JPH0221404B2 - - Google Patents
Info
- Publication number
- JPH0221404B2 JPH0221404B2 JP14298482A JP14298482A JPH0221404B2 JP H0221404 B2 JPH0221404 B2 JP H0221404B2 JP 14298482 A JP14298482 A JP 14298482A JP 14298482 A JP14298482 A JP 14298482A JP H0221404 B2 JPH0221404 B2 JP H0221404B2
- Authority
- JP
- Japan
- Prior art keywords
- brominated
- reaction
- polyphenol
- water
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000013824 polyphenols Nutrition 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 21
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 21
- 239000003960 organic solvent Substances 0.000 claims description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 14
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000006704 dehydrohalogenation reaction Methods 0.000 claims description 7
- 150000003944 halohydrins Chemical class 0.000 claims description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 33
- 238000007259 addition reaction Methods 0.000 description 24
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 16
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 15
- 239000002966 varnish Substances 0.000 description 10
- 239000000047 product Substances 0.000 description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- 239000003153 chemical reaction reagent Substances 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000007033 dehydrochlorination reaction Methods 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- -1 polybutylene terephthalate Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000007363 ring formation reaction Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000006703 hydration reaction Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 239000003021 water soluble solvent Substances 0.000 description 2
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- FUQAGKYWAUZSEJ-UHFFFAOYSA-N 2,3,4,5-tetrabromo-6-(2-hydroxyphenyl)phenol Chemical compound OC1=CC=CC=C1C1=C(O)C(Br)=C(Br)C(Br)=C1Br FUQAGKYWAUZSEJ-UHFFFAOYSA-N 0.000 description 1
- JHJUYGMZIWDHMO-UHFFFAOYSA-N 2,6-dibromo-4-(3,5-dibromo-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(O)C(Br)=C1 JHJUYGMZIWDHMO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VVHFXJOCUKBZFS-UHFFFAOYSA-N 2-(chloromethyl)-2-methyloxirane Chemical compound ClCC1(C)CO1 VVHFXJOCUKBZFS-UHFFFAOYSA-N 0.000 description 1
- AGIBHMPYXXPGAX-UHFFFAOYSA-N 2-(iodomethyl)oxirane Chemical compound ICC1CO1 AGIBHMPYXXPGAX-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 150000008045 alkali metal halides Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- XENVCRGQTABGKY-ZHACJKMWSA-N chlorohydrin Chemical compound CC#CC#CC#CC#C\C=C\C(Cl)CO XENVCRGQTABGKY-ZHACJKMWSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 238000005695 dehalogenation reaction Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- BVURNMLGDQYNAF-UHFFFAOYSA-N dimethyl(1-phenylethyl)amine Chemical compound CN(C)C(C)C1=CC=CC=C1 BVURNMLGDQYNAF-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- WPZJSWWEEJJSIZ-UHFFFAOYSA-N tetrabromobisphenol-F Natural products C1=C(Br)C(O)=C(Br)C=C1CC1=CC(Br)=C(O)C(Br)=C1 WPZJSWWEEJJSIZ-UHFFFAOYSA-N 0.000 description 1
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 1
- NJFUXFRJVIXVSG-UHFFFAOYSA-M tetramethylphosphanium;chloride Chemical compound [Cl-].C[P+](C)(C)C NJFUXFRJVIXVSG-UHFFFAOYSA-M 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Description
本発明は可鹸化ハロゲン含量の少ない臭素化ポ
リエポキシ化合物の製造方法に関するものであ
る。本発明の実施により得られた臭素化ポリエポ
キシ化合物は電気積層板、特にプリント配線基板
(PC)のワニス用樹脂、封止剤として有用であ
る。
テトラブロモビスフエノールAのジグリシジル
エーテルに代表される臭素化ポリフエノールは耐
トラツキング性、耐熱性、難燃性に優れる硬化物
を与えることからビスフエノールAのジグリシジ
ルエーテルと併用され、電気積層板の含浸材料と
して利用されている。また、テトラブロモビスフ
エノールAのジグリシジルエーテル自身、単独で
注型材料、ポリブチレンテレフタレートや不飽和
ポリエステルの難燃剤として利用されている。
かかるテトラブロモビスフエノールAのジグリ
シジルエーテルは、従来、テトラブロモビスフエ
ノールA1モルに対し、エピハロヒドリンを5〜
10モルの割合で用い、水酸化ナトリウム2〜2.2
モルの水溶液を2〜3時間かけて徐々に添加し、
60〜90℃で反応させて製造されている。しかしな
がら、この製造方法で得られる次式()で示さ
れるテトラブロモビスフエノールAのジグリシジ
ルエーテル
は、次式()
において示される構造式の化合物を含有し、この
可鹸化可能な塩素含量が生成物中、1〜2重量%
残存する。
可鹸化塩素含量が高いことはポリエポキシ化合
物の硬化速度を遅くしたり、得られる硬化物の電
気特性、沸騰水煮沸後の機械特性を低下させるの
で、更に再脱塩化水素反応を行つて可鹸化塩素含
量を0.1重量%以下に低下させる必要がある。
この再脱塩化水素反応は、一般に過剰のエピク
ロルヒドリンを留去した後、トルエン、キシレン
などの芳香族系溶媒あるいはメチルイソブチルケ
トン、メチルエチルケトンなどのケトン系溶媒で
希釈して、濃度1〜20%の水酸化ナトリウム水溶
液を、残存している加水分解性塩素に対し、1.1
〜10倍当量添加し、60〜90℃で行われる。しか
し、この方法では加水分解性塩素を0.1%以下、
特に0.05%以下まで低減するには、前述の条件の
うち、かなり厳しい条件をとつても困難であり、
その場合には逆にエポキシ基の水和及び重合等の
好ましくない副反応が生じるおそれがある。この
場合、上記の疎水性溶剤に代えてアセトン、メチ
ルアルコール、エチルアルコール、プロピルアル
コールなどの水溶性溶媒を多量に用いれば、比較
的ゆるやかな条件でも加水分解性塩素を0.1%以
下にすることはできるが、水溶性溶媒は水と分離
しにくいので、廃水中にこれらの有機溶媒が混入
し、このため廃水処理が大変で製造コストは高い
ものとなる。
本発明は、かかる再脱塩化水素反応を行なうこ
となく、可鹸化ハロゲン含量が0.1重量%以下の
