! The generation of scrap per plate 1 can be reduced.
なお前記実施例ではベース回路基板１上に各ユニット回
路基板２を形成した後、スリット４を打抜き形成した後
、スリット４を打抜き形成したものであるが、予めスリ
ットをベース回ｍ基板に設けておき、この回路基板上に
各ユニット回路基板２を形成してもよい。In the above embodiment, after each unit circuit board 2 was formed on the base circuit board 1, the slit 4 was formed by punching, and then the slit 4 was punched out. Then, each unit circuit board 2 may be formed on this circuit board.
本発明によれば、金属板からなるベース回路基板に複数
個のユニット回路基板に分割可能なスリットを形成する
工程と、前記ベース回路基板に分離される各ユニット回
路基板部の長手方向に沿った両側縁部にそれぞれ縁片部
を切り起す工程と、前記ベース回路基板に分離される各
ユニット回路基板部に電子部品を表面実装する工程と、
前記ベース回路基板から各ユニット回路基板部を分離す
る工程とを含むので、複数の各ユニット回路基板の製造
が同時に同一工程でき、製造ｖｆ固を短縮でき、製造コ
ストを低減でき、また各ユニット回路基板は予め、両側
縁に縁片部を形成しているため、ユニット回路基板の歪
み変形を防止でき、電子部品は確実に安定してユニット
回路基板に接続され、信頼性の高い電子部品ユニットを
製造できるものである。According to the present invention, a step of forming a slit in a base circuit board made of a metal plate that can be divided into a plurality of unit circuit boards, and a step of forming a slit along the longitudinal direction of each unit circuit board part to be separated into the base circuit board. a step of cutting and raising edge pieces on both side edges, and a step of surface mounting electronic components on each unit circuit board section separated into the base circuit board;
Since the process includes the step of separating each unit circuit board section from the base circuit board, a plurality of unit circuit boards can be manufactured simultaneously in the same process, manufacturing VF can be shortened, manufacturing cost can be reduced, and each unit circuit board can be manufactured in the same process. The board has edge pieces formed on both sides in advance, which prevents distortion and deformation of the unit circuit board, ensuring that electronic components are stably connected to the unit circuit board, and creating a highly reliable electronic component unit. It can be manufactured.
第１図乃至第４図は本発明の電子部品ユニットの製造方
法の工程を示す斜視図、第５図は従来の電子回路ユニッ
トの製造方法を示す斜Ｊ［である。
１・・ベース回路基板、２・・ユニット回路基板、４・
・スリット、５・・縁片部、６・・電子部品。
平成元年２月１４日
発 明 者
鈴
木
思1 to 4 are perspective views showing the steps of the method for manufacturing an electronic component unit according to the present invention, and FIG. 5 is a perspective view showing a conventional method for manufacturing an electronic circuit unit. 1.Base circuit board, 2.Unit circuit board, 4.
・Slit, 5. Edge piece, 6. Electronic component. Invented on February 14, 1989 by Osamu Suzuki
Claims (1)
ット回路基板に分割可能なスリットを形成する工程と、 このスリットを形成する工程の後に前記ベース回路基板
に分離される各ユニット回路基板部の両側縁部にそれぞ
れ縁片部を切り起す工程と、この縁片部を切り起す工程
の後に前記ベース回路基板に分離される各ユニット回路
基板部に電子部品を表面実装する工程と、 この表面実装する工程の後に前記ベース回路基板からユ
ニット回路基板部を分離する工程とを含むことを特徴と
する電子部品ユニットの製造方法。(1) A step of forming a slit that can be divided into a plurality of unit circuit boards in a base circuit board made of a metal plate, and a step of forming each unit circuit board section to be separated into the base circuit board after the step of forming the slit. a step of cutting and raising edge pieces on both side edges, a step of surface mounting electronic components on each unit circuit board portion separated into the base circuit board after the step of cutting and raising the edge pieces, and this surface mounting. A method for manufacturing an electronic component unit, comprising the step of separating a unit circuit board portion from the base circuit board after the step of separating the unit circuit board portion from the base circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3410089A JPH02213193A (en) | 1989-02-14 | 1989-02-14 | Manufacture of electronic component unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3410089A JPH02213193A (en) | 1989-02-14 | 1989-02-14 | Manufacture of electronic component unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02213193A true JPH02213193A (en) | 1990-08-24 |
Family
ID=12404856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3410089A Pending JPH02213193A (en) | 1989-02-14 | 1989-02-14 | Manufacture of electronic component unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02213193A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4225362C2 (en) * | 1991-08-09 | 2001-05-10 | Thomson Consumer Electronics | Magnetic field compensator |
-
1989
- 1989-02-14 JP JP3410089A patent/JPH02213193A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4225362C2 (en) * | 1991-08-09 | 2001-05-10 | Thomson Consumer Electronics | Magnetic field compensator |
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