臭素化ポリエポキシ化合物を製造する方法、即
ち、臭素化ポリフエノールとエピハロヒドリンと
を前者の臭素化ポリフエノールのフエノール性水
酸基1当量に対してエピハロヒドリン0.6〜1.5モ
ル未満の割合で、アルカリ金属の水酸化物が前記
臭素化ポリフエノールのフエノール性水酸基1当
量に対し、0.01〜0.8モルの割合であるアルカリ
金属の水酸化物の水溶液および生成する臭素化ポ
リエポキシ化合物の5〜200重量%の有機溶剤の
存在下に反応させて臭素化ポリフエノールのハロ
ヒドリンエーテルを製造した後、アルカリ金属の
水酸化物を添加し、脱ハロゲン化水素反応を反応
系より水を除去しながら行うことを特徴とする臭
素化ポリエポキシ化合物の製造方法を提供するも
のである。
本発明の実施において、臭素化ポリフエノール
としては、次式()で示されるテトラブロモビ
スフエノールA、テトラブロモビスフエノール
F、テトラブロモビスフエノールS等のメタ位に
Br基を有するテトラブロモビスフエノール類;
〔式中、Aは―CH2―、
The present invention relates to a method for producing a brominated polyepoxy compound having a low saponifiable halogen content. The brominated polyepoxy compounds obtained by practicing the present invention are useful as varnish resins and sealants for electrical laminates, especially printed wiring boards (PCs). Brominated polyphenols, typified by diglycidyl ether of tetrabromobisphenol A, are used in combination with diglycidyl ether of bisphenol A because they provide cured products with excellent tracking resistance, heat resistance, and flame retardancy, and are used in electrical laminates. It is used as an impregnating material. In addition, the diglycidyl ether of tetrabromobisphenol A itself is used alone as a casting material and a flame retardant for polybutylene terephthalate and unsaturated polyester. Such diglycidyl ether of tetrabromobisphenol A has conventionally been prepared by adding 5 to 5 epihalohydrin to 1 mole of tetrabromobisphenol A.
Used in a ratio of 10 moles, 2 to 2.2 sodium hydroxide
molar aqueous solution was gradually added over 2 to 3 hours,
It is manufactured by reacting at 60-90℃. However, the diglycidyl ether of tetrabromobisphenol A obtained by this production method and represented by the following formula () is the following formula () contains a compound having the structural formula shown in
remain. A high saponifiable chlorine content slows down the curing speed of the polyepoxy compound and lowers the electrical properties and mechanical properties of the resulting cured product after boiling in boiling water, so a further dehydrochlorination reaction is performed to make it saponifiable. It is necessary to reduce the chlorine content to below 0.1% by weight. This re-dehydrochlorination reaction is generally carried out by distilling off excess epichlorohydrin and then diluting it with an aromatic solvent such as toluene or xylene or a ketone solvent such as methyl isobutyl ketone or methyl ethyl ketone to give a concentration of 1 to 20% water. Add sodium oxide aqueous solution to the remaining hydrolyzable chlorine at 1.1
~10 times the equivalent is added and carried out at 60-90°C. However, with this method, the amount of hydrolyzable chlorine is 0.1% or less.
In particular, it is difficult to reduce it to 0.05% or less even under the severe conditions mentioned above.
In that case, there is a risk that undesirable side reactions such as hydration and polymerization of the epoxy group may occur. In this case, if you use a large amount of a water-soluble solvent such as acetone, methyl alcohol, ethyl alcohol, or propyl alcohol instead of the above-mentioned hydrophobic solvent, it is possible to reduce the hydrolyzable chlorine to 0.1% or less even under relatively mild conditions. However, since water-soluble solvents are difficult to separate from water, these organic solvents are mixed into wastewater, making wastewater treatment difficult and production costs high. The present invention provides a method for producing a brominated polyepoxy compound having a saponifiable halogen content of 0.1% by weight or less without carrying out such re-dehydrochlorination reaction. an alkali in which the proportion of epihalohydrin is less than 0.6 to 1.5 mol per equivalent of the phenolic hydroxyl group of the phenol, and the alkali metal hydroxide is contained in a proportion of 0.01 to 0.8 mol per equivalent of the phenolic hydroxyl group of the brominated polyphenol; A halohydrin ether of a brominated polyphenol is produced by reacting it in the presence of an aqueous solution of metal hydroxide and an organic solvent containing 5 to 200% by weight of the resulting brominated polyepoxy compound, followed by hydration of an alkali metal. The present invention provides a method for producing a brominated polyepoxy compound, characterized in that the dehydrohalogenation reaction is carried out while removing water from the reaction system. In the practice of the present invention, examples of brominated polyphenols include tetrabromobisphenol A, tetrabromobisphenol F, and tetrabromobisphenol S represented by the following formula () at the meta position.
Tetrabromobisphenols having a Br group; [In the formula, A is -CH 2 -,
【式】―SO2―基
である〕
一般式()
〔式中、RはH、Brまたは炭素数1〜9のア
ルキル基であり、nは1〜5の数である〕
で示される臭素化ノボラツクがあげられる。
次に、エピハロヒロリドンとしては、エピクロ
ルヒドリン、エピブロモヒドリン、エピヨードヒ
ドリン、β―メチルエピクロルヒドリンが使用で
きる。
前段の付加反応の触媒であるアルカリ金属の水
酸化物としては、水酸化カリウム、水酸化ナトリ
ウム、水酸化リチウムが挙げられる。これらの中
でも水酸化ナトリウムが最も安価である。このア
ルカリ金属の水酸化物は水溶液として反応系に添
加される。
これらアルカリ金属の大酸化物とともに、公知
の付加触媒であるテトラメチルアンモニウムブロ
マイド等の第四アンモニウム塩、テトラメチルホ
スホニウムクロリド等のホスホニウム塩を用いて
もよい。
そして付加反応時の溶媒として用いられる有機
溶剤は、原料のエピハロヒドリン、臭素化ポリフ
エノールおよび目的とする生成物である臭素化ポ
リエポキシ化合物と相溶性を有するものであり、
具体的にはn―ブタノール、オクタノール等の脂
肪族一価アルコール;エチレングリコール、ジエ
チレングリコール、プロピレングリコール等のグ
リコール類;ベンジルアルコール、シクロヘキサ
ノール等の環状アルコール;メチルエチルケト
ン、メチルイソブチロルケトン、メチルイソプロ
ピルケトン、シクロヘキサノン等のケトン類;n
―ブチルエーテル、1,4―ジオキサン、エチレ
ングリコールモノメチルエーテル、エチレングリ
コールモノエチルエーテル等のエーテル類;酢酸
メチル、酢酸エチル、酢酸イソブチル、酢酸n―
ブチル、蟻酸エチル、蟻酸プピル、蟻酸n―ブチ
ル等のエステル類があげられる。これらの中でも
沸点が100℃を越えるものが好ましく、中でも水
との分離が容易なブタノール、メチルエチルケト
ン、メチルイソブチルケトンが好ましく、特にメ
チルイソブチルケトン(沸点117℃)は水への溶
解度が小さいことと比重が0.8と小さいので最適
である。
付加反応における各成分の仕込比は次の通りで
ある。
臭素化ポリフエノールのフエノール性水酸基1
当量に対し、エピハロヒドリンは0.6〜1.5モル未
満、好ましくは0.7〜1.4モル、より好ましくは0.8
〜1.4モルの割合である。0.6モル未満では、生成
物がエポキシ基を殆んど持たない高分子量樹脂と
なり、硬化剤により三次元構造の熱不融硬化物を
得ることができない。また、1.5モル以上用いる
と、前式(1)において、nが0の臭素化ポリフエノ
ールのジグリシジルエーテルが得られるが、この
ものはフエノール樹脂の難燃剤として有用である
が、ワニス用としてメチルイソブチルケトン、ト
ルエン等に溶解して保存する場合、再結晶して析
出しやすい欠点がある。また、エピハロヒドリン
の過剰の使用は、回収コストを増加させる。
次に、付加反応触媒であるアルカリ金属の水酸
化物は、臭素化ポリフエノールのフエノール性水
酸基1当量に対し、0.01〜0.8モル、好ましくは
0.1〜0.5モルの割合で使用される。0.01モル未満
では付加反応に長時間要する。0.8モルを越えて
使用すると、付加反応中に閉環反応及び閉環反応
により生成したエポキシ基と残存フエノールとの
重合反応が進行し、ゲル分が増加するので好まし
くない。
そして、有機溶剤は付加反応および閉環反応を
容易とならしめるために目的とする生成物の臭素
化ポリエポキシ化合物の5〜200重量%、好まし
くは10〜50重量%の割合で使用される。従来の製
造方法においては、臭素化ポリフエノール1モル
に対し、エピハロヒドリンは5〜10モルと過剰に
用いられ、臭素化ポリフエノールはエピハロヒド
リンに溶解されるが、本発明においては1.2〜3
モル未満であるためにエピハロヒドリンが臭素化
ポリフエノールを完全に溶解することができない
ので臭素化ポリフエノールを溶解する有機溶剤を
配合して付加反応を容易とならしめる。
付加反応は、80〜120℃で1/6〜3時間、好まし
くは95〜110℃で1/3〜1時間行うことにより臭素
化ポリフエノールのフエノール性水酸基をハロヒ
ドリンエーテル基に95%以上転化させることがで
きる。付加反応を反応試剤が沸騰する温度で行う
ときは、共沸した水を分離して系外へ除去し、エ
ピハロヒドリン及び有機溶剤を反応試剤中に戻し
て行うのが好ましい。但し、付加反応に使用する
アルカリ金属水酸化物の水溶液を、本発明の条件
内で出来るだけ少い量を選ぶことにより水の除去
を省略できる。
この付加反応により得られる臭素化ポリフエノ
ールのハロヒドリンエーテルは、可鹸化塩素含量
が約6〜8重量%、エポキシ当量が約850〜4000
のものである。
付加反応に引き続いて、アルカリ金属の水酸化
物を原料に用い臭素化ポリフエノールのフエノー
ル性水酸基1当量に対して、付加反応に用いたア
ルカリ金属の水酸化物の使用モル数と新たに添加
するアルカリ金属の水酸化物のモル数の和が1.0
〜1.2モル、好ましくは1.05〜1.15モルとなる量、
徐々に添加する。添加は90〜110℃の温度で、5
〜120分、好ましくは10〜60分かけて行うのが付
加反応生成物を冷却することなく添加を行うこと
ができるので好ましい。
アルカリ金属の水酸化物の添加終了後、減圧下
で60〜120℃、好ましくは85〜120℃で、または、
常圧下で100〜150℃、好ましくは100〜120℃で1
〜10時間、好ましくは2〜5時間反応系より水を
除去しつつ脱ハロゲン化水素反応を行なう。この
脱ハロゲン化水素反応は有機溶剤と水が共沸する
温度で、しかも水を有機溶剤と共沸させて反応系
外へ実質的に除去し、水が分離された有機溶剤は
反応系に循環させて行なう。また、1〜5Kg/cm2
Gの加圧下に、100〜150℃の温度で1〜5時間加
熱することにより行うこともできる。前者の方が
より可鹸化ハロゲン含量の小さい臭素化ポリエポ
キシ化合物が得られ、かつ、加圧装置を必要とし
ないのでより好ましい。但し、色相が良好な臭素
化ポリエポキシ化合物を目的とする場合は減圧法
又は後者の加圧法を用いる。
なお、必要に応じて脱ハロゲン化水素反応前に
有機溶剤を反応系に添加することは可能である。
本発明において、メタ位に臭素基を有する臭素
化ポリフエノールを原料としていることおよびア
ルカリ金属水酸化物の付加反応による消費により
系内のアルカリ濃度が低くなり閉環反応がおこり
にくい状態となつているので、脱ハロゲン化水素
反応は、ほとんど水の存在しない状態で、かつ減
圧下では60〜120℃、加圧下または常圧下では100
〜150℃と苛酷な温度条件で行う必要がある。な
お、付加反応において生成したハロヒドリンエー
テルは、可鹸化可能なハロゲンとエピハロヒドリ
ンとのトランスエポキレーシヨンが起りにくいの
で副生するジハロゲンヒドリンの量は極めて少量
か、まつたくない。
脱ハロゲン化反応終了後、必要により有機溶剤
を添加し、水を加えて洗浄し、アルカリ金属のハ
ロゲン塩を水とともに分離し、その後減圧下で有
機溶剤を160℃以下の温度で留去する精製工程を
得て臭素化ポリエポキシ化合物を得ることができ
る。
このようにして得られた臭素化ポリエポキシ化
合物は、エポキシ当量が330〜800、可鹸化ハロゲ
ン含量が0.1重量%以下のものであり、20℃で固
体である。そして、テトラブロモビスフエノール
Aを原料とするときは、一般式()において、
nが0〜1、好ましくは0.08〜0.5で示されるポ
リエポキシ化合物である。
この臭素化ポリエポキシ化合物に、硬化剤、有
機溶剤、必要により促進剤、他のポリエポキシ化
合物を配合することによりプリプレグ用のワニス
が調製される。かかる硬化剤としてはジシアンジ
アミド、オルソトリルビスグアニジン、テトラメ
チルグアニジン、トリエチレンテトラミン、ジア
ミノジフエニルメタン等が使用できる。促進剤と
してはベンジルジメチルアミン、α―メチルベン
ジルジメチルアミン、2―(ジメチルアミノメチ
ル)フエノール等の芳香環を有する第3級アミ
ン、N―メチルモルホリン等の脂環族第3級アミ
ン、BF3―アミン錯塩等が使用できる。溶剤とし
ては用いる硬化剤によつて異なるが、アセトン、
メチルセロソルブ、メチルエチルケトン、ジメチ
ルホルムアミド、メタノール等が単独、または併
用して用いられる。
例えば硬化剤がジアミノジフエニルメタンのと
きはアセトンが、硬化剤がジシアンジアミドのと
きはジメチルホルムアミド、メチルセロソルブが
好適である。
PC製造用プリプレグは、例えば常温で前記組
成のワニスが補強材に樹脂量が15〜75重量%、好
ましくは50重量%前後となる割合でガラス繊維、
リンター紙に含浸され、120〜180℃に設定された
乾燥室内に導かれ、2〜10分間乾燥して有機溶剤
を除去する(B−ステージ化)ことによりポリエ
ポキシ樹脂が補強材に含浸したプリプレグが製造
される。
このプリプレグは切断によりシート状にされ、
この複数枚が接着剤付銅箔と重ねられ、次いで
140〜180℃の温度で10〜100Kg/cm2の圧力で20〜
100分間プレス成形され、樹脂が3次元に架橋さ
れることにより銅張積層板が製造される。
ついで銅箔上に回路をプリント印刷後、フオト
レジスト層を設け、光を照射してフオトレジスト
を硬化させ、弱アルカリ溶液で未硬化のフオトレ
ジストを流し去り、更に、酸エツチングによりフ
オトレジスト膜で被覆されていない銅部分を溶解
し、水洗後、塩化メチレン等で硬化したフオトレ
ジスト膜を除去することにより製造される。この
樹脂積層板の表面に銅線回路が施こされたPCは
電卓、マイコンの分野に広く使用される。
本発明の実施により得られる臭素化ポリエポキ
シ化合物は淡黄色の固体であり、これを用いて調
製したワニスは貯蔵安定性に優れている。また、
可鹸化ハロゲン含量も低いのでこの臭素化ポリエ
ポキシ化合物は電気積層板、ICやLSI等の樹脂封
止、モールデイング、トランスモールデイング、
注型等に好適な材料である。
以下、実施例により本発明を更に詳細に説明す
る。
実施例 1
冷却装置、温度計、還流冷却器、水酸化ナトリ
ウム水溶液の滴下器を備えた4のステンレスフ
ラスコ内に、テトラブロモビスフエノール
A1000g(約1.84モル)、エピクロルヒドリン340g
(約3.68モル)およびメチルイソブチルケトン
340gを仕込み、これら反応試剤を42℃迄昇温さ
せた。
ついで、50%の水酸化ナトリウムの水溶液66g
(NaOH固型分で0.825モル)をフラスコ内に一度
に添加した後、反応試剤が沸騰する温度(約100
℃)迄加熱し、同温で30分間付加反応を行つた。
この間、共沸した水、エピクロルヒドリン、メチ
ルイソブチルケトンは冷却し、フラスコ内に戻し
た。
この付加反応生成物(1320g)の一部を取り出
し、メチルイソブチルケトンに溶解した後、水洗
し、メチルイソブチルケトンを110℃で減圧留去
して得たテトラブロモビスフエノールAのクロル
ヒドリンエーテルの物性は次の通りであつた。
可鹸化塩素含量 7.82重量%
エポキシ当量 2800
フエノール性水酸基 0.010meq/g
(フエノール性水酸基転化率 99.3%)
次いで、50%の水酸化ナトリウムの水溶液
270g(3.38モル)を約100℃の温度で20分間要して
フラスコ内に滴下した後、メチルイソブチルケト
ン2160gを一度に加え、加熱し、反応試剤を共沸
状態とし、この共沸状態を反応試剤の温度が117
℃になるまで保つた。この間、水はメチルイソブ
チルケトンとともに共沸され、分液斗によりフ
ラスコ外へ分離除去され、水が分離されたメチル
イソブチルケトンはフラスコ内に戻した。
温度が117℃となつた時点で加熱を終了し、脱
塩化水素反応を終え、次いで温水を添加し、混
合、静置分離の水洗工程を排水のPHが7.5以下と
なる迄繰り返し、副生した食塩を分離した。
水層を分離した有機溶剤層よりメチルイソブチ
ルケトンを117℃で除去し、次の物性の臭素化ポ
リエポキシ化合物1190gを得た。
エポキシ当量: 380
可鹸化塩素含量: 0.03重量%
フエノール性水酸基含量:
0.001meq/g未満
ガードナー粘度(70%ブチルカルビトール溶
液): K
臭素含量: 78.9重量%
外観: 淡黄色固体
実施例 2〜5
実施例1において、反応試剤の種類および仕込
量を表1のようにする他は同様にして表1に示す
物性の臭素化ポリエポキシ化合物を得た。
比較例 1
フラスコ内に、テトラブロモビスフエノール
A1000g(約1.84モル)、エピクロルヒドリン850g
(約9.2モル)を仕込み、次いで80℃で50%の水酸
化ナトリウムの水溶液を294g(3.68モル)加え、
同温度で4時間反応させた。
反応終了後、過剰のエピクロルヒドリンと水と
を減圧留去した。
次いで、メチルイソブチルケトン600g、50%
水酸化ナトリウム水溶液90gを生成物に添加し、
80℃で4時間反応させた後、メチルイソブチケト
ン1900gを加え、更に水洗を行なつた後、メチル
イソブチルケトンを減圧留去し、表1に示す物性
を示す臭素化ビスフエノールAのジグリシジルエ
ーテル1150gを得た。
実施例 6
付加反応に於て、触媒にトラメチルアンモニウ
ムクロライド1.7gを用い、付加反応温度を90℃と
したこと以外は全て実施例−1と同様に行つた。
得られたものの物性は表1の通りであつた。
実施例 7
実施例1と同様に付加反応及び残余の50%水酸
化ナトリウム水溶液添加反応を行つた後、脱塩化
水素反応を減圧下(18〜750mmHg)でメチルイソ
ブチルケトンおよび水を共沸により系外へ除去し
つつ行つた。
反応終了後、常圧に戻し、生成物にメチルイソ
ブチルケトン2160gを加え、実施例1と同様に水
洗及び溶剤除去を行い、表1に示す物性の臭素化
エポキシ化合物を得た。
実施例 8
実施例1の付加反応を行なつた後、50%の水酸
化ナトリウムの水溶液270gを99℃で20分間かけ
てフラスコ内に滴下した。ついで、反応系を120
℃まで昇温し、1.2Kg/cm2Gの加圧下に2時間脱
塩化水素反応を行つた(この間、水は反応器外へ
出ることはない)。
次いで40℃まで冷却後、以下、実施例1と同様
に精製工程を行ない、表1に示す物性の臭素化ポ
リエポキシ化合物を得た。
貯蔵安定性評価
実施例1〜8および比較例1で得た臭素化ポリ
エポキシ化合物の60重量%メチルエチルケトン溶
液の50mlを100mlの三角フラスコ内に入れ、これ
を10℃の冷蔵庫内に6カ月保存した時、結晶の析
出しなかつたものをワニスの貯蔵性安定とし、結
晶が析出したものを貯蔵安定性不良と評価した。
結果を表1に示す。[Formula] -SO 2 - group] General formula () [In the formula, R is H, Br, or an alkyl group having 1 to 9 carbon atoms, and n is a number of 1 to 5]. Next, as the epihalohydrolidone, epichlorohydrin, epibromohydrin, epiiodohydrin, and β-methylepichlorohydrin can be used. Examples of the alkali metal hydroxide that is the catalyst for the first-stage addition reaction include potassium hydroxide, sodium hydroxide, and lithium hydroxide. Among these, sodium hydroxide is the cheapest. This alkali metal hydroxide is added to the reaction system as an aqueous solution. In addition to these large oxides of alkali metals, known addition catalysts such as quaternary ammonium salts such as tetramethylammonium bromide and phosphonium salts such as tetramethylphosphonium chloride may be used. The organic solvent used as a solvent during the addition reaction is compatible with the raw materials epihalohydrin, brominated polyphenol, and the desired product brominated polyepoxy compound,
Specifically, aliphatic monohydric alcohols such as n-butanol and octanol; glycols such as ethylene glycol, diethylene glycol, and propylene glycol; cyclic alcohols such as benzyl alcohol and cyclohexanol; methyl ethyl ketone, methyl isobutyrol ketone, and methyl isopropyl ketone. Ketones such as , cyclohexanone; n
-Ethers such as butyl ether, 1,4-dioxane, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether; methyl acetate, ethyl acetate, isobutyl acetate, acetic acid n-
Examples include esters such as butyl, ethyl formate, propyl formate, and n-butyl formate. Among these, those with a boiling point exceeding 100℃ are preferable, and among them, butanol, methyl ethyl ketone, and methyl isobutyl ketone are preferable because they can be easily separated from water.In particular, methyl isobutyl ketone (boiling point 117℃) has a low solubility in water and has a high specific gravity. is as small as 0.8, which is optimal. The charging ratio of each component in the addition reaction is as follows. Phenolic hydroxyl group of brominated polyphenol 1
For equivalent weight, the epihalohydrin is less than 0.6 to 1.5 mol, preferably 0.7 to 1.4 mol, more preferably 0.8 mol.
The proportion is ~1.4 mol. If the amount is less than 0.6 mol, the product will be a high molecular weight resin with almost no epoxy groups, and it will not be possible to obtain a heat-infusible cured product with a three-dimensional structure using the curing agent. If 1.5 mol or more is used, a diglycidyl ether of brominated polyphenol in which n is 0 in the previous formula (1) is obtained, which is useful as a flame retardant for phenolic resins, but it is not suitable for use in varnishes. When stored by dissolving it in isobutyl ketone, toluene, etc., it has the disadvantage that it tends to recrystallize and precipitate. Also, the use of excess epihalohydrin increases recovery costs. Next, the alkali metal hydroxide that is the addition reaction catalyst is 0.01 to 0.8 mol, preferably 0.01 to 0.8 mol, per equivalent of the phenolic hydroxyl group of the brominated polyphenol.
Used in a proportion of 0.1-0.5 mole. If it is less than 0.01 mol, the addition reaction will take a long time. If it is used in an amount exceeding 0.8 mol, the ring-closing reaction and the polymerization reaction between the epoxy group generated by the ring-closing reaction and the residual phenol proceed during the addition reaction, which is undesirable because the gel content increases. The organic solvent is used in an amount of 5 to 200% by weight, preferably 10 to 50% by weight of the target brominated polyepoxy compound to facilitate the addition reaction and ring closure reaction. In conventional production methods, epihalohydrin is used in excess of 5 to 10 moles per mole of brominated polyphenol, and the brominated polyphenol is dissolved in epihalohydrin, but in the present invention, epihalohydrin is used in excess of 1.2 to 3 moles.
Since the epihalohydrin cannot completely dissolve the brominated polyphenol because the amount is less than a molar amount, an organic solvent that dissolves the brominated polyphenol is blended to facilitate the addition reaction. The addition reaction is carried out at 80 to 120°C for 1/6 to 3 hours, preferably at 95 to 110°C for 1/3 to 1 hour, so that 95% or more of the phenolic hydroxyl groups of the brominated polyphenol are converted to halohydrin ether groups. can be converted. When the addition reaction is carried out at a temperature where the reaction reagent boils, it is preferable to separate the azeotropic water and remove it from the system, and return the epihalohydrin and organic solvent to the reaction reagent. However, the removal of water can be omitted by selecting the aqueous solution of alkali metal hydroxide used in the addition reaction in an amount as small as possible within the conditions of the present invention. The halohydrin ether of brominated polyphenol obtained by this addition reaction has a saponifiable chlorine content of about 6 to 8% by weight and an epoxy equivalent of about 850 to 4000.
belongs to. Following the addition reaction, using an alkali metal hydroxide as a raw material, the number of moles of the alkali metal hydroxide used in the addition reaction and the number of moles used are newly added to one equivalent of the phenolic hydroxyl group of the brominated polyphenol. The sum of the moles of alkali metal hydroxides is 1.0
~1.2 mol, preferably 1.05-1.15 mol,
Add gradually. Addition is at a temperature of 90-110℃, 5
It is preferable to carry out the addition over a period of 120 minutes, preferably 10 to 60 minutes, since the addition can be carried out without cooling the addition reaction product. After the addition of the alkali metal hydroxide is completed, at 60-120°C, preferably 85-120°C under reduced pressure, or
1 at 100-150℃ under normal pressure, preferably 100-120℃
The dehydrohalogenation reaction is carried out for 10 hours, preferably 2 to 5 hours while removing water from the reaction system. This dehydrohalogenation reaction is carried out at a temperature at which the organic solvent and water azeotrope, and the water is azeotroped with the organic solvent and substantially removed from the reaction system, and the organic solvent from which water has been separated is recycled into the reaction system. Let me do it. Also, 1~5Kg/ cm2
It can also be carried out by heating at a temperature of 100 to 150° C. for 1 to 5 hours under pressure of G. The former method is more preferable because a brominated polyepoxy compound with a lower content of saponifiable halogen can be obtained and a pressurizing device is not required. However, if the objective is to obtain a brominated polyepoxy compound with a good hue, the reduced pressure method or the latter pressurized method is used. Note that, if necessary, it is possible to add an organic solvent to the reaction system before the dehydrohalogenation reaction. In the present invention, since a brominated polyphenol having a bromine group at the meta position is used as a raw material and the alkali metal hydroxide is consumed by the addition reaction, the alkali concentration in the system is low and the ring-closing reaction is difficult to occur. Therefore, the dehydrohalogenation reaction is carried out in the absence of almost any water and at a temperature of 60 to 120°C under reduced pressure and 100°C under increased pressure or normal pressure.
It is necessary to carry out the process under harsh temperature conditions of ~150℃. In addition, in the halohydrin ether produced in the addition reaction, trans-epochlation between saponifiable halogen and epihalohydrin is difficult to occur, so the amount of dihalogenhydrin produced as a by-product is extremely small or undesirable. After the completion of the dehalogenation reaction, an organic solvent is added if necessary, water is added for washing, the alkali metal halide is separated from the water, and the organic solvent is then distilled off under reduced pressure at a temperature of 160°C or lower. A brominated polyepoxy compound can be obtained by the process. The brominated polyepoxy compound thus obtained has an epoxy equivalent of 330 to 800, a saponifiable halogen content of 0.1% by weight or less, and is solid at 20°C. When tetrabromobisphenol A is used as a raw material, in the general formula (),
It is a polyepoxy compound in which n is 0 to 1, preferably 0.08 to 0.5. A varnish for prepreg is prepared by blending this brominated polyepoxy compound with a curing agent, an organic solvent, an accelerator if necessary, and other polyepoxy compounds. As such a curing agent, dicyandiamide, orthotolylbisguanidine, tetramethylguanidine, triethylenetetramine, diaminodiphenylmethane, etc. can be used. Examples of accelerators include tertiary amines having an aromatic ring such as benzyldimethylamine, α-methylbenzyldimethylamine, and 2-(dimethylaminomethyl)phenol, alicyclic tertiary amines such as N-methylmorpholine, and BF 3 -Amine complex salts etc. can be used. The solvent varies depending on the curing agent used, but acetone,
Methyl cellosolve, methyl ethyl ketone, dimethyl formamide, methanol, etc. are used alone or in combination. For example, when the curing agent is diaminodiphenylmethane, acetone is suitable, and when the curing agent is dicyandiamide, dimethylformamide or methyl cellosolve is suitable. For example, the prepreg for PC production is made by using glass fibers in a ratio such that the varnish having the above composition is used as a reinforcing material at room temperature, and the amount of resin is 15 to 75% by weight, preferably around 50% by weight.
The prepreg is impregnated with polyepoxy resin as a reinforcing material by impregnating it with linter paper, leading it into a drying chamber set at 120 to 180℃, and drying it for 2 to 10 minutes to remove the organic solvent (B-stage). is manufactured. This prepreg is cut into sheets,
These multiple sheets are stacked with adhesive-coated copper foil, and then
20~ at a pressure of 10~100Kg/ cm2 at a temperature of 140~180℃
Press molding is performed for 100 minutes, and the resin is three-dimensionally crosslinked to produce a copper-clad laminate. Next, after printing the circuit on the copper foil, a photoresist layer is provided, the photoresist is cured by irradiation with light, the uncured photoresist is washed away with a weak alkaline solution, and the photoresist film is formed by acid etching. It is manufactured by dissolving the uncoated copper parts, washing with water, and removing the photoresist film cured with methylene chloride or the like. PCs with copper wire circuits on the surface of resin laminates are widely used in the fields of calculators and microcontrollers. The brominated polyepoxy compound obtained by carrying out the present invention is a pale yellow solid, and the varnish prepared using it has excellent storage stability. Also,
Because the saponifiable halogen content is low, this brominated polyepoxy compound can be used for electrical laminates, resin encapsulation of ICs and LSIs, molding, transmolding, etc.
This material is suitable for casting, etc. Hereinafter, the present invention will be explained in more detail with reference to Examples. Example 1 Tetrabromobisphenol was placed in a stainless steel flask equipped with a cooling device, a thermometer, a reflux condenser, and a dropper for an aqueous sodium hydroxide solution.
A1000g (approximately 1.84 mol), epichlorohydrin 340g
(approximately 3.68 mol) and methyl isobutyl ketone
340g of these reaction reagents were charged and the temperature of these reaction reagents was raised to 42°C. Next, 66g of a 50% aqueous solution of sodium hydroxide.
(0.825 mol NaOH solids) was added all at once into the flask, then the temperature at which the reaction reagents boiled (approximately 100 mol) was added to the flask.
The addition reaction was carried out at the same temperature for 30 minutes.
During this time, the azeotropic water, epichlorohydrin, and methyl isobutyl ketone were cooled and returned to the flask. A portion of this addition reaction product (1320 g) was taken out, dissolved in methyl isobutyl ketone, washed with water, and the chlorohydrin ether of tetrabromobisphenol A obtained by distilling off methyl isobutyl ketone under reduced pressure at 110°C. The physical properties were as follows. Saponifiable chlorine content 7.82% by weight Epoxy equivalent 2800 Phenolic hydroxyl group 0.010meq/g (phenolic hydroxyl group conversion rate 99.3%) Next, 50% aqueous solution of sodium hydroxide
After dropping 270 g (3.38 mol) into the flask at a temperature of about 100°C over 20 minutes, 2160 g of methyl isobutyl ketone was added at once and heated to bring the reaction reagent into an azeotropic state. Reagent temperature is 117
It was kept until it reached ℃. During this time, water was azeotropically distilled together with methyl isobutyl ketone, separated and removed out of the flask by a separating funnel, and methyl isobutyl ketone from which water had been separated was returned to the flask. When the temperature reached 117°C, the heating was terminated to complete the dehydrochlorination reaction. Then, hot water was added, and the water washing process of mixing and standing separation was repeated until the pH of the wastewater was 7.5 or less, and the by-product was produced. Separate the salt. Methyl isobutyl ketone was removed from the organic solvent layer from which the aqueous layer was separated at 117°C to obtain 1190 g of a brominated polyepoxy compound having the following physical properties. Epoxy equivalent: 380 Saponifiable chlorine content: 0.03% by weight Phenolic hydroxyl group content:
Less than 0.001meq/g Gardner viscosity (70% butyl carbitol solution): K Bromine content: 78.9% by weight Appearance: pale yellow solid Examples 2 to 5 In Example 1, the types and amounts of reaction reagents were as shown in Table 1. A brominated polyepoxy compound having the physical properties shown in Table 1 was obtained in the same manner except for the following. Comparative Example 1 Tetrabromobisphenol in the flask
A1000g (approx. 1.84 mol), epichlorohydrin 850g
(approximately 9.2 mol), then 294 g (3.68 mol) of 50% aqueous sodium hydroxide solution was added at 80°C.
The reaction was allowed to proceed at the same temperature for 4 hours. After the reaction was completed, excess epichlorohydrin and water were distilled off under reduced pressure. Then 600g of methyl isobutyl ketone, 50%
Add 90g of sodium hydroxide aqueous solution to the product,
After reacting at 80°C for 4 hours, 1900 g of methyl isobutyketone was added, and after further washing with water, methyl isobutyl ketone was distilled off under reduced pressure to produce diglycidyl brominated bisphenol A having the physical properties shown in Table 1. Obtained 1150g of ether. Example 6 The addition reaction was carried out in the same manner as in Example 1, except that 1.7 g of tramethylammonium chloride was used as a catalyst and the addition reaction temperature was 90°C.
The physical properties of the obtained product were as shown in Table 1. Example 7 After carrying out the addition reaction and addition reaction of the remaining 50% aqueous sodium hydroxide solution in the same manner as in Example 1, the dehydrochlorination reaction was carried out under reduced pressure (18 to 750 mmHg) by azeotropically adding methyl isobutyl ketone and water to the system. I went outside removing it. After the reaction was completed, the pressure was returned to normal pressure, 2160 g of methyl isobutyl ketone was added to the product, and water washing and solvent removal were performed in the same manner as in Example 1 to obtain a brominated epoxy compound having the physical properties shown in Table 1. Example 8 After carrying out the addition reaction of Example 1, 270 g of a 50% aqueous solution of sodium hydroxide was dropped into the flask at 99° C. over 20 minutes. Next, the reaction system was set to 120
The temperature was raised to 0.degree. C., and a dehydrochlorination reaction was carried out for 2 hours under a pressure of 1.2 Kg/ cm.sup.2 G (during this time, water did not come out of the reactor). After cooling to 40° C., a purification step was carried out in the same manner as in Example 1 to obtain a brominated polyepoxy compound having the physical properties shown in Table 1. Storage stability evaluation 50 ml of a 60% by weight methyl ethyl ketone solution of the brominated polyepoxy compound obtained in Examples 1 to 8 and Comparative Example 1 was placed in a 100 ml Erlenmeyer flask, and this was stored in a refrigerator at 10°C for 6 months. When the varnish did not precipitate, the storage stability of the varnish was evaluated as stable, and the varnish that precipitated crystals was evaluated as having poor storage stability. The results are shown in Table 1.
【表】【table】
【表】
積層板の製造例
実施例1および比較例1で得たテトラブロモビ
フエノールAのジグリシジエーテルの80%メチル
エチルケトン溶液40重量部に、油化シエルエポキ
シ(株)製高分子化ビスフエノールAのジグリシジル
エーテル“エピコート1001―B―80”(商品名)
60重量部、ベンジルジメチルアミン0.16重量部お
よびジシアンジアミド3.2重量部をメチルセロソ
ルブ40重量部に溶解した液43.2重量部を混合し、
ワニスを調製した。
このワニスを旭ミユエーベル(株)製ガラスクロス
“7628/1040/AS431”(商品名)に含浸させた
後、150℃の乾燥室に6分間導き、溶剤を除去し
てプリプレグを得た。
このプリプレグを切断し、得たプリプレグのシ
ートを8枚重ね合せ、160℃で大気圧下、2分間
予熱後、同温度で30Kg/cm2、45分間の条件で圧縮
成形し、次表2に示す物性の積層板を得た(ガラ
ス繊維含量55%)。[Table] Example of manufacturing a laminate To 40 parts by weight of an 80% methyl ethyl ketone solution of the diglycidether of tetrabromobiphenol A obtained in Example 1 and Comparative Example 1, polymerized bisphenol manufactured by Yuka Ciel Epoxy Co., Ltd. was added. Diglycidyl ether of A “Epicote 1001-B-80” (product name)
60 parts by weight, 0.16 parts by weight of benzyldimethylamine, and 3.2 parts by weight of dicyandiamide dissolved in 40 parts by weight of methyl cellosolve and 43.2 parts by weight of the solution were mixed.
A varnish was prepared. A glass cloth "7628/1040/AS431" (trade name) manufactured by Asahi Miyu Abel Co., Ltd. was impregnated with this varnish, and then placed in a drying room at 150° C. for 6 minutes to remove the solvent and obtain a prepreg. This prepreg was cut, 8 prepreg sheets obtained were stacked, preheated at 160°C under atmospheric pressure for 2 minutes, and compression molded at the same temperature for 45 minutes at 30 kg/cm 2. A laminate with the physical properties shown was obtained (glass fiber content 55%).
Claims (1)
を前者の臭素化ポリフエノールのフエノール性水
酸基1当量に対してエピハロヒドリン0.6〜1.5モ
ル未満の割合で、アルカリ金属の水酸化物が前記
臭素化ポリフエノールのフエノール性水酸基1当
量に対し、0.01〜0.8モルの割合であるアルカリ
金属の水酸化物の水溶液および生成する臭素化ポ
リエポキシ化合物の5〜200重量%の有機溶剤の
存在下に反応させて臭素化ポリフエノールのハロ
ヒドリンエーテルを製造した後、アルカリ金属の
水酸化物を添加し、脱ハロゲン化水素反応を水を
反応系より除去しつつ行うことを特徴とする臭素
化ポリエポキシ化合物の製造方法。 2 後段の脱ハロゲン化水素反応を、減圧下、60
〜120℃で、または常圧下100〜150℃で、かつ、
有機溶剤と水とが共沸する温度で、しかも水を有
機溶剤と共沸させて除去し、有機溶剤は反応系に
循環させて行う請求項第1項記載の製造方法。 3 臭素化ポリフエノールがメタ位にBr基を有
するテトラブロモビスフエノールAである請求項
第1項記載の製造方法。 4 テトラブロモビスフエノールAのフエノール
性水酸基1当量に対し、エピハロヒドリンが0.6
〜1.4当量の割合で用いられる請求項第3項記載
の製造方法。[Scope of Claims] 1. Brominated polyphenol and epihalohydrin are mixed in a ratio of 0.6 to less than 1.5 moles of epihalohydrin per equivalent of phenolic hydroxyl group of the former brominated polyphenol, and the alkali metal hydroxide is brominated. The reaction is carried out in the presence of an aqueous solution of an alkali metal hydroxide in a proportion of 0.01 to 0.8 mol per equivalent of the phenolic hydroxyl group of the polyphenol and an organic solvent in a proportion of 5 to 200% by weight of the brominated polyepoxy compound to be produced. A brominated polyepoxy compound characterized in that after producing a halohydrin ether of a brominated polyphenol, an alkali metal hydroxide is added and a dehydrohalogenation reaction is carried out while removing water from the reaction system. manufacturing method. 2 The subsequent dehydrohalogenation reaction was carried out at 60°C under reduced pressure.
~120℃ or 100~150℃ under normal pressure, and
2. The production method according to claim 1, wherein the process is carried out at a temperature at which the organic solvent and water are azeotropic, and the water is azeotropically removed with the organic solvent, and the organic solvent is circulated through the reaction system. 3. The production method according to claim 1, wherein the brominated polyphenol is tetrabromobisphenol A having a Br group at the meta position. 4 Epihalohydrin is 0.6 per equivalent of phenolic hydroxyl group of tetrabromobisphenol A
4. The method of claim 3, wherein the amount is 1.4 to 1.4 equivalents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14298482A JPS5933317A (en) | 1982-08-18 | 1982-08-18 | Production of brominated polyepoxy compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14298482A JPS5933317A (en) | 1982-08-18 | 1982-08-18 | Production of brominated polyepoxy compound |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5933317A JPS5933317A (en) | 1984-02-23 |
| JPH0221404B2 true JPH0221404B2 (en) | 1990-05-14 |
Family
ID=15328219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14298482A Granted JPS5933317A (en) | 1982-08-18 | 1982-08-18 | Production of brominated polyepoxy compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933317A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210622A (en) * | 1984-04-05 | 1985-10-23 | Sanyo Kokusaku Pulp Co Ltd | Production of high-purity, flame-retarding epoxy resin |
| JPS6197320A (en) * | 1984-10-18 | 1986-05-15 | Asahi Chem Ind Co Ltd | Highly halogenated epoxy resin |
| JPH0791360B2 (en) * | 1987-12-26 | 1995-10-04 | 住友化学工業株式会社 | Process for producing glycidyl ether of polyphenol |
| CN110724823B (en) * | 2019-11-28 | 2021-06-11 | 北京工业大学 | Recovery method for waste circuit board smelting soot reinforced alkaline leaching debromination |
-
1982
- 1982-08-18 JP JP14298482A patent/JPS5933317A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5933317A (en) | 1984-02-23 |
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